Light-emitting diode device and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-11942568-B2
Application number	US-202016901299-A
Country	US
Kind code	B2
Filing date	Jun 15, 2020
Priority date	Aug 6, 2019
Publication date	Mar 26, 2024
Grant date	Mar 26, 2024

Abstract

A light-emitting diode device includes an epitaxial structure that contains first-type and second-type semiconductor units and an active layer interposed therebetween, a light transmittable dielectric element that is disposed on the first-type semiconductor unit opposite to the active layer and is formed with a first through hole, an adhesive layer that is disposed on the dielectric element and is formed with a second through hole corresponding in position to the first through hole, and a metal contact element that is disposed on the adhesive layer. The adhesive layer has a thickness of at most one fifth of that of the dielectric element. The metal contact element extends into the first and second through holes, and electrically contacts the first-type semiconductor unit. A method for manufacturing the LED device is also disclosed.

First claim

What is claimed is:

1. A light-emitting diode (LED) device, comprising:
an epitaxial structure including a first-type semiconductor unit having a contact surface, an active layer disposed on said first-type semiconductor unit opposite to said contact surface, and a second-type semiconductor unit disposed on said active layer opposite to said first-type semiconductor unit, said second-type semiconductor unit having a light emitting surface opposite to said first-type semiconductor unit;
a light transmittable dielectric element disposed on said contact surface of said first-type semiconductor unit and formed with at least one first through hole to expose said contact surface;
an adhesive layer disposed on a surface of said light transmittable dielectric element opposite to said first-type semiconductor unit and formed with at least one second through hole disposed in spatial communication with and corresponding positionally to said first through hole, said adhesive layer having a thickness that is at most one fifth of a thickness of said light transmittable dielectric element, and being made of a transparent electrically conductive material; and
a metal contact element disposed on a surface of said adhesive layer opposite to said light transmittable dielectric element, wherein said metal contact element extends into said first and second through holes and electrically contacts said contact surface of said first-type semiconductor unit, wherein said light transmittable dielectric element has at least one hole-defining wall defining said first through hole, wherein said adhesive layer extends into said hole-defining wall, and wherein a width of said second through hole is smaller than a width of said first through hole.

2. The LED device of claim 1 , wherein said thickness of said adhesive layer ranges between 0.1 nm to 10 nm.

3. The LED device of claim 1 , wherein said thickness of said light transmittable dielectric element is equal to or greater than 50 nm.

4. The LED device of claim 1 , wherein said transparent electrically conductive material is selected from the group consisting of indium zinc oxide, indium tin oxide, and the combination thereof.

5. The LED device of claim 1 , wherein said light transmittable dielectric element includes at least one layer made of an insulating material.

6. The LED device of claim 5 , wherein said insulating material is selected from the group consisting of a fluoride compound, an oxide compound, an nitride compound, and combinations thereof.

7. The LED device of claim 1 , wherein said at least one hole-defining wall of said light transmittable dielectric element angularly extends from said contact surface to said adhesive layer.

8. The LED device of claim 7 , wherein said at least one hole-defining wall angularly extends from said contact surface to said adhesive layer at an angle that is equal to or greater than 90°, and that is not greater than 180°.

9. The LED device of claim 8 , wherein said at least one hole-defining wall angularly extends from said contact surface to said adhesive layer at an angle ranging from 110° to 170°.

10. The LED device of claim 7 , wherein said first through hole has a width gradually varying from said contact surface to said adhesive layer, a difference between a largest width and a smallest width of said first through hole being at least 1 nm.

11. The LED device of claim 7 , wherein said first through hole has a width gradually varying from said contact surface to said adhesive layer, a difference between a largest width and a smallest width of said first through hole being at least 20 nm.

12. The LED device of claim 1 , wherein said metal contact element includes an ohmic contact part disposed in said first through hole to electrically contact said first-type semiconductor unit.

13. The LED device of claim 12 , wherein said metal contact element further includes a reflective part disposed on said ohmic contact part and covering said adhesive layer.

14. The LED device of claim 12 , wherein said ohmic contact part is made of an alloy material selected from the group consisting of AuZn, AuGe, AuGeNi, AuBe, and AuNi.

15. The LED device of claim 13 , wherein said reflective part is made of a metal material selected from the group consisting of gold, silver, and the combination thereof.

16. The LED device of claim 1 , wherein said epitaxial structure is configured to emit one of red light and infrared light.

17. The LED device of claim 1 , further comprising a first electrode that is disposed on and electrically connects to said metal contact element, and a second electrode that is disposed on and electrically connects to said second-type semiconductor unit.

18. The LED device of claim 1 , wherein said epitaxial structure is formed with at least one recess which is defined by a recess-defining surface extending from said first-type semiconductor unit to said second-type semiconductor unit.

19. A method for manufacturing an LED device, comprising the steps of:
1) Providing an epitaxial structure that includes a first-type semiconductor unit having a contact surface, an active layer disposed on the first-type semiconductor unit opposite to the contact surface, and a second-type semiconductor unit disposed on the active layer opposite to the first-type semiconductor unit and having a light emitting surface opposite to the first-type semiconductor unit;
2) Forming a light transmittable dielectric element on the contact surface of the first-type semiconductor unit, the light transmittable dielectric element being formed with at least one first through hole to expose the contact surface, and subsequently forming an adhesive layer on a surface of the light transmittable dielectric element opposite to the first-type semiconductor unit, the adhesive layer being formed with at least one second through hole that is in spatial communication with and corresponds in position to the first through hole, and having a thickness that is at most one fifth of a thickness of the light transmittable dielectric element, the adhesive layer being made of a transparent electrically conductive material;
3) Forming a metal contact element on a surface of the adhesive layer opposite to the light transmittable dielectric element, the metal contact element extending into the first and second through holes and electrically contacting the contact surface of the first-type semiconductor unit.

20. The method of claim 19 , wherein step 2) includes the substeps of:
2a) disposing at least one sacrificial unit on said contact surface;
2b) forming the light transmittable dielectric element on the contact surface and the sacrificial unit;
2c) forming the adhesive layer on the light transmittable dielectric element;
2d) removing the sacrificial unit and a portion of the adhesive layer and a portion of the light transmittable dielectric element that are formed on and correspond in position to the sacrificial unit, so as to form the first through hole in the light transmittable dielectric element and the second through hole in the adhesive layer.

21. The method of claim 20 , wherein the sacrificial unit includes at least one sacrificial layer selected from the group consisting of a metal layer, a dielectric layer, and a photoresist layer.

22. The method of claim 20 , wherein the sacrificial unit includes a first sacrificial element and a second sacrificial element that is disposed on the first sacrificial element, the first sacrificial element having a diamete

Assignees

• Xiamen Sanan Optoelectronics Co Ltd

Inventors

• Zhang Dongyan
• Jia Yuehua
• Meng Cheng
• Wang Jing
• Wu Chun-I
• Wang Duxiang

Classifications

• H10H29/142

  Two-dimensional arrangements, e.g. asymmetric LED layout · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• H10H20/01 Primary

  Manufacture or treatment · CPC title

• H10H20/032

  of electrodes · CPC title

• H10H20/841

  Reflective coatings, e.g. dielectric Bragg reflectors · CPC title