Connecting element for a pipe arrangement and arrangement

US11920702B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11920702-B2
Application numberUS-202117550447-A
CountryUS
Kind codeB2
Filing dateDec 14, 2021
Priority dateDec 15, 2020
Publication dateMar 5, 2024
Grant dateMar 5, 2024

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A connecting element for a pipe arrangement, comprising a base body with at least one through channel, a receiving bore for receiving a pipe end of a pipe, wherein the receiving bore corresponds with the through channel, wherein the receiving bore has a larger cross section than the through channel, wherein a transition step is introduced into the base body between the through channel and the receiving bore, and an arrangement and a method for manufacturing an arrangement.

First claim

Opening claim text (preview).

The invention claimed is: 1. A pipe arrangement comprising: a pipe having a circumferential burr at an inner circumferential edge of an end of the pipe; and a connecting element having a base body with a through channel, the base body having a receiving bore receiving the pipe end of the pipe, wherein the receiving bore corresponds with the through channel, wherein the receiving bore has a larger cross section than the through channel, and wherein a transition step is formed in the base body between the through channel and the receiving bore, wherein the transition step has a radial section and an axial section, and wherein a transition between radial section and axial section is rounded to form a curvature extending in the axial direction, and wherein the axial section of the transition step is sized and positioned such that it receives the circumferential burr of the pipe. 2. The pipe arrangement according to claim 1 , wherein the diameter of the transition step is larger than the diameter of the through channel and smaller than the diameter of the receiving bore. 3. The pipe arrangement according to claim 1 , wherein the bottom of the receiving bore is tapered. 4. The pipe arrangement according to claim 1 , wherein the receiving bore opens radially into a cross section expansion on a side facing away from the transition step. 5. The pipe arrangement according to claim 1 , wherein an end face of the pipe end is tapered. 6. The pipe arrangement according to claim 1 , wherein the connecting element and the pipe are connected in a substance-to-substance manner by way of a soldered connection. 7. The pipe arrangement according to claim 1 , wherein the pipe has an end face, the end face including an outer circumferential portion that faces axially, and wherein the circumferential burr at the inner circumferential edge of the pipe projects axially from a plane defined by the outer circumferential portion of the end face. 8. The pipe arrangement according to claim 7 , wherein the radial section of the transition step receives the inner circumferential edge of the pipe, and wherein the axial section receives the circumferential burr of the pipe. 9. The pipe arrangement according to claim 1 , wherein the receiving bore transitions into the radial section of the transition step, and wherein the axial section of the transition step transitions into the through channel. 10. The pipe arrangement according to claim 1 , wherein the axial section of the transition step has a diameter greater than a diameter of the through channel. 11. A cooling circuit of a motor vehicle, comprising at least one arrangement according to claim 1 . 12. A method of manufacturing the pipe arrangement according to claim 1 , the method comprising: cutting the pipe to size by way of a pipe cutter; adding a solder ring; inserting the pipe end of the pipe into the receiving bore of the connecting element, wherein a burr of the pipe end protrudes into the axial section of the transition step; and heating the arrangement such that the solder melts and rises between an inner wall of the receiving bore and an outer wall of the pipe. 13. The method according to claim 12 , wherein the receiving bore opens radially into a cross section expansion on a side facing away from the transition step, and wherein after the heating step, excess solder is accommodated in the cross-section expansion. 14. The method according to claim 12 , wherein the solder ring is inserted into the receiving bore and then the pipe is inserted into the receiving bore. 15. The method according to claim 12 , wherein the receiving bore opens radially into a cross section expansion on a side facing away from the transition step, and wherein the solder ring is pushed onto the pipe and the pipe is subsequently inserted into the receiving bore, wherein the solder ring rests in the cross-section expansion before the heating step.

Assignees

Inventors

Classifications

  • F16L13/08Primary

    Soldered joints · CPC title

  • circumferential seams, e.g. of shells · CPC title

  • Soldered joints · CPC title

  • Tubes · CPC title

  • F16L43/00Primary

    Bends; Siphons (with cleaning apertures F16L45/00) · CPC title

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What does patent US11920702B2 cover?
A connecting element for a pipe arrangement, comprising a base body with at least one through channel, a receiving bore for receiving a pipe end of a pipe, wherein the receiving bore corresponds with the through channel, wherein the receiving bore has a larger cross section than the through channel, wherein a transition step is introduced into the base body between the through channel and the r…
Who is the assignee on this patent?
Ti Automotive Eng Centre Heidelberg Gmbh, Ti Automotive Tech Ct Gmbh
What technology area does this patent fall under?
Primary CPC classification F16L13/08. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Mar 05 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).