Polyamide composition for the production of weldable moulded bodies

US11945949B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11945949-B2
Application numberUS-201816757704-A
CountryUS
Kind codeB2
Filing dateNov 22, 2018
Priority dateNov 23, 2017
Publication dateApr 2, 2024
Grant dateApr 2, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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Abstract

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Disclosed is a polyamide composition including 30% to 99.9% by weight of a polyamide mixture as component A). Component A) includes aliphatic polyamide A1) and aliphatic copolyamide or terpolyamide A2). The weight ratio of A1) to A2) is 55:45 to 95:5. The polyamide composition also includes 0% to 60% by weight of glass fibers as component B), 0% to 2% by weight of nigrosin as component C), 0.1% to 10% by weight of at least one polyhydric alcohol including more than two hydroxyl groups and a number-average molecular weight (M n ) of less than 2000 as component D), 0% to 20% by weight of further additives as component E). The reported amounts sum to 100% by weight based on the total composition.

First claim

Opening claim text (preview).

The invention claimed is: 1. A polyamide composition comprising: (a) 30% to 99.9% by weight of a polyamide mixture as component A) composed of aliphatic polyamide A1) and aliphatic copolyamide A2), wherein the weight ratio of A1) to A2) is 55:45 to 95:5; (b) 0% to 60% by weight of glass fibers as component B); (c) 0% to 2% by weight of nigrosin as component C); (d) 0.1% to 10% by weight of at least one polyhydric alcohol comprising more than two hydroxyl groups and a number-average molecular weight (Me) of less than 2000 selected from the group consisting of pentaerythritol, dipentaerythritol, tripentaerythritol, di-trimethylolpropane, D-mannitol, D-sorbitol, and xylitol as component D); and (e) 0% to 20% by weight of further additives as component E), wherein component E) is selected from the group consisting of fillers and reinforcing materials different from glass fibers, thermoplastic polymers different from component A), non-nucleated colorants different from C), carbon black, lubricants, heat stabilizers, light stabilizers, dyes, nucleating agents, metallic pigments, metal flakes, metal-coated particles, antistatic agents, conductivity additives, mold-release agents, optical brighteners and antifoams; wherein the reported amounts summing to 100% by weight are based on the total composition, the aliphatic polyamide A1) is selected from the group consisting of PA 6, PA 66 and mixtures thereof and the aliphatic copolyamide A2) is a PA 6/PA 66 copolymer; wherein the polyamide composition comprises 0 to 15% by weight, based on the total weight of the composition, of at least one flame retardant selected from the group consisting of red phosphorus, nitrogen-containing flame retardants, oligomeric brominated polycarbonates, polypentabromobenzyl acrylates with a degree of polymerization greater than 4, reaction products of tetrabromobisphenol A with epoxides, brominated oligomeric or polymeric styrenes, and Dechlorane. 2. The polyamide composition according to claim 1 , wherein 0.1% to 2% by weight of nigrosin is present as component C). 3. A process for producing polyamide compositions according to claim 1 by mixing the ingredients while heating to a temperature in the range from 160° C. to 340° C. 4. A weldable molding or welded shaped article composed of a polyamide composition according to claim 1 . 5. The polyamide composition as claimed in claim 1 , wherein the crystallization point of the mixture of the aliphatic polyamide A1) and the aliphatic copolyamide A2) in the polyamide composition is below the crystallization points of the at least one polyamide and at least one copolyamide. 6. The polyamide composition according to claim 1 , wherein the weight ratio of A1) to A2) is 60:40 to 90:10. 7. The polyamide composition according to claim 1 , wherein the weight ratio of A1) to A2) is 70:30 to 90:10. 8. The polyamide composition according to claim 1 , wherein the composition does not comprise a flame retardant. 9. The polyamide composition according to claim 1 , wherein the crystallization temperature of the polyamide mixture A) is below the crystallization temperatures of the aliphatic polyamide A1) and the aliphatic copolyamide A2). 10. A polyamide composition comprising: (a) 30% to 99.9% by weight of a polyamide mixture as component A) composed of aliphatic polyamide A1) and aliphatic copolyamide A2), wherein the weight ratio of A1) to A2) is 55:45 to 95:5; (b) 0% to 60% by weight of glass fibers as component B); (c) 0% to 2% by weight of nigrosin as component C); (d) 0.1% to 10% by weight of at least one polyhydric alcohol comprising more than two hydroxyl groups and a number-average molecular weight (Mn) of less than 2000 selected from glycerol, trimethylolpropane, 2,3-di-(2′-hydroxyethyl)cyclohexan-1-ol, hexane-1,2,6-triol, 1,1,1-tris(hydroxymethyl)ethane, 3-(2′-hydroxyethoxy)propane-1,2-diol, 3-(2′ hydroxypropoxy)propane-1,2-diol, 2-(2′-hydroxyethoxy)hexane-1,2-diol, 6-(2′-hydroxypropoxy)hexane-1,2-diol, 1,1,1-tris-[(2′-hydroxyethoxy)methyl]ethane, 1,1,1-tris-[(2′-hydroxypropoxy)methyl]propane, 1,1,1-tris-(4′-hydroxyphenyl)ethane, 1,1,1-tris (hydroxyphenyl)propane, 1,1,3-tris-(dihydroxy-3-methylphenyl)propane, 1,1,4-tris(dihydroxyphenyl)butane, 1,1,5-tris(hydroxyphenyl)-3-methylpentane, ditrimethylopropane, trimethylolpropane ethoxylates, trimethylolpropane propoxylates, pentaerythritol, dipentaerythritol, tripentaerythritol, cyclodextrin, D-mannose, glucose, galactose, sucrose, fructose, xylose, arabinose, D-mannitol, D-sorbitol, D- or L-arabitol, xylitol, iditol, talitol, allitol, altritol, guilitol, erythritol, threitol and D-gulono-y-lactone as component D); and (e) 0% to 20% by weight of further additives as component E), selected from the group consisting of fillers and reinforcing materials different from glass fibers, thermoplastic polymers different from component A), non-nucleated colorants different from C), carbon black, lubricants, heat stabilizers, light stabilizers, dyes, nucleating agents, metallic pigments, metal flakes, metal-coated particles, antistatic agents, conductivity additives, mold-release agents, optical brighteners and antifoams; wherein the reported amounts summing to 100% by weight are based on the total composition, the aliphatic polyamide A1) is selected from PA 4, PA 5, PA 6, PA 7, PA 8, PA 9, PA 10, PA 11, PA 12, PA 46, PA 66, PA 69, PA 610, PA 612, PA 96, PA 99, PA 910, PA 912, PA 1212 and the aliphatic copolyamide A2) is constructed from monomers of two or three polyamides selected from PA 4, PA 5, PA 6, PA 7, PA 8, PA 9, PA 10, PA 11, PA 12, PA 46, PA 66, PA 69, PA 610, PA 612, PA 96, PA 99, PA 910, PA 912, PA 1212; wherein the composition does not comprise a flame retardant.

Assignees

Inventors

Classifications

  • C08L77/06Primary

    Polyamides derived from polyamines and polycarboxylic acids (C08L77/10 takes precedence) · CPC title

  • Thermal after-treatment {(B29C71/0063 and B29C71/0072 take precedence)} · CPC title

  • Use of {PA, i.e.} polyamides, e.g. polyesteramides {or derivatives thereof}, as moulding material · CPC title

  • containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure · CPC title

  • C08L77/02Primary

    Polyamides derived from omega-amino carboxylic acids or from lactams thereof (C08L77/10 takes precedence) · CPC title

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What does patent US11945949B2 cover?
Disclosed is a polyamide composition including 30% to 99.9% by weight of a polyamide mixture as component A). Component A) includes aliphatic polyamide A1) and aliphatic copolyamide or terpolyamide A2). The weight ratio of A1) to A2) is 55:45 to 95:5. The polyamide composition also includes 0% to 60% by weight of glass fibers as component B), 0% to 2% by weight of nigrosin as component C), 0.1%…
Who is the assignee on this patent?
Basf Se
What technology area does this patent fall under?
Primary CPC classification C08L77/06. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Apr 02 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).