Light emitting diode cooling systems and methods

Patent metadata

Field	Value
Publication number	US-11946628-B2
Application number	US-202217741059-A
Country	US
Kind code	B2
Filing date	May 10, 2022
Priority date	May 29, 2019
Publication date	Apr 2, 2024
Grant date	Apr 2, 2024

Abstract

A cooling system for a light emitting diode assembly includes a heat exchanger configured to exchange heat from a fluid to ambient air, an enclosure configured to house the LED assembly, and a pump configured to circulate the fluid through the enclosure, through the LED assembly, or both, and through the heat exchanger. The fluid is configured to absorb heat at the LED assembly and generated by the LED assembly, and the heat exchanger is configured to cool the fluid and remove the heat absorbed by the fluid at the LED assembly.

First claim

The invention claimed is:

1. A lighting assembly, comprising:
a base;
a printed circuit board (PCB) coupled to the base, wherein the PCB comprises a plurality of electrical connections configured to couple to additional PCBs communicatively coupled to a plurality of light emitting diodes (LEDs);
a fluid inlet positioned generally in a center of the PCB and disposed at least partially in the base and configured to receive a fluid into the base; and
one or more fluid outlets positioned adjacent to the fluid inlet and disposed at least partially in the base and configured to expel the fluid from the base, wherein the fluid is configured to absorb heat generated by the plurality of LEDs.

2. The lighting assembly of claim 1 , wherein the PCB comprises a wet side and a dry side.

3. The lighting assembly of claim 1 , wherein the one or more fluid outlets comprise at least two fluid outlets positioned generally around the fluid inlet.

4. A lighting assembly, comprising:
a base;
a printed circuit board (PCB) coupled to the base, wherein the PCB comprises a plurality of electrical connections configured to couple to additional PCBs communicatively coupled to a plurality of light emitting diodes (LEDs);
a fluid inlet disposed at least partially in the base and configured to receive a fluid into the base; and
one or more fluid outlets disposed at least partially in the base and configured to expel the fluid from the base, wherein the fluid is configured to absorb heat generated by the plurality of LEDs;
wherein the fluid inlet is positioned on a first radial side of the PCB, wherein the one or more fluid outlets are positioned on a second radial side of the PCB, and wherein the first radial side is generally opposite the second radial side.

5. The lighting assembly of claim 1 , comprising a cylinder extending from the base, wherein the PCB is disposed in the cylinder.

6. The lighting assembly of claim 5 , wherein the cylinder is optically clear to enable the light generated by the plurality of LEDs to pass through the cylinder.

7. The lighting assembly of claim 1 , comprising an LED assembly, wherein the LED assembly comprises:
a plurality of LED arrays, wherein the plurality of LED arrays comprises the plurality of LEDs; and
the additional PCBs, wherein each additional PCB is coupled to one or more different LED arrays of the plurality of LED arrays, and wherein the additional PCBs extend generally along a common axis.

8. The lighting assembly of claim 7 , comprising an enclosure, wherein the enclosure comprises:
an additional base; and
a cylinder extending from the additional base, wherein the LED assembly is disposed at least partially within the cylinder.

9. A light emitting diode (LED) assembly, comprising:
a plurality of LED arrays;
a plurality of printed circuit boards (PCBs), wherein each PCB is coupled to one or more different LED arrays of the plurality of LED arrays, and wherein the plurality of PCBs extend generally along a common axis; and
a plurality of panels, wherein the plurality of PCBs are disposed within the plurality of panels, wherein each respective panel of the plurality of panels is coupled to a respective one or more different LED arrays, wherein the respective one or more different LED arrays are disposed on a first side of the respective panel, wherein a respective PCB is disposed on a second side of the respective panel, and wherein the first side is opposite the second side.

10. The LED assembly of claim 9 , comprising a base PCB, wherein a first end of each PCB is coupled to the base PCB, and wherein the base PCB comprises a wet side and a dry side.

11. The LED assembly of claim 10 , comprising an end plate disposed generally opposite the base PCB, wherein a second end of each PCB is coupled to the end plate.

12. The LED assembly of claim 9 , wherein the respective panel extends generally parallel to the respective PCB.

13. The LED assembly of claim 9 , the plurality of LED arrays are configured to operate above a predetermined power density of between 50 watts per square inch and 250 watts per square inch.

14. The LED assembly of claim 9 , comprising an enclosure, wherein the plurality of LED arrays and the plurality of PCBs are disposed at least partially within the enclosure.

15. An enclosure for receiving a light emitting diode (LED) assembly, comprising:
a base; and
a cylinder extending from the base, wherein the cylinder is configured to receive the LED assembly, wherein the base extends radially outward from the cylinder, wherein the base and cylinder comprise a single component, and wherein the enclosure is configured to form a fluid flow path when coupled to an additional base of the LED assembly.

16. The enclosure of claim 15 , wherein the cylinder is optically clear to enable light generated by the LED assembly to pass through the cylinder.

Assignees

• Nbcuniversal Media Llc

Inventors

• Edwards Charles

Classifications

• F21V29/58 Primary

  characterised by the coolants · CPC title

• F21V29/59 Primary

  with forced flow of the coolant · CPC title

• F21V29/61

  characterised by control arrangements · CPC title

• F21Y2105/18

  annular; polygonal other than square or rectangular, e.g. for spotlights or for generating an axially symmetrical light beam · CPC title

• F21Y2107/30

  on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section · CPC title