Camera module and electronic device including the same

Patent metadata

Field	Value
Publication number	US-11943538-B2
Application number	US-202217732976-A
Country	US
Kind code	B2
Filing date	Apr 29, 2022
Priority date	Apr 29, 2021
Publication date	Mar 26, 2024
Grant date	Mar 26, 2024

Abstract

Disclosed is an electronic device including a camera module enabling a movable member (e.g., a circuit board) having an image sensor disposed thereon to move for an image stabilization function and including a connecting member that provides electrical connection of the image sensor, and an electronic device including the camera module.

First claim

What is claimed is:

1. An electronic device, comprising:
a housing in which a main circuit board is disposed; and
a camera module, at least part of which is disposed in the housing, the camera module being electrically connected with the main circuit board,
wherein the camera module includes:
a camera housing;
a lens assembly, at least part of which is accommodated in the camera housing, the lens assembly including a lens,
a movable member including an image sensor and a first circuit board electrically connected with the image sensor, the movable member being coupled to the camera housing so as to be movable in a direction perpendicular to an optical axis of the lens;
a second circuit board, at least part of which is electrically connected with the main circuit board; and
a connecting member configured to electrically connect the first circuit board and the second circuit board,
wherein the connecting member includes a first flexible circuit board connected with the first circuit board and a second flexible circuit board connected with the second circuit board,
wherein the first flexible circuit board and the second flexible circuit board are configured to be electrically connected, and
wherein each of the first flexible circuit board and the second flexible circuit board includes a first layer, a second layer disposed to face the first layer, and a via configured to electrically connect the first layer and the second layer.

2. The electronic device of claim 1 ,
wherein each of the first flexible circuit board and the second flexible circuit board is configured to be deformed in a shape in which, when the movable member moves, a gap between a partial area of the first layer and a partial area of the second layer is decreased or increased as the first circuit board moves relative to the second circuit board.

3. The electronic device of claim 2 ,
wherein the movable member is configured to move in a direction of at least one of a first shift axis or a second shift axis perpendicular to the optical axis,
wherein the first shift axis and the second shift axis are perpendicular to each other,
wherein the first flexible circuit board is configured to be deformed in response to a movement of the movable member in the direction of the first shift axis, and
wherein the second flexible circuit board is configured to be deformed in response to a movement of the movable member in the direction of the second shift axis.

4. The electronic device of claim 1 ,
wherein each of the first flexible circuit board and the second flexible circuit board is configured such that the first layer and the second layer are formed in substantially an identical shape.

5. The electronic device of claim 1 ,
wherein the first layer of the first flexible circuit board is connected to the first circuit board,
wherein the first layer of the second flexible circuit board is connected to the second circuit board, and
wherein the second layer of the first flexible circuit board and the second layer of the second flexible circuit board are electrically connected.

6. The electronic device of claim 1 ,
wherein the first layer includes a first pad area on which a first conductive pad is formed and a first via area on which the via is formed, and
wherein the second layer includes a second pad area on which a second conductive pad is formed and a second via area on which the via is formed.

7. The electronic device of claim 6 , wherein each of the first flexible circuit board and the second flexible circuit board further includes an adhesive member disposed between the first via area and the second via area, and
wherein the via passes through at least part of the first via area, the second VIA area, and the adhesive member.

8. The electronic device of claim 6 , wherein the first layer and the second layer are configured such that the first via area and the second via area are physically coupled through an adhesive member and a gap between the first pad area and the second pad area is changed based on areas coupled by the adhesive member.

9. The electronic device of claim 1 ,
wherein the connecting member further includes a connecting circuit board configured to electrically connect the first flexible circuit board and the second flexible circuit board,
wherein the first flexible circuit board is disposed between the first circuit board and the connecting circuit board, and
wherein the second flexible circuit board is disposed between the second circuit board and the connecting circuit board.

10. The electronic device of claim 9 ,
wherein the first flexible circuit board is configured such that at least part of the first layer of the first flexible circuit board is coupled to the first circuit board and at least part of the second layer of the first flexible circuit board is coupled to the connecting circuit board, and
wherein the second flexible circuit board is configured such that at least part of the first layer of the second flexible circuit board is coupled to the second circuit board and at least part of the second layer of the second flexible circuit board is coupled to the connecting circuit board.

11. The electronic device of claim 1 ,
wherein the first circuit board includes a first portion on which the image sensor is disposed and a second portion configured to extend from the first portion at a right angle, and
wherein the first flexible circuit board is connected to the second portion such that the first layer and the second layer are parallel to the second portion.

12. The electronic device of claim 11 ,
wherein the second circuit board includes a third portion on which a connector is disposed and a fourth portion configured to extend from the third portion and disposed perpendicular to the first portion and the second portion of the first circuit board, and
wherein the second flexible circuit board is connected to the fourth portion such that the first layer and the second layer are parallel to the fourth portion.

13. The electronic device of claim 12 ,
wherein the connecting member further includes a connecting circuit board configured to connect the first flexible circuit board and the second flexible circuit board,
wherein the connecting circuit board includes a first connecting portion configured to face the second portion of the first circuit board in parallel and a second connecting portion configured to extend from the first connecting portion at a right angle and face the fourth portion of the second circuit board in parallel,
wherein the first flexible circuit board is disposed between the second portion and the first connecting portion, and
wherein the second flexible circuit board is disposed between the fourth portion and the second connecting portion.

14. The electronic device of claim 13 ,
wherein each of the first flexible circuit board and the second flexible circuit board is configured such that a first conductive pad is disposed on a partial area of the first layer and a second conductive pad is disposed on a partial area of the second layer,
wherein the first flexible circuit board electrically connects the first circuit board and the connecting circuit board as the first conductive pad is coupled to the second portion and the second conductive pad is coupled to the first connecting portion, and
wherein the second flexible circuit board electrically connects the second circuit board and the connecting circuit board as the first conductive pad is coupled to the fourth portion and the second conductive pad is coupled to the second connecting portion.

15. The electronic dev

Assignees

• Samsung Electronics Co Ltd

Inventors

• JUNG Hwajoong
• Kim Bongchan
• BYON Kwangseok
• Kim Taehwan
• Rho Hyungjin
• Park Jaeheung
• Won Jonghun

Classifications

• H04N23/687 Primary

  by shifting the lens or sensor position · CPC title

• H04N23/54 Primary

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• H05K1/112

  directly combined with via connections · CPC title

• H05K1/118

  specially for flexible printed circuits, e.g. using folded portions · CPC title

• H05K1/14

  Structural association of two or more printed circuits (providing electric connection to or between printed circuits H05K1/11, H01R12/00) · CPC title