Apparatus and method for treating substrate

Patent metadata

Field	Value
Publication number	US-11942337-B2
Application number	US-202017063820-A
Country	US
Kind code	B2
Filing date	Oct 6, 2020
Priority date	Oct 7, 2019
Publication date	Mar 26, 2024
Grant date	Mar 26, 2024

Abstract

The apparatus includes a support unit to support the substrate in a treatment space of a process chamber, a first fluid supply unit to supply a supercritical fluid having an organic solvent dissolved in the supercritical fluid, to the treatment space, a second fluid supply unit to supply the supercritical fluid having no organic solvent dissolved in the supercritical fluid, to the treatment space, an exhaust unit to exhaust the treatment space, a controller to control the first fluid supply unit, the second fluid supply unit, and the exhaust unit. The controller controls the first and second fluid supply units such that the supercritical fluid having no organic solvent dissolved in the supercritical fluid is supplied to the treatment space through the second fluid supply unit, after the supercritical fluid mixed with the organic solvent is supplied to the treatment space through the first fluid supply unit.

First claim

What is claimed is:

1. An apparatus for treating a substrate, the apparatus comprising:
a liquid treating device configured to perform a liquid treatment process for the substrate by supplying a liquid onto the substrate;
a supercritical device configured to perform a drying process to remove the liquid remaining on the substrate; and
a carrying device configured to carry the substrate from the liquid treating device to the supercritical device,
wherein the liquid treating device comprises
a cup having a first treatment space,
a first support unit configured to support the substrate in the first treatment space, and
a nozzle configured to supply a first organic solvent onto the substrate supported by the first support unit,

wherein the supercritical device comprises
a process chamber having a second treatment space inside the process chamber,
a second support unit configured to support the substrate in the second treatment space,
a first fluid supply unit configured to supply, to the second treatment space, a supercritical fluid with a second organic solvent dissolved therein,
a second fluid supply unit configured to supply, to the second treatment space, the supercritical fluid having no organic solvent dissolved therein,
an exhaust unit configured to exhaust the second treatment space, and
a controller configured to control the first fluid supply unit, the second fluid supply unit, and the exhaust unit,

wherein the controller is configured to control the first fluid supply unit and the second fluid supply unit such that the supercritical fluid having no organic solvent dissolved therein is supplied to the second treatment space through the second fluid supply unit, after the supercritical fluid having the second organic solvent dissolved therein is supplied to the second treatment space through the first fluid supply unit, and
wherein the first organic solvent and the second organic solvent are a same organic solvent.

2. The apparatus of claim 1 , wherein the first fluid supply unit includes:
a mixing tank;
a first supercritical fluid supply line configured to supply the supercritical fluid to the mixing tank;
an organic solvent supply unit configured to supply the second organic solvent to the mixing tank; and
a first supply line configured to supply, to the second treatment space, the supercritical fluid having the second organic solvent dissolved therein from the mixing tank to the second treatment space.

3. The apparatus of claim 1 , wherein the second fluid supply unit includes:
a reservoir configured to store the supercritical fluid;
a second supercritical fluid supply line configured to supply the supercritical fluid to the reservoir; and
a second supply line configured to supply, to the second treatment space, the supercritical fluid in the reservoir.

4. The apparatus of claim 1 , wherein the controller is configured to
control the first fluid supply unit to adjust a mixing ratio of the supercritical fluid having the second organic solvent dissolved therein, such that the second organic solvent is provided at 1 wt % or less in the second treatment space.

5. The apparatus of claim 1 , wherein the supercritical fluid is carbon dioxide (CO 2 ).

6. The apparatus of claim 1 , wherein the second organic solvent is isopropyl alcohol (IPA).

7. The apparatus of claim 1 , wherein
the first fluid supply unit comprises a mixing tank configured to dissolve the second organic solvent in the supercritical fluid,
the second fluid supply unit comprises a reservoir configured to store the supercritical fluid, and
a pressure of the supercritical fluid with the second organic solvent dissolved therein in the mixing tank is different than a pressure of the supercritical fluid in the reservoir.

8. The apparatus of claim 1 , wherein
the first fluid supply unit comprises,
a mixing tank configured to dissolve the second organic solvent in the supercritical fluid, and
a first supply valve between the mixing tank and the process chamber, and configured to adjust a flow rate of the supercritical fluid with the second organic solvent dissolved therein from the mixing tank to the second treatment space, and

wherein the second fluid supply unit comprises,
a reservoir configured to store the supercritical fluid, and
a second supply valve disposed between the reservoir and the process chamber, and configured to adjust a flow rate of the supercritical fluid from the reservoir to the second treatment space.

Assignees

• Semes Co Ltd

Inventors

• Lim Eui Sang
• Lee Young Hun
• Jung Jinwoo
• PARK Miso
• Ahn Byongwook
• Lee Yong Hee

Classifications

• H10P72/0402 Primary

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10P70/15

  by wet cleaning only (H10P70/52 takes precedence) · CPC title

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0406 Primary

  for cleaning followed by drying, rinsing, stripping, blasting or the like · CPC title