Current sensor system

Patent metadata

Field	Value
Publication number	US-11940470-B2
Application number	US-202217804654-A
Country	US
Kind code	B2
Filing date	May 31, 2022
Priority date	May 31, 2022
Publication date	Mar 26, 2024
Grant date	Mar 26, 2024

Abstract

A substrate, comprising one or more first conductive layers, one or more second conductive layers, and a dielectric material that is arranged to encapsulate, at least in part, the first conductive layers and the second conductive layers. The one or more second conductive layers are electrically coupled to the first conductive layers. The first conductive layers and the second conductive layers are arranged to form a conductor. The first conductive layers are arranged to define a first rift in the conductor.

First claim

The invention claimed is:

1. A substrate, comprising:
one or more first conductive layers;
one or more second conductive layers that are electrically coupled to the first conductive layers, the first conductive layers and the second conductive layers being arranged to form a conductor, the first conductive layers being arranged to define a first rift in the conductor; and
a dielectric material that is arranged to encapsulate, at least in part, the first conductive layers and the second conductive layers,
wherein the first rift is arranged to cause an area directly above the first rift to have a substantially uniform magnetic coupling coefficient.

2. The substrate of claim 1 , wherein the one or more first conductive layers include a plurality of first conductive layers.

3. The substrate of claim 1 , wherein the one or more second conductive layers are disposed below the one or more first conductive layers.

4. The substrate of claim 1 , wherein the conductor includes a middle portion that is disposed between two side portions, the middle portion of the conductor has a smaller width than the side portions of the conductor, and the first rift is formed in the middle portion of the conductor.

5. The substrate of claim 1 , wherein each of the first conductive layers includes a respective through-hole that is arranged to define, at least in part, the first rift in the conductor.

6. The substrate, of claim 1 , wherein each of the first conductive layers includes at least two segments that are spaced apart from each other and arranged to define, at least in part, the first rift.

7. A substrate, comprising:
one or more first conductive layers;
one or more second conductive layers that are electrically coupled to the first conductive layers, the first conductive layers and the second conductive layers being arranged to form a conductor, the first conductive layers being arranged to define a first rift in the conductor; and
a dielectric material that is arranged to encapsulate, at least in part, the first conductive layers and the second conductive layers,
wherein the one or more first conductive layers include at least two first conductive layers, and at least one of the second conductive layers is disposed between the first conductive layers, dividing the first rift into two portions.

8. A substrate, comprising:
one or more first conductive layers;
one or more second conductive layers that are electrically coupled to the first conductive layers, the first conductive layers and the second conductive layers being arranged to form a conductor, the first conductive layers being arranged to define a first rift in the conductor; and
a dielectric material that is arranged to encapsulate, at least in part, the first conductive layers and the second conductive layers,
wherein the conductor includes a middle portion that is disposed between side portions, the side portions and the middle portion each having a respective central axis, such that the respective central axis of the middle portion is transverse to the respective central axes of the side portions.

9. A substrate, comprising:
one or more first conductive layers;
one or more second conductive layers that are electrically coupled to the first conductive layers, the first conductive layers and the second conductive layers being arranged to form a conductor, the first conductive layers being arranged to define a first rift in the conductor; and
a dielectric material that is arranged to encapsulate, at least in part, the first conductive layers and the second conductive layers,
wherein the conductor includes: a first portion having the first rift formed therein, a second portion having a second rift formed therein, and a cutout that is formed between the first portion and the second portion.

10. A system, comprising:
one or more first conductive layers;
one or more second conductive layers that are electrically coupled to the first conductive layers, the first conductive layers and the second conductive layers being arranged to form a conductor, the first conductive layers being configured to define a first rift in the conductor; and
a first current sensor that is mounted above the first rift,
wherein the first rift is arranged to cause an area where the first current sensor is mounted to have a substantially uniform magnetic coupling coefficient.

11. The system of claim 10 , further comprising a dielectric material that is configured to encapsulate, at least in part, the one or more first conductive layers and the one or more second conductive layers, wherein the one or more first conductive layers include a plurality of first conductive layers.

12. The system of claim 10 , wherein the one or more second conductive layers are disposed below the one or more first conductive layers.

13. The system of claim 10 , wherein the conductor includes a middle portion that is disposed between two side portions, the middle portion of the conductor having a smaller width than the side portions of the conductor, and the first rift is formed in the middle portion of the conductor.

14. The system of claim 10 , wherein each of the first conductive layers includes a respective through-hole that is arranged to define, at least in part, the first rift in the conductor.

15. The system of claim 10 , wherein each of the first conductive layers includes at least two segments that are spaced apart from each other and arranged to define, at least in part, the first rift.

16. A system, comprising:
one or more first conductive layers;
one or more second conductive layers that are electrically coupled to the first conductive layers, the first conductive layers and the second conductive layers being arranged to form a conductor, the first conductive layers being configured to define a first rift in the conductor; and
a first current sensor that is mounted above the first rift,
wherein the one or more first conductive layers include at least two first conductive layers, and at least one of the second conductive layers is disposed between the first conductive layers, dividing the first rift into two portions.

17. A system, comprising:
one or more first conductive layers;
one or more second conductive layers that are electrically coupled to the first conductive layers, the first conductive layers and the second conductive layers being arranged to form a conductor, the first conductive layers being configured to define a first rift in the conductor; and
a first current sensor that is mounted about the first rift,
wherein the conductor includes a middle portion that is disposed between side portions, the side portions and the middle portion each having a respective central axis, such that the respective central axis of the middle portion is transverse to the respective central axes of the side portions.

18. A system, comprising:
one or more first conductive layers,
one or more second conductive layers that are electrically coupled to the first conductive layers, the first conductive layers and the second conductive layers being arranged to form a conductor, the first conductive layers being configured to define a first rift in the conductor; and
a first current sensor that is mounted about the first rift,
wherein the conductor includes a first portion having the first rift formed therein, and a second portion having a second rift formed therein, and a cutout that is formed between the first portion and the second portion, the system further comprising a second current sensor that is mounted over the second rift.

Assignees

• Allegro Microsystems Llc

Inventors

• Messier Loïc André
• Rock Simon E
• Vuillermet Yannick

Classifications

• G01R15/207 Primary

  Constructional details independent of the type of device used · CPC title

• H02K11/27

  Devices for sensing current, or actuated thereby (overcurrent protection responsive to temperature of the machines or parts thereof, e.g. windings, H02K11/25) · CPC title

• H02K2211/03

  Machines characterised by circuit boards, e.g. pcb · CPC title