Optical module

Patent metadata

Field	Value
Publication number	US-11927818-B2
Application number	US-202117364322-A
Country	US
Kind code	B2
Filing date	Jun 30, 2021
Priority date	Dec 20, 2019
Publication date	Mar 12, 2024
Grant date	Mar 12, 2024

Abstract

An optical module has an optical port and an electrical port, and includes a shell, a circuit board, a circuit adapter board, a silicon optical chip, a light source and an optical fiber socket. The circuit board is disposed in the shell. One end of the circuit board is provided with a connecting finger located in the electrical port. The circuit adapter board is disposed on and electrically connected to the circuit board. A thermal expansion coefficient of the circuit adapter board is lower than that of the circuit board. The silicon optical chip is disposed on and electrically connected to the circuit adapter board. The light source is disposed on the circuit board, is electrically connected to the circuit board, and is optically connected to the silicon optical chip. The optical fiber socket is optically connected to the silicon optical chip, and is configured to form the optical port.

First claim

What is claimed is:

1. An optical module having an optical port and an electrical port, the optical module comprising:
a shell;
a circuit board disposed in the shell, an end of the circuit board being provided with a connecting finger, and the connecting finger being located in the electrical port;
a circuit adapter board disposed on the circuit board and electrically connected to the circuit board, a thermal expansion coefficient of the circuit adapter board being lower than that of the circuit board;
a silicon optical chip disposed on the circuit adapter board and electrically connected to the circuit adapter board;
a light source disposed on the circuit board, and electrically connected to the circuit board and optically connected to the silicon optical chip; and
an optical fiber socket optically connected to the silicon optical chip and configured to form the optical port.

2. The optical module according to claim 1 , wherein a thermal conductivity of the circuit adapter board is greater than a thermal conductivity of the circuit board.

3. The optical module according to claim 1 , wherein
the circuit adapter board includes: first bonding pads disposed on a surface of the circuit adapter board proximate to the silicon optical chip, second bonding pads disposed on a surface of the circuit adapter board away from the silicon optical chip, and internal wiring connecting the first bonding pads and the second bonding pads;
the silicon optical chip includes third bonding pads disposed on a surface of the silicon optical chip proximate to or away from the circuit adapter board; and
the silicon optical chip is electrically connected to the circuit adapter board through the first bonding pads and the third bonding pads, and the circuit adapter board is electrically connected to the circuit board through the second bonding pads.

4. The optical module according to claim 1 , further comprising:
a driver chip disposed on the circuit adapter board, and being electrically connected to the circuit adapter board and the silicon optical chip; and
a trans-impedance amplifier disposed on the circuit adapter board, and being electrically connected to the circuit adapter board and the silicon optical chip.

5. The optical module according to claim 4 , wherein
the driver chip and the trans-impedance amplifier are electrically connected to the silicon optical chip through corresponding internal wiring in the circuit adapter board, respectively.

6. The optical module according to claim 1 , wherein the silicon optical chip includes optical waveguide end facets disposed on a side of the silicon optical chip;
the optical waveguide end facets include a plurality of first light inlet waveguide end facets, a plurality of second light inlet waveguide end facets, and a plurality of light outlet waveguide end facets; and
the silicon optical chip receives light of the light source through the plurality of first light inlet waveguide end facets and modulates the light, and transmits an optical signal obtained after modulation to an outside of the optical module through the plurality of light outlet waveguide end facets; and the silicon optical chip also receives an optical signal outside the optical module through the plurality of second light inlet waveguide end facets.

7. The optical module according to claim 6 , wherein a side of the silicon optical chip provided with the optical waveguide end facets is located near an edge of the circuit adapter board proximate to the optical port; and
the circuit adapter board further includes a notch located on a side of the circuit adapter board proximate to the optical waveguide end facets, and the silicon optical chip is bridged over the notch.

8. The optical module according to claim 7 , wherein there is a distance between the side of the silicon optical chip provided with the optical waveguide end facets and the side of the circuit adapter board provided with the notch; and
the side of the circuit adapter board provided with the notch is closer to or farther away from the optical port than the side of the silicon optical chip provided with the optical waveguide end facets.

9. The optical module according to claim 7 , wherein the side of the silicon optical chip provided with the optical waveguide end facets is flush with the side of the circuit adapter board provided with the notch.

10. The optical module according to claim 6 , further comprising:
a first optical fiber ribbon, wherein one end of the first optical fiber ribbon is optically connected to the silicon optical chip, and another end of the first optical fiber ribbon is optically connected to the optical fiber socket;
a second optical fiber ribbon, wherein one end of the second optical fiber ribbon is optically connected to the silicon optical chip, and another end of the second optical fiber ribbon is optically connected to the light source;
a first optical fiber ribbon connector configured to clamp the end of the first optical fiber ribbon and the end of the second optical fiber ribbon that are optically connected to the silicon optical chip; and
a second optical fiber ribbon connector configured to clamp the end of the second optical fiber ribbon optically connected to the light source.

11. The optical module according to claim 10 , wherein the first optical fiber ribbon connector includes:
a first fixing component including a first clamping surface and a second clamping surface;
a second fixing component including a third clamping surface, and the third clamping surface cooperates with the first clamping surface to clamp first optical fiber segments of the first optical fiber ribbon and the second optical fiber ribbon; and
a third fixing component including a fourth clamping surface, and the fourth clamping surface cooperates with the second clamping surface to clamp second optical fiber segments of the first optical fiber ribbon and the second optical fiber ribbon.

12. The optical module according to claim 11 , wherein a plurality of grooves are provided on the first clamping surface, and an arrangement density of the plurality of grooves corresponds to that of the optical waveguide end facets;
the third clamping surface cooperates with the first clamping surface to fix optical fibers of the first optical fiber ribbon and the second optical fiber ribbon in corresponding grooves.

13. The optical module according to claim 10 , further comprising a connector fixing component, wherein
the connector fixing component is configured to fix the first optical fiber ribbon connector and the silicon optical chip after optical fibers in the first optical fiber ribbon connector is optically connected to the silicon optical chip.

14. The optical module according to claim 13 , wherein the connector fixing component includes a first fixing surface and a second fixing surface, and the first fixing surface and the second fixing surface are in a stepped shape; and
the first fixing surface is fixed on a surface of the silicon optical chip away from the circuit adapter board, the second fixing surface is fixed on a surface of the first optical fiber ribbon connector away from the circuit board, and there is a gap between the circuit board and a surface of the first optical fiber ribbon connector proximate to the circuit board.

15. The optical module according to claim 14 , wherein a thermal expansion coefficient of the connector fixing component is less than the thermal expansion coefficient of the circuit board.

16. The optical module according to claim 14 , wherein an absolute value of a difference between th

Assignees

• Hisense Broadband Multimedia Technology Co Ltd

Inventors

• Zheng Long
• Yang Sigeng

Classifications

• G02B6/4281 Primary

  the printed circuit boards being flexible (in general H05K1/147) · CPC title

• G02B6/3885

  Multicore or multichannel optical connectors, i.e. one single ferrule containing more than one fibre, e.g. ribbon type (optical ribbon cable G02B6/4403, G02B6/448) · CPC title

• G02B6/389

  characterised by the method of fastening connecting plugs and sockets, e.g. screw- or nut-lock, snap-in, bayonet type · CPC title

• G02B6/43

  Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections · CPC title

• G02B6/1203

  using mounting means, e.g. by using a combination of materials having different thermal expansion coefficients · CPC title