Compact opto-electronic modules and fabrication methods for such modules

Patent metadata

Field	Value
Publication number	US-11942580-B2
Application number	US-202117498105-A
Country	US
Kind code	B2
Filing date	Oct 11, 2021
Priority date	Sep 10, 2013
Publication date	Mar 26, 2024
Grant date	Mar 26, 2024

Abstract

Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.

First claim

The invention claimed is:

1. An optoelectronic module comprising:
an optoelectronic device mounted on a substrate;
a transparent overmold laterally surrounding sides of the optoelectronic device and covering a top surface of the optoelectronic device, wherein the transparent overmold is in direct contact with the optoelectronic device, wherein the top surface of the transparent overmold is slanted with respect to a plane of the substrate on which the optoelectronic device is mounted;
a passive optical element on a top surface of the transparent overmold, wherein the passive optical element is transparent; and
sidewalls laterally surrounding the optoelectronic device and in direct contact with sides of the transparent overmold.

2. The optoelectronic module of claim 1 , wherein the sidewalls are composed of a material that is substantially non-transparent to light emitted by or detectable by the optoelectronic device.

3. The optoelectronic module of claim 1 , wherein the passive optical element is a lens.

4. The optoelectronic module of claim 1 , wherein the top surface of the transparent overmold has a curved shape that corresponds to a shape of a surface of the passive optical element.

5. The optoelectronic module of claim 1 , wherein the at least a portion of the sidewalls serves as an outer wall of the module.

6. The optoelectronic module of claim 1 , the passive optical element is composed of a material having a higher index of refraction than that of the transparent overmold.

7. The optoelectronic module of claim 1 , wherein the transparent overmold is composed of a curable polymer.

8. The optoelectronic module of claim 1 , wherein the sidewalls are in direct contact with the slanted top surface of the transparent overmold.

Assignees

• Ams Sensors Singapore Pte Ltd

Inventors

• Gubser Simon
• Cesana Mario
• Rossi Markus
• Rudmann Hartmut

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/0198

  batch processes · CPC title