Hot-melt pressure-sensitive adhesive
US-10604682-B2 · Mar 31, 2020 · US
Styrene-based materials for hot melt adhesives
US11945977B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11945977-B2 |
| Application number | US-201816486880-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 20, 2018 |
| Priority date | Feb 20, 2017 |
| Publication date | Apr 2, 2024 |
| Grant date | Apr 2, 2024 |
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- Title
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Abstract
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A hot melt adhesive comprises at least one polymer selected from the group consisting of polystyrene, polybutene, polyisobutene, linear low density polyethylene, polypropylene random copolymer, polypropylene, olefin block copolymer, polyolefins, styrene block copolymers, and ethyl vinyl acetate polymers; a tackifying resin; and at least one precisely end-capped polystyrene (PECPS). The use of the styrene-based oligomers and polymers with the precisely controlled end-groups in hot melt adhesive formulations to improve compatibility with polymers and block copolymers frequently used in such adhesives.
First claim
Opening claim text (preview).
What is claimed is: 1. A hot melt adhesive composition comprising: a) about 2% to about 98% by weight of at least one polymer selected from the group consisting of polystyrene, polybutene, polyisobutene, linear low density polyethylene, polypropylene random copolymer, polypropylene, olefin block copolymer, polyolefins, styrene block copolymers, and ethyl vinyl acetate polymers; b) 0% to about 80% by weight of a tackifying resin; and c) about 2% to about 98% by weight of at least one precisely end-capped polystyrene (PECPS) having a formula of: produced by the reaction below wherein n is from 2 to 20, and R is selected from the group consisting of: 2. The hot melt adhesive composition of claim 1 , wherein the at least one polymer includes a portion comprising aromatic groups, and wherein at least a first portion of the at least one PECPS is compatible with the portion comprising aromatic groups of the at least one polymer, wherein compatibility between the portion comprising aromatic groups of the at least one polymer and the first portion of PECPS is defined by blends of the first portion of PECPS and the at least one polymer at a range of ratios of 1:49 to 49:1 exhibiting glass transition temperatures that are each within 25° C. of the Tg of the mixture predicted by the Fox equation given below: 1 Tg mixture = ω PECPS Tg PECPS + ω polymer or polymer segment Tg polymer or polymer segment wherein Tg refers to the glass transition temperature in Kelvin for the PECPS and polymer or polymer segment and ω refers to the mass ratio of the PECPS and polymer or polymer segment of block copolymer where the mass ratio values, ω, are calculated using the sum of mass of the PECPS and polymer or, in the case of block copolymers, the amount of polymer segment present. 3. The hot melt adhesive composition of claim 1 , wherein the at least one polymer comprises an end-block, and wherein at least a first portion of the at least one PECPS is compatible with the end-block of the at least one polymer, wherein compatibility between the end-block of the at least one polymer and the first portion of PECPS is defined by blends of the first portion of PECPS and the at least one polymer at a range of ratios of 1:49 to 49:1 exhibiting glass transition temperatures that are each within 25° C. of the Tg predicted by the Fox equation given below: 1 Tg mixture = ω PECPS Tg PECPS + ω polymer or polymer segment Tg polymer or polymer segment wherein Tg refers to the glass transition temperature in Kelvin for the PECPS and polymer or polymer segment and ω refers to the mass ratio of the PECPS and polymer or polymer segment of block copolymer where the mass ratio values, ω, are calculated using the sum of mass of the PECPS and polymer or, in the case of block copolymers, the amount of polymer segment present. 4. The hot melt adhesive composition of claim 2 , comprising about 10% to about 50% of the at least one polymer, about 20% to about 80% of the tackifying resin, and about 2% to about 20% of the at least one PECPS. 5. The hot melt adhesive composition of claim 1 , comprising about 2% to about 5% by weight of the at least one PECPS. 6. The hot melt adhesive composition of claim 1 , further comprising a plasticizer. 7. The hot melt adhesive composition of claim 1 , wherein the at least one polymer includes a portion comprising aliphatic groups, and wherein at least a second portion of the at least one PECPS is compatible with the portion of the at least one polymer comprising aliphatic groups, wherein compatibility between the portion comprising aliphatic groups of the at least one polymer and the second portion of PECPS is defined by blends of the second portion of PECPS and the at least one polymer at a range of ratios of 1:49 to 49:1 exhibiting glass transition temperatures that are each within 25° C. of the Tg predicted by the Fox equation given below: 1 Tg mixture =
Assignees
Inventors
Classifications
- C09J153/02Primary
Vinyl aromatic monomers and conjugated dienes · CPC title
Polystyrene · CPC title
organic · CPC title
Clay · CPC title
Silica · CPC title
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Frequently asked questions
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- What does patent US11945977B2 cover?
- A hot melt adhesive comprises at least one polymer selected from the group consisting of polystyrene, polybutene, polyisobutene, linear low density polyethylene, polypropylene random copolymer, polypropylene, olefin block copolymer, polyolefins, styrene block copolymers, and ethyl vinyl acetate polymers; a tackifying resin; and at least one precisely end-capped polystyrene (PECPS). The use of t…
- Who is the assignee on this patent?
- Bostik Inc
- What technology area does this patent fall under?
- Primary CPC classification C09J153/02. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Apr 02 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).