Contactless communication medium and method for producing contactless communication medium

Patent metadata

Field	Value
Publication number	US-11941476-B2
Application number	US-202017638279-A
Country	US
Kind code	B2
Filing date	Jul 20, 2020
Priority date	Sep 5, 2019
Publication date	Mar 26, 2024
Grant date	Mar 26, 2024

Abstract

A contactless communication medium according to an embodiment of the present technology includes an IC module, a first member, a second member, and a print layer. The IC module is capable of performing a contactless communication. The first member is made of a first transparent resin material, the first member including a first surface and a second surface, the first surface being a surface in which a concave portion that accommodates therein the IC module is formed, the second surface being situated opposite to the first surface. The second member is made of a second transparent resin material, the second member being connected to the first surface or the second surface. The print layer is arranged between the first member and the second member.

First claim

The invention claimed is:

1. A contactless communication medium, comprising:
an integrated circuit (IC) module used to perform a contactless communication;
a first member that is made of a first transparent resin material, the first member including a first surface and a second surface, the first surface being a surface in which a concave portion that accommodates therein the IC module is formed, the second surface being situated opposite to the first surface;
a second member that is made of a second transparent resin material, the second member being connected to the first surface or the second surface;
a print layer that is arranged between the first member and the second member; and
a lid member that is arranged to cover the concave portion accommodating therein the IC module.

2. The contactless communication medium according to claim 1 , wherein
the lid member includes a plurality of recesses having different shapes.

3. The contactless communication medium according to claim 1 , wherein
the first transparent resin material is an acrylic resin or polycarbonate, and
the second transparent resin material is the acrylic resin or polycarbonate.

4. The contactless communication medium according to claim 1 , wherein
the first transparent resin material and the second transparent resin material are the same material.

5. The contactless communication medium according to claim 1 , wherein
the contactless communication medium has a plate shape having a uniform thickness, and
the first member and the second member are connected to each other in a direction of the uniform thickness.

6. The contactless communication medium according to claim 5 , wherein
the lid member is arranged to cover the entirety of the concave portion, as viewed from the direction of the uniform thickness.

7. The contactless communication medium according to claim 5 , wherein
the first member and the second member have the same shape, as viewed from the direction of the uniform thickness.

8. The contactless communication medium according to claim 5 , wherein
the print layer has a specified outer shape, as viewed from the direction of the uniform thickness, and
the first member and the second member each have an outer shape based on the specified outer shape of the print layer, as viewed from the direction of the uniform thickness.

9. The contactless communication medium according to claim 1 , wherein
the first member includes a first separate member and a second separate member, the first separate member being a member in which a through-hole is formed, the second separate member being connected to the first separate member to cover one of openings of the through-hole, and
the concave portion is the through-hole of which the one of the openings is covered.

10. The contactless communication medium according to claim 1 , wherein
the lid member is arranged such that a surface of the lid member that is situated opposite to the IC module is situated in plane with the first surface of the first member.

11. The contactless communication medium according to claim 1 , wherein
the print layer is a layer in which at least one of a character, a word, a picture, a photo, or a figure is printed.

12. The contactless communication medium according to claim 1 , wherein
the first member, the second member, the lid member, and the print layer are each connected to another member using one of UV bonding, bonding with a double-sided tape, ultrasonic welding, laser welding, or heat welding.

13. The contactless communication medium according to claim 12 , wherein
at least one of the first member, the second member, the lid member, or the print layer is connected to the another member using the UV bonding.

14. The contactless communication medium according to claim 1 , wherein
the concave portion is formed on a basis of a specified reference position, and
the contactless communication medium further comprises a position display member that indicates the specified reference position.

15. A method for producing a contactless communication medium, the method comprising:
forming a first member using a first transparent resin material, the first member including a first surface and a second surface, the first surface including a concave portion, the second surface being situated opposite to the first surface;
forming a second member using a second transparent resin material;
accommodating, in the concave portion, an integrated circuit (IC) module used to perform a contactless communication;
connecting the second member to the first surface or the second surface of the first member such that a print layer is arranged between the first member and the second member; and
arranging a lid member to cover the concave portion accommodating therein the IC module.

16. A method for producing a contactless communication medium, the method comprising:
forming a first separate member using a first transparent resin material, the first separate member including a through-hole;
forming a second separate member using the first transparent resin material;
forming a first member by connecting the first separate member and the second separate member to cover one of openings of the through-hole, the first member including a first surface and a second surface, the first surface including a concave portion, the second surface being situated opposite to the first surface;
forming a second member using a second transparent resin material;
accommodating, in the concave portion, an integrated circuit (IC) module used to perform a contactless communication; and
connecting the second member to the first surface or the second surface of the first member such that a print layer is arranged between the first member and the second member.

17. A method for producing a contactless communication medium, the method comprising:
forming a first transparent member using a first transparent resin material, the first transparent member including a first surface and a second surface, the first surface including a plurality of concave portions, the second surface being situated opposite to the first surface;
forming a second transparent member using a second transparent resin material;
accommodating, in each of the plurality of concave portions, an integrated circuit (IC) module used to perform a contactless communication;
connecting the second transparent member to the first surface or the second surface of the first transparent member such that a print layer is arranged between the first transparent member and the second transparent member; and
cutting out a portion that includes each of the plurality of concave portions each accommodating therein the IC module, such that the portion has a specified shape.

18. The method for producing the contactless communication medium according to claim 17 , wherein
the cutting out the portion including each of the plurality of concave portions such that the portion has the specified shape is performed by laser processing or cutting processing.

19. A method for producing a contactless communication medium, the method comprising:
forming a first separate member using a first transparent resin material, the first separate member including a plurality of through-holes;
forming a second separate member using the first transparent resin material;
forming a first transparent member by connecting the first separate member and the second separate member to cover respective openings of the plurality of through-holes that are situated on the same

Assignees

• Sony Group Corp

Inventors

• Nakano Aki

Classifications

• G06K7/10297 Primary

  arrangements for handling protocols designed for non-contact record carriers such as RFIDs NFCs, e.g. ISO/IEC 14443 and 18092 (cryptographic protocols H04L9/00; network security protocols H04L63/00; real-time communication protocols in data switching networks H04L65/00; network protocols for data switching network services H04L67/00) · CPC title

• B32B3/30

  characterised by a layer formed with recesses or projections, e.g. {hollows, grooves, protuberances, ribs (apertured layer B32B3/266; layer with cavities or internal voids B32B3/26)} · CPC title

• B32B27/308

  comprising acrylic (co)polymers · CPC title

• B32B27/365

  comprising polycarbonates · CPC title

• A47G29/10

  Key holders; Key boards (key cases A45C11/32) · CPC title