Drying system with integrated substrate alignment stage
US-2022282918-A1 · Sep 8, 2022 · US
US11929264B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11929264-B2 |
| Application number | US-202217681670-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 25, 2022 |
| Priority date | Mar 3, 2021 |
| Publication date | Mar 12, 2024 |
| Grant date | Mar 12, 2024 |
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A substrate cleaning and drying system includes a cleaning station, a drying station positioned adjacent the cleaning station, a cleaner robot to transfer a substrate from the cleaning station to the drying station, an aligner stage adjacent to the drying station, a robot arm rotatable between a substantially vertical first position for receiving the substrate from the drying station and a substantially horizontal second position for releasing the substrate onto the aligner stage, and a factory interface robot to transfer a substrate from the aligner stage into a factory interface module while in a horizontal orientation. The aligner stage includes a rotatable support to hold the substrate in a substantially horizontal orientation and to rotate the substrate to a desired orientation.
Opening claim text (preview).
What is claimed is: 1. A substrate cleaning and drying system, comprising: a cleaning station including a first support to hold a substrate in a substantially vertical orientation; a drying station positioned adjacent the cleaning station, the drying station including a tank to contain a liquid, a second support to hold the substrate in a substantially vertical orientation in the liquid, and a dispenser to deliver drying fluid comprising a surfactant; a cleaner robot having an arm configured to transfer the substrate from the cleaning station to the drying station; an aligner stage arranged on a side of the drying station opposing the cleaning station, the aligner stage including a rotatable support to hold the substrate in a horizontal orientation and to rotate the substrate about an axis perpendicular to the substrate to a desired orientation; a transfer robot having a robot arm arranged between the drying station and the aligner stage rotatable between a substantially vertical first position for receiving the substrate from above the drying station and a substantially horizontal second position above the aligner stage and for releasing the substrate onto the aligner stage, the robot arm having a first end to hold the substrate and a second end that is rotatable around a horizontal axis parallel to a face of the substrate and offset from the substrate such that the substrate swings face-first from a substantially vertical orientation over the drying station to a substantially horizontal orientation over the aligner stage; a factory interface module to support a cassette; and a factory interface robot to transfer the substrate from the aligner stage into the factory interface module while in a horizontal orientation. 2. The system of claim 1 , wherein the arm of the cleaner robot is configured to lower the substrate into the tank. 3. The system of claim 2 , comprising a first robot configured to raise the substrate out of the tank to a position for a hand-off to the robot arm. 4. The system of claim 2 , wherein the robot arm is configured to raise the substrate out of the tank to the first position. 5. The system of claim 2 , wherein the arm of the cleaner robot is configured to lower the substrate onto the second support. 6. The system of claim 1 , comprising a first robot configured to receive the substrate in a hand-off from the cleaner robot above the tank and lower the substrate into the tank. 7. The system of claim 6 , wherein the first robot is configured to raise the substrate out of the tank to the first position. 8. The system of claim 6 , wherein the first robot is configured to be reinserted into or lowered within the tank while the robot arm holds the substrate. 9. The system of claim 6 , wherein the first robot is configured to lower the substrate onto the second support. 10. The system of claim 6 , wherein the aligner stage is configured to align a first substrate of multiple substrates simultaneously with the drying station drying a second substrate of the multiple substrates. 11. The system of claim 1 , wherein the robot arm includes fingers adjustable to grip edges of the substrate during rotation between the first position and the second position. 12. The system of claim 1 , wherein the rotatable support comprises a pedestal rotatable about a vertical axis and coupleable to the face of the substrate on the aligner stage.
the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title
Position monitoring, e.g. misposition detection or presence detection · CPC title
for positioning, orientation or alignment · CPC title
with the semiconductor substrates being dipped in baths or vessels · CPC title
Vertical transfer of a single workpiece · CPC title
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