Cooling systems and methods using two circuits with water flow in a counter flow and in a series or parallel arrangement

US11940197B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11940197-B2
Application numberUS-202217720730-A
CountryUS
Kind codeB2
Filing dateApr 14, 2022
Priority dateNov 6, 2013
Publication dateMar 26, 2024
Grant dateMar 26, 2024

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

The cooling systems and methods of the present disclosure relate to cooling electronic equipment in data centers or any other applications that have high heat rejection temperature and high sensible heat ratio.

First claim

Opening claim text (preview).

What is claimed is: 1. A cooling system comprising: a first refrigerant circuit including: a first evaporator coil in thermal communication with an air outtake flow to a heat load, and a first condenser in fluid communication with the first evaporator coil; a second refrigerant circuit including: a second evaporator coil in thermal communication with an air intake flow from the heat load, and a second condenser in fluid communication with the second evaporator coil, wherein the second evaporator coil is in air flow series with the first evaporator coil such that the air intake flow is coupled to the air outtake flow, and the second condenser is in fluid communication with the first condenser; a water loop in fluid communication with a free-cooling fluid cooler and the first and second condensers such that water output from the free-cooling fluid cooler flows to the second condenser from the first condenser; a chiller loop in thermal communication with the water loop and the first and second condensers, the chiller loop including a trim condenser in fluid communication with: the chiller loop at a first trim fluid path of the trim condenser, and the water loop at a second trim fluid path of the trim condenser; and an air conditioning system evaporator in thermal communication with the first and second condensers, a first evaporator fluid path of the air conditioning system evaporator in fluid communication with the first trim fluid path, and a second evaporator fluid path of the air conditioning system evaporator in fluid communication with the water loop, wherein the second evaporator fluid path is in fluid communication with the second trim fluid path via the first and second condensers, and wherein a fluid flowing through the chiller loop and a fluid flowing through the water loop flow in opposite directions through the trim condenser. 2. The cooling system according to claim 1 , wherein the first and second evaporator coils are microchannel evaporator coils. 3. The cooling system according to claim 1 , wherein the chiller loop includes a compressor in fluid communication with a fluid output of the first evaporator fluid path and a fluid input of the first trim fluid path. 4. The cooling system according to claim 3 , wherein chilled water from the air conditioning system evaporator is in thermal communication with the first and second refrigerant circuits, and wherein the fluid flowing through the chiller loop and a refrigerant flowing through the first and second refrigerant circuits are in thermal counter flow. 5. The cooling system according to claim 4 , wherein a refrigerant saturation temperature of the first refrigerant circuit is less than a refrigerant saturation temperature of the second refrigerant circuit. 6. The cooling system according to claim 3 , wherein water flow through the trim condenser is in a series or in a parallel arrangement with water flow through the air conditioning system evaporator, the first condenser, and the second condenser. 7. A cooling system, comprising: a first refrigerant circuit including: a first evaporator coil in thermal communication with an air outtake flow to a heat load, and a first condenser in fluid communication with the first evaporator coil; a second refrigerant circuit including: a second evaporator coil in thermal communication with an air intake flow from the heat load, and a second condenser in fluid communication with the second evaporator coil, wherein the second evaporator coil is in air flow series with the first evaporator coil such that the air intake flow is coupled to the air outtake flow, and the second condenser is in fluid communication with the first condenser; a water loop in fluid communication with a free-cooling fluid cooler and the first and second condensers such that water output from the free-cooling fluid cooler flows to the second condenser via the first condenser; a chiller loop in thermal communication with the water loop and the first and second condensers, the chiller loop including: a trim condenser including first and second trim fluid paths; an air conditioning system evaporator in thermal communication with the first and second condensers, the air conditioning system evaporator including first and second evaporator fluid paths in fluid communication with each other; and a compressor in fluid communication with a fluid output of the first evaporator fluid path and a fluid input of the first trim fluid path, wherein the first refrigerant circuit includes the first condenser, which includes first and second condenser fluid paths, a first fluid receiver in fluid communication with the first condenser fluid path, and a first refrigerant pump in fluid communication with the first fluid receiver, wherein the second condenser fluid path is in fluid communication with the second evaporator fluid path, wherein the second refrigerant circuit includes: the second condenser, which includes a third condenser fluid path and a fourth condenser fluid path, a second fluid receiver in fluid communication with the third condenser fluid path, and a second refrigerant pump in fluid communication with the second fluid receiver, wherein the fourth condenser fluid path is in fluid communication with the second condenser fluid path and the water loop, wherein the water loop is in fluid communication with the second trim fluid path, wherein water flows through the air conditioning system evaporator to the trim condenser via the first and second condensers, and wherein a fluid flowing through the chiller loop and a fluid flowing through the water loop flow in opposite directions through the trim condenser. 8. The cooling system according to claim 7 , wherein the first and second evaporator coils are microchannel evaporator coils. 9. The cooling system according to claim 7 , wherein the first refrigerant circuit further includes a first fluid receiver in fluid communication with a first fluid path of the first condenser, wherein the first refrigerant pump is in fluid communication with the first fluid receiver, and wherein a second fluid path of the first condenser is in fluid communication with the second fluid path of the air conditioning system evaporator. 10. The cooling system according to claim 7 , wherein the second refrigerant circuit includes a second fluid receiver in fluid communication with the third condenser fluid path, wherein the second refrigerant pump is in fluid communication with the second fluid receiver, and wherein a fourth condenser fluid path is in fluid communication with the second condenser fluid path and the water loop.

Assignees

Inventors

Classifications

  • F25D17/02Primary

    for circulating liquids, e.g. brine · CPC title

  • using primary and secondary systems · CPC title

  • Compression machines, plants or systems with non-reversible cycle (F25B3/00, F25B5/00, F25B6/00, F25B7/00, F25B9/00 take precedence) · CPC title

  • of the single unit type (F25B1/10 takes precedence) · CPC title

  • Water-cooled condensers · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11940197B2 cover?
The cooling systems and methods of the present disclosure relate to cooling electronic equipment in data centers or any other applications that have high heat rejection temperature and high sensible heat ratio.
Who is the assignee on this patent?
Inertech Ip Llc
What technology area does this patent fall under?
Primary CPC classification F25D17/02. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Mar 26 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).