Direct 4D printing gradient structure ceramics

US11945754B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11945754-B2
Application numberUS-202117512664-A
CountryUS
Kind codeB2
Filing dateOct 27, 2021
Priority dateOct 27, 2021
Publication dateApr 2, 2024
Grant dateApr 2, 2024

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A method for forming a complex shape three-dimensional ceramic article by printing a first layer of a first material having a first fraction of first ceramic particles and a first fraction of a first polymeric ceramic precursor. A second layer is printed such that it is at least partially disposed on the first layer of a second material having a second fraction of second ceramic particles and a second fraction of a second polymeric ceramic precursor. A composite of the first layer and the second layer is heated at a temperature sufficient to decompose the first and second polymeric ceramic precursors and sinter the article. During the sintering process, the first and second layers with different fractions of ceramic particles undergo different degrees of shrinkage, resulting in a tuneable mismatch of the bilayer structure and accurately achieving a targeted geometry.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for forming a gradient structure three-dimensional ceramic article comprising: printing a first layer of a first material comprising a first fraction of first ceramic particles and a first fraction of a first polymeric ceramic precursor; printing a second layer at least partially disposed on the first layer of a second material comprising a second fraction of second ceramic particles and a second fraction of a second polymeric ceramic precursor, the first fraction of first ceramic particles being different from the second fraction of second ceramic particles; heating a composite of the first layer and the second layer at a temperature sufficient to decompose the first and second polymeric ceramic precursors and sinter the composite wherein a difference between the first fraction of first ceramic particles and the second fraction of second ceramic particles creates an interface stress to cause a selected level of deformation of the ceramic article. 2. The method of claim 1 , wherein the first ceramic particles and the second ceramic particles are each selected from one or more of alumina (Al 2 O 3 ), zirconia (ZrO 2 ), titania (TiO 2 ), silicon nitride (Si 3 N 4 ), hydroxyapatite (Ca 10 (PO 4 ) 6 (OH) 2 ), silicon carbide (SiC), yttria (Y 2 O 3 ), or aluminum nitride (AlN) particles. 3. The method according to claim 2 , wherein the particle size ranges from approximately 10 nm to 400 μm. 4. The method according to claim 1 , wherein the first and second polymeric ceramic precursors are each selected from one or more of a polysiloxane, a polyborosiloxane, a polycarbosiloxane, a polysilazane or a poly(organosilylcarbodiimide). 5. The method according to claim 1 , wherein the first polymeric ceramic precursor and/or the second polymeric ceramic precursor is polydimethylsiloxane. 6. The method of claim 1 , wherein the first fraction of ceramic particles and the second fraction of ceramic particles is in the range from approximately 5% to 71%. 7. The method of claim 1 , wherein the thickness of the first layer and/or the second layer ranges from 1 mm to 1 cm. 8. The method of claim 1 , wherein the heating is performed at a temperature in a range from approximately 800° C. to 2200° C. 9. The method of claim 1 wherein the selected level of deformation is a curved deformation. 10. The method of claim 1 , further comprising a curing process before the heating, the curing process occurring at a temperature of 60° C. to approximately 250° C.

Assignees

Inventors

Classifications

  • C04B35/571Primary

    obtained from {Si-containing} polymer precursors {or organosilicon monomers} · CPC title

  • B28B1/001Primary

    Rapid manufacturing of 3D objects by additive depositing, agglomerating or laminating of material (selective deposition modelling of metallic powder B22F10/00; rapid manufacturing of 3D objects in general and in particular of plastics B29C64/00) · CPC title

  • Processes of additive manufacturing · CPC title

  • Materials specially adapted for additive manufacturing · CPC title

  • Curing of mixtures · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11945754B2 cover?
A method for forming a complex shape three-dimensional ceramic article by printing a first layer of a first material having a first fraction of first ceramic particles and a first fraction of a first polymeric ceramic precursor. A second layer is printed such that it is at least partially disposed on the first layer of a second material having a second fraction of second ceramic particles and a…
Who is the assignee on this patent?
Univ City Hong Kong
What technology area does this patent fall under?
Primary CPC classification C04B35/571. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Apr 02 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).