Water-absorbing resin particles

US11931718B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11931718-B2
Application numberUS-201917040465-A
CountryUS
Kind codeB2
Filing dateMar 27, 2019
Priority dateMar 28, 2018
Publication dateMar 19, 2024
Grant dateMar 19, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Water-absorbing resin particles have a repulsion rate of 5% or more according to the formula (h3−h2)/h1×100(%) when a cylinder with an inner diameter of 25.4 mm, which has a mesh-like bottom onto which 0.2 g of the water-absorbing resin particles are sprinkled, is placed in a container having ion exchange water in an amount of 30 times a mass of the water-absorbing resin particles, where h1 represents a free swelling height (mm) of the water-absorbing resin particles after 1 minute from initiation of water absorption, h2 represents a height (mm) of the water-absorbing resin particles after a load of 1.3×103 Pa is applied to the water-absorbing resin particles for 1 minute after 1 minute from initiation of the water absorption, and h3 represents a height (mm) of the water-absorbing resin particles after 1 minute from release of the load applied when measuring h2.

First claim

Opening claim text (preview).

The invention claimed is: 1. Water-absorbing resin particles having a repulsion rate of 5% or more represented by Formula (1): ( h 3 −h 2 )/ h 1 ×100(%)  (1) wherein in Formula (1), when a cylinder with an inner diameter of 25.4 mm, which has a mesh-like bottom onto which 0.2 g of the water-absorbing resin particles are sprinkled, is placed in a container having ion exchange water in an amount of 30 times a mass of the water-absorbing resin particles such that the water-absorbing resin particles absorb the ion exchange water, h 1 represents a free swelling height (mm) of the water-absorbing resin particles after 1 minute from initiation of the water absorption, h 2 represents a height (mm) of the water-absorbing resin particles after a load of 1.3×10 3 Pa is applied to the water-absorbing resin particles for 1 minute after 1 minute from initiation of the water absorption, and h 3 represents a height (mm) of the water-absorbing resin particles after 1 minute from release of the load applied when measuring h 2 . 2. The water-absorbing resin particles according to claim 1 , wherein an absorption rate of physiological saline by a vortex method is 10 seconds or less. 3. The water-absorbing resin particles according to claim 1 , wherein a retention capacity of physiological saline is 15 to 39 g/g. 4. The water-absorbing resin particles according to claim 1 , wherein an absorption rate of physiological saline by a vortex method is 7 seconds or less.

Assignees

Inventors

Classifications

  • B01J20/261Primary

    obtained by reactions only involving carbon to carbon unsaturated bonds (macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds per se C08F) · CPC title

  • Properties of the article, e.g. stiffness or absorbency (chemical aspects A61L15/00) · CPC title

  • Particle form · CPC title

  • Investigating flow properties of materials, e.g. viscosity, plasticity; Analysing materials by determining flow properties · CPC title

  • Absorbency · CPC title

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What does patent US11931718B2 cover?
Water-absorbing resin particles have a repulsion rate of 5% or more according to the formula (h3−h2)/h1×100(%) when a cylinder with an inner diameter of 25.4 mm, which has a mesh-like bottom onto which 0.2 g of the water-absorbing resin particles are sprinkled, is placed in a container having ion exchange water in an amount of 30 times a mass of the water-absorbing resin particles, where h1 rep…
Who is the assignee on this patent?
Sumitomo Seika Chemicals
What technology area does this patent fall under?
Primary CPC classification B01J20/261. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Mar 19 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).