Flexible piezoelectric sensor based on 4D printing and preparation method thereof

Patent metadata

Field	Value
Publication number	US-11938680-B2
Application number	US-202017037745-A
Country	US
Kind code	B2
Filing date	Sep 30, 2020
Priority date	Mar 9, 2020
Publication date	Mar 26, 2024
Grant date	Mar 26, 2024

Abstract

The disclosure belongs to the technical field of additive manufacturing, and discloses a flexible piezoelectric sensor based on 4D printing and a preparation method thereof. The sensor includes a magnetic part and a conductive part, wherein: the conductive part includes two substrates disposed opposite to each other and a spiral structure disposed between the two substrates. Both the two substrates and the spiral structure are made of conductive metal materials. The magnetic part has a flexible porous structure and is arranged between the two substrates to generate a magnetic field. When the substrate is subjected to external pressure, the spiral structure and the magnetic part are compressed simultaneously, the magnetic flux passing through the spiral structure changes, and the voltage of the two substrates changes, by measuring the voltage change of the two substrates to reflect the change of external pressure, the pressure measuring process is achieved.

First claim

What is claimed is:

1. A preparation method of a flexible piezoelectric sensor, the flexible piezoelectric sensor comprises a magnetic part and a conductive part, wherein the conductive part comprises two substrates disposed opposite to each other and a spiral structure disposed between the two substrates, both the two substrates and the spiral structure are formed of conductive metal materials; the magnetic part is a flexible porous structure and arranged between the two substrates to generate a magnetic field; when the two substrates are subjected to external pressure, the spiral structure and the magnetic part are compressed simultaneously, a magnetic flux passing through the spiral structure changes, and a voltage of the two substrates changes, by measuring a voltage change of the two substrates to reflect the change of external pressure, a pressure measuring process is achieved, the method comprising the following steps:
S1 selecting polymer powder and magnetic powder as raw materials, mixing the polymer powder and the magnetic powder to prepare composite powder, calculating and obtaining a compression modulus of the spiral structure in the conductive part, constructing a porous structure of the magnetic part, and calculating and obtaining a compression modulus of the porous structure, forming the porous structure by a 3D printing method, thereby obtaining the required magnetic part; magnetizing the magnetic part so that the magnetic part obtains permanent magnetism;
S2 constructing a three-dimensional structure of the conductive part, and simultaneously constructing the compression modulus of the spiral structure according to the compression modulus of the porous structure, such that a ratio of the compression modulus of the spiral structure of the conductive part to the compression modulus of the porous structure is 0.1 to 10, selecting a raw material of the conductive part, performing a 3D printing method by using the raw material according to the 3D model, thereby obtaining the required conductive part;
S3 assembling the magnetic part with permanent magnetism between the substrates of the conductive part to obtain the required piezoelectric sensor.

2. The preparation method according to claim 1 , wherein in step S1, the 3D printing method is a metal 3D-printing process such as selective laser melting (SLM), electron beam melting (EBM), or Laser engineered net shaping (LENS).

3. The preparation method according to claim 1 , wherein in step S3, the 3D printing method is a polymer 3D-printing process such as selective laser sintering (SLS), fused deposition modelling (FDM), or photo-curing based on ultra violet.

Assignees

• Univ Huazhong Science Tech

Inventors

• Su Bin
• Wu Hongzhi
• Yan Chunze
• Shi Yusheng

Classifications

• B29C64/386 Primary

  Data acquisition or data processing for additive manufacturing · CPC title

• B22F10/18

  by mixing binder with metal in filament form, e.g. fused filament fabrication [FFF] · CPC title

• B22F10/28

  Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM] · CPC title

• B22F10/38

  to achieve specific product aspects, e.g. surface smoothness, density, porosity or hollow structures · CPC title

• B22F12/30

  Platforms or substrates · CPC title