Image conversion module with a microelectromechanical optical system and method for applying the same

Patent metadata

Field	Value
Publication number	US-11940609-B2
Application number	US-202017084812-A
Country	US
Kind code	B2
Filing date	Oct 30, 2020
Priority date	Oct 30, 2019
Publication date	Mar 26, 2024
Grant date	Mar 26, 2024

Abstract

The present invention concerns an image conversion module (09) that comprises an optical interface (10) for establishing an optical path (07). The image conversion module (09) further comprises a beam splitting element (13) on the optical path (07). The beam splitting element (13) is configured for splitting a beam entering the optical interface (10, 11) on the optical path (07) into a first optical subpath (14) and a second optical subpath (16). The image conversion module (09) further comprises a microelectromechanical optical system (17) that is configured for enhancing a depth of field on the first optical subpath (14) that is directed to a first optoelectronic submodule (21). The image conversion module (09) further comprises a second optoelectronic submodule (24) having an electronic sensor (26) on the second optical subpath (16). The second optoelectronic submodule (24) is configured for acquiring additional data on the sample (02).

First claim

The invention claimed is:

1. An image conversion module, comprising:
an optical interface for establishing an optical path of the image conversion module;
a beam splitting element on the optical path, wherein the beam splitting element is configured for splitting a beam entering the optical interface on the optical path into a first optical subpath and a second optical subpath;
a first exchangeable optoelectronic submodule with an image sensor;
a microelectromechanical optical system that is configured for enhancing a depth of field on the first optical subpath that is directed to the first exchangeable optoelectronic submodule; and
a second exchangeable optoelectronic submodule that comprises an electronic sensor on the second optical subpath, wherein the second exchangeable optoelectronic submodule is configured for acquiring additional data on the sample, wherein the electronic sensor of the second exchangeable optoelectronic submodule is an additional image sensor, or the electronic sensor of the second exchangeable optoelectronic submodule is configured for measuring geometric properties of the sample, or the electronic sensor of the second exchangeable optoelectronic submodule is configured for detecting a feature of the sample, wherein the additional image sensor of the second exchangeable optoelectronic submodule is a polarization image sensor, a hyperspectral image sensor, or a thermal image sensor.

2. Image conversion module according to claim 1 , wherein the microelectromechanical optical system comprises an array of moveable micromirrors ( 18 ), wherein each of the movable micromirrors shows two degrees of freedom of rotation and one degree of freedom of translation.

3. Image conversion module according to claim 1 , wherein the beam splitting element is a beam splitter, a colour beam splitter or a polarizing beam splitter, wherein the beam splitter, the colour beam splitter or the polarizing beam splitter is directed to the first exchangeable optoelectronic submodule.

4. Image conversion module according to claim 1 , wherein the beam splitting element is located between the microelectromechanical optical system and the optical interface, wherein the beam splitting element is located between the first exchangeable optoelectronic submodule and the second exchangeable optoelectronic submodule.

5. Image conversion module according to claim 1 , further comprising a mechanical interface for removably mounting the image conversion module such that the image conversion module is modular.

6. Method for examining a sample using an optical instrument with an image conversion module according to claim 1 , wherein the method comprises the following steps:
imaging the sample using the optical instrument, the first exchangeable optoelectronic submodule, and the microelectromechanical optical system, wherein the resulting image shows an enhanced depth of field;
recording additional data on the sample using the second exchangeable optoelectronic submodule; and
displaying the image with the enhanced depth of field and the additional data.

7. Method according to claim 6 , wherein the additional data are an additional image of the sample, contrast data on the sample, spectral data on the sample, polarization data on the sample, data on a geometric property of the sample, and/or data on a feature of the sample.

8. Method according to claim 7 , wherein the additional image of the sample shows a differing resolution in at least one of three dimensions than the image with the enhanced depth of field and/or that the additional image represents another part of the sample than the image with the enhanced depth of field.

9. Method according to claim 7 , wherein the contrast data are polarization data, differential interference data, phase contrast data, thermal imaging data, spectral imaging data, and/or hyperspectral imaging data.

Assignees

• Zeiss Carl Microscopy Gmbh
• Sd Optics Inc
• Stereo Display Inc

Inventors

• Gaiduk Alexander
• Sohn Jin Young
• Cho Gyoungil
• Seo Cheong Soo

Classifications

• G02B21/125 Primary

  affording both dark- and bright-field illumination · CPC title

• G02B21/0032

  Optical details of illumination, e.g. light-sources, pinholes, beam splitters, slits, fibers (G02B21/0036 - G02B21/008; means for illumination of specimens in general G02B21/06) · CPC title

• G02B26/0833

  the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD (G02B26/0825 takes precedence; micromechanical devices in general B81B) · CPC title

• G02B21/18 Primary

  Arrangements with more than one light path, e.g. for comparing two specimens · CPC title

• G02B27/0075 Primary

  with means for altering, e.g. increasing, the depth of field or depth of focus · CPC title