Pre-connected analyte sensors

US11943876B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11943876-B2
Application numberUS-201816168715-A
CountryUS
Kind codeB2
Filing dateOct 23, 2018
Priority dateOct 24, 2017
Publication dateMar 26, 2024
Grant dateMar 26, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Pre-connected analyte sensors are provided. A pre-connected analyte sensor includes a sensor carrier attached to an analyte sensor. The sensor carrier includes a substrate configured for mechanical coupling of the sensor to testing, calibration, or wearable equipment. The sensor carrier also includes conductive contacts for electrically coupling sensor electrodes to the testing, calibration, or wearable equipment.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of making an on-skin wearable device, the method comprising: assembling electronic circuitry into an internal volume of a housing, wherein the electronic circuitry is configured for (1) detecting signals generated from an electrochemical reaction under the skin of a subject at a working electrode of an analyte sensor, and (2) wirelessly transmitting data derived from the detected signals outside of the housing for processing and/or display by a separate device; after assembling the electronic circuitry into the internal volume of the housing, attaching a proximal portion of the analyte sensor to an external electrical interface coupled to the electronic circuitry such that the electronic circuitry becomes connected to the analyte sensor to receive signals therefrom without opening the housing, wherein the external electrical interface is formed in a recess located in an external bottom surface of the housing, the external bottom surface configured to directly contact a patch for coupling the housing to the skin of the subject; and dispensing a curable liquid into the recess to seal the attachment of the proximal portion of the analyte sensor to the external electrical interface. 2. The method of claim 1 , further comprising testing the electronic circuitry for functionality prior to the attaching. 3. The method of claim 1 , further comprising testing the analyte sensor for functionality prior to the attaching. 4. The method of claim 1 , wherein the assembling is performed at a location remote from the attaching. 5. The method of claim 1 , further comprising coupling an intermediate body to the proximal portion of the analyte sensor, and wherein the attaching comprises attaching the intermediate body to the external electrical interface. 6. The method of claim 5 , further comprising performing at least one manufacturing or testing procedure on the working electrode using the intermediate body prior to the attaching. 7. The method of claim 6 , wherein the performing comprises coating the working electrode of the analyte sensor. 8. The method of claim 6 , wherein the coupling is performed at a first location, the assembling is performed at a second location, and the performing is performed at a third location, and wherein the first, second, and third locations are remote from one another. 9. The method of claim 5 , wherein the coupling is performed with anisotropic conductive film. 10. The method of claim 1 , wherein the attaching is performed with anisotropic conductive film. 11. The method of claim 1 , further comprising attaching an inserter to the housing for implanting the working electrode into a subject. 12. The method of claim 1 , further comprising coupling the patch directly to the external bottom surface of the housing. 13. The method of claim 1 , wherein the curable liquid physically couples the proximal portion of the analyte sensor to the external electrical interface. 14. The method of claim 1 , wherein the curable liquid is dispensed to seal the attachment of the proximal portion of the analyte sensor to the external electrical interface from moisture ingress. 15. The method of claim 1 , further comprising curing the curable liquid. 16. The method of claim 1 , wherein the patch includes an adhesive bonded to a carrier substrate, the carrier substrate including a top surface for coupling directly to the external bottom surface of the housing. 17. The method of claim 16 , further comprising directly coupling the top surface of the carrier substrate to the external bottom surface of the housing. 18. The method of claim 17 , further comprising covering the recess with the top surface of the carrier substrate. 19. The method of claim 1 , wherein the proximal portion of the analyte sensor is configured to extend parallel to a skin surface of the subject that the patch couples to. 20. The method of claim 19 , wherein the analyte sensor includes a bend that angles the proximal portion of the analyte sensor from a distal portion of the analyte sensor for insertion into the skin of the subject.

Assignees

Inventors

Classifications

  • H05K3/321Primary

    by conductive adhesives · CPC title

  • for measuring glucose, e.g. by tissue impedance measurement · CPC title

  • for measuring analytes not otherwise provided for, e.g. ions, cytochromes · CPC title

  • invasive, e.g. introduced into the body by a catheter · CPC title

  • A61B5/1473Primary

    invasive, e.g. introduced into the body by a catheter · CPC title

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What does patent US11943876B2 cover?
Pre-connected analyte sensors are provided. A pre-connected analyte sensor includes a sensor carrier attached to an analyte sensor. The sensor carrier includes a substrate configured for mechanical coupling of the sensor to testing, calibration, or wearable equipment. The sensor carrier also includes conductive contacts for electrically coupling sensor electrodes to the testing, calibration, or…
Who is the assignee on this patent?
Dexcom Inc
What technology area does this patent fall under?
Primary CPC classification H05K3/321. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 26 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).