Flexible light-emitting device and EL module including transparent conductive film

Patent metadata

Field	Value
Publication number	US-11930668-B2
Application number	US-202117532302-A
Country	US
Kind code	B2
Filing date	Nov 22, 2021
Priority date	Oct 16, 2008
Publication date	Mar 12, 2024
Grant date	Mar 12, 2024

Abstract

It is an object to provide a flexible light-emitting device with long lifetime in a simple way and to provide an inexpensive electronic device with long lifetime using the flexible light-emitting device. A flexible light-emitting device is provided, which includes a substrate having flexibility and a light-transmitting property with respect to visible light; a first adhesive layer over the substrate; an insulating film containing nitrogen and silicon over the first adhesive layer; a light-emitting element including a first electrode, a second electrode facing the first electrode, and an EL layer between the first electrode and the second electrode; a second adhesive layer over the second electrode; and a metal substrate over the second adhesive layer, wherein the thickness of the metal substrate is 10 μm to 200 μm inclusive. Further, an electronic device using the flexible light-emitting device is provided.

First claim

What is claimed is:

1. An EL module comprising:
a plastic substrate;
a layer comprising a light-emitting element;
a metal substrate; and
a transparent conductive film,
wherein the plastic substrate and the layer are bonded to each other by a first bonding layer,
wherein the metal substrate and the layer are bonded to each other by a second bonding layer,
wherein the transparent conductive film overlaps with the light-emitting element with the plastic substrate therebetween, and
wherein the transparent conductive film is a transparent metal oxide.

2. The EL module according to claim 1 ,
wherein a thickness of the metal substrate is greater than or equal to 10 μm and less than or equal to 200 μm.

3. The EL module according to claim 1 ,
wherein the EL module is curved along a curved surface, and
wherein a region which is along the curved surface is configured to display an image.

4. An EL module comprising:
a plastic substrate;
a layer comprising a light-emitting element;
a metal substrate; and
a transparent conductive film,
wherein the plastic substrate and the layer are bonded to each other by a first bonding layer,
wherein the metal substrate and the layer are bonded to each other by a second bonding layer,
wherein the transparent conductive film overlaps with the light-emitting element with the plastic substrate therebetween,
wherein the transparent conductive film is a transparent metal oxide, and
wherein the transparent conductive film is configured to suppress an electrostatic charge on the plastic substrate.

5. The EL module according to claim 4 ,
wherein a thickness of the metal substrate is greater than or equal to 10 μm and less than or equal to 200 μm.

6. The EL module according to claim 4 ,
wherein the EL module is curved along a curved surface, and
wherein a region which is along the curved surface is configured to display an image.

7. A flexible light-emitting device comprising:
a plastic substrate;
a layer comprising a light-emitting element;
a metal substrate; and
a transparent conductive film,
wherein the plastic substrate and the layer are bonded to each other by a first bonding layer,
wherein the metal substrate and the layer are bonded to each other by a second bonding layer,
wherein the transparent conductive film overlaps with the light-emitting element with the plastic substrate therebetween,
wherein the transparent conductive film is a transparent metal oxide, and
wherein the transparent conductive film is configured to suppress an electrostatic charge on the plastic substrate.

8. The flexible light-emitting device according to claim 7 ,
wherein a thickness of the metal substrate is greater than or equal to 10 μm and less than or equal to 200 μm.

9. The flexible light-emitting device module according to claim 7 ,
wherein the EL module is curved along a curved surface, and
wherein a region which is along the curved surface is configured to display an image.

Assignees

• Semiconductor Energy Lab

Inventors

• Hatano Kaoru
• Seo Satoshi
• Nagata Takaaki
• Okano Tatsuya

Classifications

• H10K59/873

  Encapsulations · CPC title

• H10K59/8722 Primary

  Peripheral sealing arrangements, e.g. adhesives, sealants · CPC title

• H10K59/8721

  Metallic sealing arrangements · CPC title

• H10K59/80524

  Transparent cathodes, e.g. comprising thin metal layers · CPC title

• H10K59/124 Primary

  Insulating layers formed between TFT elements and OLED elements · CPC title