Activating surfaces for subsequent bonding

Patent metadata

Field	Value
Publication number	US-11926768-B2
Application number	US-202117340259-A
Country	US
Kind code	B2
Filing date	Jun 7, 2021
Priority date	Dec 6, 2018
Publication date	Mar 12, 2024
Grant date	Mar 12, 2024

Abstract

A method of activating a surface of a plastics substrate formed from:
(a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); (b) a polymer containing a phenyl group directly attached to a carbonyl group, for example polybutadiene terephthalate (PBT) optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA); (c) polyphenylene sulfide (PPS); or (d) polyetherimide (PEI);

for subsequent bonding, the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation:
includes radiation with wavelength in the range from about 10 nm to about 1000 nm;
the energy of the actinic radiation to which the surface is exposed is in the range from
about 0.5 J/cm 2 to about 300 J/cm 2 .
Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.

First claim

What is claimed:

1. A method of activating a surface of a plastics substrate formed from:
(a) a polyaryletherketone;
(b) a polymer containing a phenyl group directly attached to a carbonyl group, optionally wherein the carbonyl group is part of an amide group;
(c) polyphenylene sulfide (PPS); or
(d) polyetherimide (PEI);
for subsequent bonding,
the method comprising a step of exposing the surface to actinic radiation wherein the actinic radiation:
includes radiation with wavelength in a range from about 10 nm to about 1000 nm;
and energy of the actinic radiation to which the surface is exposed is in a range from 4 J/cm 2 to about 300 J/cm 2 .

2. A method according to claim 1 wherein the exposing of the surface to actinic radiation is applied selectively to create areas of the surface that are activated for subsequent bonding and areas of the surface that are not activated for subsequent bonding.

3. A method according to claim 2 , wherein a mask is used which has areas which transmit actinic radiation to create areas of the surface that are activated for subsequent bonding areas and areas which block actinic radiation to create areas of the surface that are not activated for subsequent bonding.

4. A method of activating a surface according to claim 1 , the method comprising the step of treating the surface with a (meth)acrylate, prior to exposing the surface to actinic radiation, wherein the (meth)acrylate is selected from tetrahydrofurfuryl acrylate (THFA): methyl methacrylate (MMA); and isobornyl acrylate (IBOA) and any combination thereof.

5. A method according to claim 4 wherein:
the plastics substrate is PPS; and/or
the activating is carried out for subsequent bonding with acrylic adhesive; and/or
the energy of the actinic radiation to which the surface is exposed is in the range from about 25 J/cm 2 to about 240 J/cm 2 .

6. A method of activating a surface according to claim 1 wherein the polyaryletherketone (a) is selected from polyether ether ketone (PEEK); polyether ketone ketone (PEKK); polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); and the actinic radiation includes radiation with wavelength in the range from about 200 nm to about 700 nm.

7. A method according to claim 1 wherein the energy of the actinic radiation to which the surface is exposed is in the range from 4 J/cm 2 to about 240 J/cm 2 .

8. A method according to claim 1 wherein the duration of the exposure is from about 0.1 seconds to about 360 minutes.

9. A method of activating a surface according to claim 1 wherein the activating is carried out for subsequent bonding with an acrylic adhesive, optionally wherein the energy of the actinic radiation to which the surface is exposed is in the range from 4 J/cm 2 to about 240 J/cm 2 .

10. A method according to claim 1 wherein:
the energy of the actinic radiation to which the surface is exposed is in the range from 4 J/cm 2 to about 100 J/cm 2 ; and/or
the substrate is PPS, polybutadiene terephthalate (PBT), polyarylamide (PARA) or PEI; and/or
activating is carried out for subsequent bonding with acrylic adhesive.

11. A method according to claim 1 wherein:
the energy of the actinic radiation to which the surface is exposed is in the range from 4 J/cm 2 to about 240 J/cm 2 ; and/or
the substrate is PEEK, PEKK, PEK, PEEKK, PEKEKK, PPS, PBT or PEI; and/or
activating is carried out for subsequent bonding with epoxy adhesive.

12. A method of activating a surface to claim 1 , wherein the activating is carried out for subsequent bonding with an epoxy adhesive.

13. A method of activating a surface of a plastics substrate formed from:
(a) a polyaryletherketone;
(b) a polymer containing a phenyl group directly attached to a carbonyl group, optionally wherein the carbonyl group is part of an amide group;
(c) polyphenylene sulfide (PPS); or
(d) polyetherimide (PEI);
for subsequent bonding,
the method comprising a step of exposing the surface to actinic radiation wherein the actinic radiation:
includes radiation with wavelength in a range from about 10 nm to about 1000 nm;
and energy of the actinic radiation to which the surface is exposed is in a range from about 0.5 J/cm 2 to about 300 J/cm 2 , the method comprising the step of treating the surface with copper acrylate, prior to exposing the surface to actinic radiation.

14. A method according to claim 13 wherein:
the energy of the actinic radiation to which the surface is exposed is in the range from about 3 J/cm 2 to about 240 J/cm 2 ; and/or
activating is carried out for subsequent bonding with anaerobic adhesive.

15. A method of activating a surface according to claim 13 wherein the activating is carried out for subsequent bonding with an anaerobic adhesive.

16. A method of bonding a first substrate formed from:
(a) polyaryletherketone;
(b) a polymer containing a phenyl group directly attached to a carbonyl group, optionally wherein the carbonyl group is part of an amide group;
(c) polyphenylene sulfide (PPS); or
(d) polyetherimide (PEI);
to a second substrate comprising the steps of:
(i) exposing the surface of the first substrate to actinic radiation to activate the surface for subsequent bonding wherein the actinic radiation includes radiation with wavelength in the range from about 10 nm to about 1000 nm; and the energy of the actinic radiation to which the surface is exposed is in the range from about 4 J/cm 2 to about 300 J/cm 2 ,
(ii) subsequently, bonding the activated surface of the first substrate to the second substrate utilising adhesive.

17. A method of bonding a first substrate formed from:
(a) a polyaryletherketone;
(b) a polymer containing a phenyl group directly attached to a carbonyl group, optionally wherein the carbonyl group is part of an amide group;
(c) polyphenylene sulfide (PPS); or
(d) polyetherimide (PEI);
to a second substrate comprising the steps of:
(i) exposing a surface of the first substrate to actinic radiation to activate the surface for subsequent bonding wherein the actinic radiation includes radiation with wavelength in the range from about 10 nm to about 1000 nm; and the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm 2 to about 300 J/cm 2 ,
(ii) subsequently, bonding the activated surface of the first substrate to the second substrate utilising adhesive,

the method comprising the step of treating the surface with copper acrylate, prior to step (i) exposing the surface to actinic radiation.

18. A method of bonding according to claim 16 , the method comprising the step of treating the surface with a (meth)acrylate, prior to exposing the surface to actinic radiation.

19. A method of activating a surface of a plastics substrate formed from: polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK);
for subsequent bonding,
the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation:
includes radiation with wavelength in the range from about 10 nm to about 1000 nm;
and the energy of the actinic radiation to which the surface is exposed is in the range from 4 J/cm 2 to about 40 J/cm 2 for subsequent bonding with acrylic adhesive; or
the energy of the actinic radiation to which the surface is exposed is in the range from about 4 J/cm 2 to about 850 J/cm 2 for subsequent bonding wit

Assignees

• Henkel Ag & Co Kgaa

Inventors

• Deegan Brian
• Haberlin Gavin
• Kneafsey Brendan
• Fearon Stephen

Classifications

• C09J5/02 Primary

  involving pretreatment of the surfaces to be joined · CPC title

• B29C65/483

  Reactive adhesives, e.g. chemically curing adhesives · CPC title

• B29C65/8215

  Tensile tests · CPC title

• B29C66/028

  Non-mechanical surface pre-treatments, i.e. by flame treatment, electric discharge treatment, plasma treatment, wave energy or particle radiation (B29C65/14 takes precedence; non-mechanical surface treatment of plastics in general B29C59/08 - B29C59/16) · CPC title

• B29C66/73921

  characterised by the materials of both parts being thermoplastics · CPC title