Sensor arrangement

Patent metadata

Field	Value
Publication number	US-11933441-B2
Application number	US-201917297909-A
Country	US
Kind code	B2
Filing date	Nov 27, 2019
Priority date	Dec 5, 2018
Publication date	Mar 19, 2024
Grant date	Mar 19, 2024

Abstract

A sensor arrangement (1) is described comprising a sensor housing (2) and a mounting connector (3). Such a sensor arrangement should be soldered to a refrigeration system without being sensitive for vibrations during operation of the system and without deteriorating a sensor arranged in the housing. To this end the mounting connector (3) is at least partly made of a bi-metal material with an inner layer (10) of steel and an outer layer (11) of copper.

First claim

What is claimed is:

1. A sensor arrangement comprising a sensor housing and a mounting connector, wherein the mounting connector has a first portion made of a bi-metal material with an inner layer of steel and an outer layer of copper and a second portion made without the outer layer of copper.

2. The sensor arrangement according to claim 1 , wherein the connector is a deep drawn part.

3. The sensor arrangement according to claim 2 , wherein the deep-drawn part is made of a copper cladded stainless-steel sheet material.

4. The sensor arrangement according to claim 2 , wherein the deep-drawn part is coated with a copper layer after deep-drawing.

5. The sensor arrangement according to claim 1 , wherein the inner layer comprises a thickness in a range from 0.2 to 2 mm.

6. The sensor arrangement according to claim 1 , wherein the outer layer comprises a thickness in a range from 5% to 20% of the thickness of the inner layer.

7. The sensor arrangement according to claim 1 , wherein the mounting connector is connected to a mounting section of the housing, wherein the mounting section comprises a recess and the mounting connector comprises a flange, wherein the flange is arranged in the recess.

8. The sensor arrangement according to claim 7 , wherein the flange is free of copper.

9. The sensor arrangement according to claim 7 , wherein the mounting section comprises a step.

10. The sensor arrangement according to claim 7 , wherein the mounting section comprises a protrusion extending from the mounting section.

11. The sensor arrangement according to claim 10 , wherein the protrusion extends from a front face of the step.

12. The sensor arrangement according to claim 1 , wherein the mounting connector is in form of a connector tube.

13. The sensor arrangement according to claim 12 , wherein the connector tube is of cylindrical form.

14. The sensor arrangement according to claim 12 , wherein the connector tube comprises at least a first section having a first diameter and a second section having a second diameter smaller than the first diameter, wherein the first section is arranged closer to the housing than the second section.

15. The sensor arrangement according to claim 14 , wherein the connector tube comprises at least a third section having a third diameter smaller than the first diameter and the second diameter, wherein the third section is arranged at an end of the connector tube remote from the mounting area.

16. The sensor arrangement according to claim 15 , wherein the third section comprises an opening in an end section.

17. The sensor arrangement according to claim 3 , wherein the deep-drawn part is coated with a copper layer after deep-drawing.

18. The sensor arrangement according to claim 2 , wherein the inner layer comprises a thickness in a range from 0.2 to 2 mm.

19. The sensor arrangement according to claim 3 , wherein the inner layer comprises a thickness in a range from 0.2 to 2 mm.

20. The sensor arrangement according to claim 4 , wherein the inner layer comprises a thickness in a range from 0.2 to 2 mm.

Assignees

• Danfoss As

Inventors

• Shetty Veenith
• Hansen Hans-Henning
• Jensen Jens

Classifications

• F16L41/008 Primary

  for connecting a measuring instrument · CPC title

• B23K1/19

  taking account of the properties of the materials to be soldered · CPC title

• F16L41/084

  Soldered joints · CPC title

• G01D11/245

  Housings for sensors · CPC title

• G01L19/0007

  Fluidic connecting means · CPC title