Low pressure molded article and method for making same

US11927760B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11927760-B2
Application numberUS-202117221995-A
CountryUS
Kind codeB2
Filing dateApr 5, 2021
Priority dateNov 30, 2018
Publication dateMar 12, 2024
Grant dateMar 12, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An article includes a hollow enclosure defining a void. The void has a first section and a second section separate from the first section. An electronic component is housed in the first section and the second section of the void. A low pressure mold material is molded into the first section of the void and cured around a first segment of the electronic component to encapsulate the first segment of the electronic component. A support seal is inserted into the second section of the void adjacent a second segment of the electronic component. The support seal defines a sealing barrier on one side of the low pressure mold material that limits the flow of low pressure mold material out of the first section of the void.

First claim

Opening claim text (preview).

What is claimed: 1. Eyewear comprising: a frame including a first aperture configured to support a first lens, a second aperture configured to support a second lens, a first void above the first aperture, and a second void above the second aperture; a first support seal contained within the first void above the first aperture configured to provide a first sealing barrier in the first void that prevents low pressure mold (LPM) material flow from a first section of the first void to a second section of the first void; and a second support seal contained within the second void above the second aperture configured to provide a second sealing barrier in the second void that prevents LPM material flow from a first section of the second void to a second section of the second void. 2. The eyewear of claim 1 , wherein at least one of the first and the second support seals comprises a first side and a second side opposite the first side, the at least one support seal further defining a seal aperture that is open on at least the first side of the support seal. 3. The eyewear of claim 1 , wherein the first support seals comprises a first side and a second side opposite the first side, the first support seal further defines a seal aperture that is open on at least the first side of the support seal, and the eyewear further comprises: an electronic component contained in the first section and the second section of the at least one void; a LPM material molded into the first section of the first void and cured around a first segment of the electronic component to encapsulate the first segment of the electronic component; wherein the first support seal is positioned adjacent a second segment of the electronic component. 4. The eyewear of claim 3 , wherein the second segment of the electronic component extends into the seal aperture such that the first support seal fixes the position of the second segment relative to the first void. 5. The eyewear of claim 4 , wherein the first support seal sealingly engages the second segment of the electronic component in the seal aperture. 6. The eyewear of claim 3 , wherein the seal aperture is only open on the first side of the first support seal. 7. The eyewear of claim 6 , wherein the seal aperture is formed as a blind bore. 8. The eyewear of claim 3 , wherein the seal aperture is open on the first side and the second side of the first support seal. 9. The eyewear of claim 8 , wherein the seal aperture is formed as a through-hole extending through the first side and the second side of the first support seal. 10. The eyewear of claim 2 , wherein the first support seal further comprises a third side that interconnects the first side with the second side, and wherein the seal aperture is open on the first side, the second side, and the third side of the first support seal. 11. The eyewear of claim 10 , wherein the seal aperture forms a longitudinal slot through the first support seal, the longitudinal slot intersecting the first side, the second side, and the third side of the first support seal. 12. The eyewear of claim 2 , wherein at least one of the first side and the second side of the first support seal defines a glue well. 13. The eyewear of claim 1 , wherein the low pressure mold material is sealed off from the second section of the first void by the first support seal. 14. The eyewear of claim 1 , wherein the first void comprises a third section, and the first support seal is positioned between the first section of the first void and the third section of the first void so that the third section of the first void is sealed off from the LPM material. 15. The eyewear of claim 1 , wherein the support seal seals the first section of the void from an outside area external to the hollow enclosure. 16. A method for use in forming augmented reality eyewear, the augmented reality eyewear including a frame having an aperture configured to support a lens and a void above the aperture, the method comprising the steps of: placing the frame into a low pressure mold, the void having a first section and a second section different from the first section; inserting an electronic component into the void, the electronic component having a first segment placed into the first section of the void, and a second segment placed in the second section of the void; placing a support seal in the second section of the void such that the support seal supports and maintains the electronic component in a fixed position in the void; closing the low pressure mold around the frame; injecting a hot melt material into the low pressure mold and inside the first section of the void to encapsulate the first segment of the electronic component in the first section of the void, the support seal limiting the flow of the hot melt material into the second section of the void; opening the low pressure mold; and removing the frame from the low pressure mold. 17. The method of claim 16 , wherein the support seal comprises a first side and a second side opposite the first side, the support seal further defines a seal aperture that is open on at least the first side of the support seal, and the support seal supports and maintains the position of the second segment of the electronic component in the seal aperture. 18. The method of claim 17 , wherein the support seal sealingly engages the second segment of the electronic component in the seal aperture. 19. The method of claim 16 , wherein the hot melt material is sealed off from the second section of the void by the support seal. 20. The method of claim 16 , wherein the method further comprises: removing the support seal from the second section of the void after removing the frame from the low pressure mold.

Assignees

Inventors

Classifications

  • characterised by mechanical features · CPC title

  • Positioning or centering articles in the mould · CPC title

  • specially adapted for particular purposes, not otherwise provided for or not fully classifiable according to technical characteristics, e.g. therapeutic glasses · CPC title

  • Electronic devices other than hearing aids · CPC title

  • B29D12/02Primary

    Spectacle frames (constructional form G02C) · CPC title

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Frequently asked questions

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What does patent US11927760B2 cover?
An article includes a hollow enclosure defining a void. The void has a first section and a second section separate from the first section. An electronic component is housed in the first section and the second section of the void. A low pressure mold material is molded into the first section of the void and cured around a first segment of the electronic component to encapsulate the first segment…
Who is the assignee on this patent?
Steger Stephen Andrew, Snap Inc
What technology area does this patent fall under?
Primary CPC classification G02B27/0176. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Mar 12 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).