Vapor chambers

Patent metadata

Field	Value
Publication number	US-11930620-B2
Application number	US-202016914294-A
Country	US
Kind code	B2
Filing date	Jun 27, 2020
Priority date	Jun 27, 2020
Publication date	Mar 12, 2024
Grant date	Mar 12, 2024

Abstract

There is disclosed in one example a heat dissipator for an electronic apparatus, including: a planar vapor chamber having a substantially rectangular form factor, wherein a second dimension d 2 of the rectangular form factor is at least approximately twice a first dimension d 1 of the rectangular form factor; a first fan and second fan; and a first heat pipe and second heat pipe discrete from the planar vapor chamber and disposed along first and second d 1 edges of the planar vapor chamber, further disposed to conduct heat from the first and second d 1 edges to the first and second fan respectively.

First claim

What is claimed is:

1. A heat dissipator for an electronic apparatus, comprising:
a planar vapor chamber having a substantially rectangular form factor, wherein a second dimension (d 2 ) of the rectangular form factor is at least twice a first dimension (d 1 ) of the rectangular form factor;
a first fan located adjacent to a d 2 edge of the planar vapor chamber and proximate to a first d 1 edge of the planar vapor chamber;
a second fan located adjacent to the d 2 edge of the planar vapor chamber and proximate to a second d 1 edge of the planar vapor chamber, wherein the second d 1 edge of the planar vapor chamber is opposite the first d 1 edge of the planar vapor chamber;
a first heat pipe discrete from the planar vapor chamber and located along the first d 1 edge of the planar vapor chamber, wherein the first heat pipe is disposed to conduct heat from the first d 1 edge of the planar vapor chamber to the first fan; and
a second heat pipe discrete from the planar vapor chamber and located along the second d 1 edge of the planar vapor chamber, wherein the second heat pipe is disposed to-conduct heat from the second d 1 edge of the planar vapor chamber to the second fan.

2. The heat dissipator of claim 1 , wherein the d 2 of the planar vapor chamber is between two times the d 1 (2·d 1 ) and five times the d 1 (5·d 1 ).

3. The heat dissipator of claim 1 , wherein the first heat pipe extends beyond the d 2 edge of the planar vapor chamber.

4. The heat dissipator of claim 3 , wherein the second heat pipe extends beyond the d 2 edge of the planar vapor chamber.

5. The heat dissipator of claim 1 , wherein the second heat extends beyond the d 2 edge of the planar vapor chamber.

6. The heat dissipator of claim 1 , wherein the first heat pipe is a second vapor chamber and the second heat pipe is a third vapor chamber.

7. The heat dissipator of claim 1 , wherein the planar vapor chamber further comprises wicking means to conduct fluid from a condenser of the planar vapor chamber to an evaporator of the planar vapor chamber.

8. The heat dissipator of claim 7 , wherein the wicking means are locally absent from a portion of the planar vapor chamber.

9. The heat dissipator of claim 1 , wherein the planar vapor chamber further comprises radial pattern internal support ribbing.

10. A computing system, comprising:
a processor;
a memory;
a human interface; and
the heat dissipator of claim 1 .

11. The computing system of claim 10 , wherein the system is a laptop computer.

Assignees

• Intel Corp

Inventors

• Ku Jeff
• Nien Cora
• Sung Gavin
• Liu Tim
• Lin Lance
• Liu Wan Yu
• Juan Gerry
• Jiang Jason Y
• Huttula Justin M
• Kuklinski Evan Piotr
• Paavola Juha Tapani
• Sen Arnab
• Thakur Hari Shanker
• Kurma Raju Prakash

Classifications

• H10W40/73

  for cooling by change of state · CPC title

• H05K7/20309 Primary

  Evaporators · CPC title

• G06F1/203 Primary

  for portable computers, e.g. for laptops · CPC title

• H01L23/427

  Electricity · mapped topic

• H05K7/20136

  Forced ventilation, e.g. by fans (H05K7/202 takes precedence) · CPC title