Array substrate, display panel and display device

Patent metadata

Field	Value
Publication number	US-11942443-B2
Application number	US-202117507655-A
Country	US
Kind code	B2
Filing date	Oct 21, 2021
Priority date	Mar 11, 2021
Publication date	Mar 26, 2024
Grant date	Mar 26, 2024

Abstract

Provided is an array substrate. The array substrate includes at least one pad group disposed in a peripheral region of a base substrate, wherein the at least one pad group includes a sector pad group in which the pads are distributed in a sector shape. Therefore, the bonding yield between the array substrate and the circuit board is increased.

First claim

What is claimed is:

1. An array substrate, comprising: a base substrate, wherein the base substrate comprises a display region and a peripheral region surrounding the display region; and at least one pad group disposed in the peripheral region, wherein each of the at least one pad group comprises a plurality of pads sequentially arranged along a first direction, the at least one pad group comprises a sector pad group, and the pads in the sector pad group are distributed in a sector shape, wherein in the sector pad group, any one of the pads comprises a first edge and a second edge that are oppositely disposed and extended along the first direction, and the first edge is more proximal to the display region relative to the second edge; and in the any two adjacent pads, a dimension of the first edge of the pad distal from a central axis of the sector pad group is greater than a dimension of the first edge of the pad proximal to the central axis of the sector pad group.

2. The array substrate according to claim 1 , wherein the first direction is parallel to a bearing surface of the base substrate and an extension direction of any side of the base substrate.

3. The array substrate according to claim 1 , wherein in the sector pad group, a distance between any two adjacent pads at an end proximal to the display region is not greater than a distance between the two pads at an end distal from the display region.

4. The array substrate according to claim 3 , wherein an angle defined between extension directions of any two adjacent pads in the sector pad group is a target angle.

5. The array substrate according to claim 1 , wherein in the sector pad group, an angle defined between extension directions of two pads disposed at both ends ranges from 10 degrees to 20 degrees.

6. The array substrate according to claim 1 , wherein an angle defined between an extension direction of the pad at any end and a second direction ranges from 5 degrees to 10 degrees, wherein the second direction is parallel to a bearing surface of the base substrate and perpendicular to the first direction.

7. The array substrate according to claim 1 , wherein in the sector pad group, a dimension of the first edge of the pad disposed at any end is 2 μm to 6 μm greater than a dimension of the first edge of the pad most proximal to the central axis of the sector pad group.

8. The array substrate according to claim 1 , wherein a length of the first edge ranges from 25 μm to 35 μm.

9. The array substrate according to claim 1 , wherein in the sector pad group, a distance between a center of the first edge of one pad and a center of the first edge of the other pad in one pair of adjacent pads is equal to a distance between a center of the first edge of one pad and a center of the first edge of the other pad in another pair of adjacent pads.

10. The array substrate according to claim 1 , wherein in the sector pad group, the first edges of the pads are in a same line, and the second edges of the pads are in a same line.

11. The array substrate according to claim 1 , wherein in the sector pad group, any one of the pads further comprises a third edge and a fourth edge that are oppositely disposed to be parallel to each other, the third edge is connected to one end of the first edge and one end of the second edge, and the fourth edge is connected to the other end of the first edge and the other end of the second edge.

12. The array substrate according to claim 1 , wherein each of the pads of the sector pad group comprises a metal layer, an insulating layer, and a conductive adhesion layer stacked sequentially along a direction away from the base substrate, an orthographic projection of the metal layer onto the base substrate covers an orthographic projection of the conductive adhesion layer onto the base substrate; and at least one of the pads of the sector pad group further comprises at least one connection via extending through the insulating layer, and the conductive adhesion layer is connected to the metal layer through at least one connection via; and
in any two pads of the sector pad group, a total area of the connection vias in one pad is the same as a total area of the connection vias in the other pad.

13. The array substrate according to claim 12 , wherein the plurality of pads in the sector pad group comprises at least one auxiliary pad and one main pad;
wherein the main pad performs signal interaction with a circuit board, and the auxiliary pad does not perform signal interaction with the circuit board; the auxiliary pad does not comprise the connection via extending through the insulating layer, and the main pad comprises the connection via extending through the insulating layer.

14. The array substrate according to claim 13 , wherein the sector pad group comprises an odd number of pads, wherein in the odd number of pads, the pad disposed in the middle is the auxiliary pad.

15. The array substrate according to claim 14 , wherein the first direction is parallel to the bearing surface of the base substrate and the extension direction of any side of the base substrate;
in the sector pad group, a distance between any two adjacent pads at an end proximal to the display region is not greater than a distance between the two pads at an end distal from the display region;
an angle defined between extension directions of any two adjacent pads in the sector pad group is a target angle; an angle defined between extension directions of two pads disposed at both ends ranges from 10 degrees to 20 degrees; and an angle defined between the extension direction of the pad at any end and a second direction ranges from 5 degrees to 10 degrees, wherein the second direction is parallel to the bearing surface of the base substrate and perpendicular to the first direction;
any one of the pads comprises a first edge and a second edge that are oppositely disposed and extended along the first direction, and the first edge is more proximal to the display region relative to the second edge; and in the any two adjacent pads, a dimension of the first edge of the pad distal from a central axis of the sector pad group is greater than a dimension of the first edge of the pad proximal to the central axis of the sector pad group; wherein in the sector pad group, a dimension of the first edge of the pad disposed at any end is 2 μm to 6 μm greater than a dimension of the first edge of the pad most proximal to the central axis of the sector pad group; wherein a length of the first edge ranges from 25 μm to 35 μm; wherein in the sector pad group, a distance between a center of the first edge of one pad and a center of the first edge of the other pad in one pair of adjacent pads is equal to a distance between a center of the first edge of one pad and a center of the first edge of the other pad in another pair of adjacent pads; the first edges of pads are in a same line, and the second edges of pads are is in a same line;
any one of the pads further comprises a third edge and a fourth edge that are oppositely disposed to be parallel to each other, the third edge is connected to one end of the first edge and one end of the second edge, and the fourth edge is connected to the other end of the first edge and the other end of the second edge; any two pads comprises an equal number of connection vias, and a shape of each connection via is a parallelogram with one side extending along the first direction; and
any two of the connection vias have a same dimension along both the first direction and the second direction, wherein the second direction is parallel to the bearing surface of the base substrate and perpendicular t

Assignees

• Hefei Boe Display Tech Co Ltd
• Boe Technology Group Co Ltd

Inventors

• Zhang Chunxu
• Jiang Xiaoting
• Cheng Min
• Zhou Maoxiu
• Yang Haipeng
• Dai Ke

Classifications

• H10W72/9445

  Top-view layouts, e.g. mirror arrays · CPC title

• H10W72/967

  Multiple bond pads having different functions · CPC title

• H10W72/963

  Providing mechanical bonding or support, e.g. dummy bond pads · CPC title

• H10W72/953

  not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title