Oven-controlled crystal oscillator

US11929709B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11929709-B2
Application numberUS-202117770028-A
CountryUS
Kind codeB2
Filing dateFeb 22, 2021
Priority dateMar 30, 2020
Publication dateMar 12, 2024
Grant dateMar 12, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An oven-controlled crystal oscillator according to one or more embodiments may include a core section having a crystal resonator, an oscillator IC and a heating IC, wherein the core section is supported by a package via an interposer, and furthermore the core section is hermetically encapsulated in the package.

First claim

Opening claim text (preview).

The invention claimed is: 1. An oven-controlled crystal oscillator comprising a core section including a piezoelectric resonator, an oscillator IC and a heating element, wherein the core section comprises a layered structure in which the oscillator IC, the piezoelectric resonator and the heating element are laminated, the core section is supported by a package via a core substrate, and furthermore is hermetically encapsulated in the package, the core substrate is formed in a flat plate shape, the piezoelectric resonator includes: a first sealing member and a second sealing member both made of glass or crystal; and a piezoelectric resonator plate made of crystal, the piezoelectric resonator plate includes a vibrating part, on respective main surfaces of which excitation electrodes are formed, and the first sealing member and the second sealing member are laminated and bonded to each other via the piezoelectric resonator plate so as to hermetically seal the vibrating part of the piezoelectric resonator plate in an internal space. 2. The oven-controlled crystal oscillator according to claim 1 , wherein the package is provided with a recess part whose upper part is opened, and the core section is supported by the core substrate so as to be hung inside the package. 3. The oven-controlled crystal oscillator according to claim 2 , wherein a pair of step parts facing each other is formed inside the package, the core substrate is disposed so as to be bridged between the pair of step parts, and the core section is disposed so as to be housed in a space between the pair of step parts. 4. The oven-controlled crystal oscillator according to claim 3 , wherein the core substrate is fixed to the pair of step parts via a polyimide conductive adhesive. 5. The oven-controlled crystal oscillator according to claim 1 , wherein the heating element, the piezoelectric resonator and the oscillator IC are laminated in the recited order from the core substrate side. 6. An oven-controlled crystal oscillator comprising a core section including a piezoelectric resonator, an oscillator IC and a heating element, wherein the core section comprises a layered structure in which the oscillator IC, the piezoelectric resonator and the heating element are laminated, and the core section is supported by a package via a core substrate, and furthermore is hermetically encapsulated in the package, wherein the core section is supported by the package via only the core substrate, the piezoelectric resonator includes: a first sealing member and a second sealing member both made of glass or crystal; and a piezoelectric resonator plate made of crystal, the piezoelectric resonator plate includes a vibrating part, on respective main surfaces of which excitation electrodes are formed, and the first sealing member and the second sealing member are laminated and bonded to each other via the piezoelectric resonator plate so as to hermetically seal the vibrating part of the piezoelectric resonator plate in an internal space. 7. The oven-controlled crystal oscillator according to claim 6 , wherein the package is provided with a recess part having an upper part that is opened, and the core section is supported by the core substrate so as to hang inside the package. 8. The oven-controlled crystal oscillator according to claim 7 , wherein a pair of step parts facing each other is formed inside the package, the core substrate is disposed so as to be bridged between the pair of step parts, and the core section is disposed so as to be housed in a space between the pair of step parts. 9. The oven-controlled crystal oscillator according to claim 8 , wherein the core substrate is fixed to the pair of step parts via a polyimide conductive adhesive. 10. The oven-controlled crystal oscillator according to claim 6 , wherein the heating element, the piezoelectric resonator and the oscillator IC are laminated in the recited order from the core substrate side. 11. An oven-controlled crystal oscillator comprising a core section including a piezoelectric resonator, an oscillator IC and a heating element, wherein the core section comprises a layered structure in which the oscillator IC, the piezoelectric resonator and the heating element are laminated, the core section is supported by a package via a core substrate, and furthermore is hermetically encapsulated in the package, the core substrate is formed in a flat plate shape, the package is provided with a recess part whose upper part is opened, the core section is supported by the core substrate so as to be hung inside the package, a pair of step parts facing each other is formed inside the package, the core substrate is disposed so as to be bridged between the pair of step parts, and the core section is disposed so as to be housed in a space between the pair of step parts. 12. The oven-controlled crystal oscillator according to claim 11 , wherein the core substrate is fixed to the pair of step parts via a polyimide conductive adhesive. 13. The oven-controlled crystal oscillator according to claim 11 , wherein the heating element, the piezoelectric resonator and the oscillator IC are laminated in the recited order from the core substrate side.

Assignees

Inventors

Classifications

  • H03B5/04Primary

    Modifications of generator to compensate for variations in physical values, e.g. power supply, load, temperature · CPC title

  • being a piezoelectric resonator (selection of piezoelectric material H10N30/00) · CPC title

  • H03L1/04Primary

    Constructional details for maintaining temperature constant · CPC title

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What does patent US11929709B2 cover?
An oven-controlled crystal oscillator according to one or more embodiments may include a core section having a crystal resonator, an oscillator IC and a heating IC, wherein the core section is supported by a package via an interposer, and furthermore the core section is hermetically encapsulated in the package.
Who is the assignee on this patent?
Daishinku Corp
What technology area does this patent fall under?
Primary CPC classification H03B5/04. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 12 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).