Composite plated product and method for producing same

Patent metadata

Field	Value
Publication number	US-11920255-B2
Application number	US-202017630564-A
Country	US
Kind code	B2
Filing date	Jun 4, 2020
Priority date	Aug 1, 2019
Publication date	Mar 5, 2024
Grant date	Mar 5, 2024

Abstract

There are provided a composite plated product wherein a composite plating film of a composite material containing carbon particles in a silver layer is formed on a base material and wherein the amount of the carbon particles dropped out of the composite plating film is small, and a method for producing the same. After a composite plating film of a composite material containing carbon particles in a silver layer is formed on a base material (of preferably copper or a copper alloy) by electroplating using a silver-plating solution to which the carbon particles are added, a treatment for removing part of the carbon particles on the surface thereof is carried out.

First claim

The invention claimed is:

1. A composite plated product comprising:
a base material; and
a composite plating film of a composite material which contains carbon particles in a silver layer, the composite plating film being formed on the base material,
wherein the percentage of an area occupied by the carbon particles on the surface of the composite plating film is in the range of from 1 area % to 50 area %, and
wherein the number of the carbon particles adhered to an adhesive tape having an adhesive force of 4.02 N/10 mm is not larger than 35,000/mm 2 when the adhesive tape is peeled off from the surface of the composite plating film after it is put thereon.

2. A composite plated product as set forth in claim 1 , wherein said composite plating film has a thickness of 0.5 to 15 μm.

3. A composite plated product as set forth in claim 1 , which has a surface roughness Ra of 0.2 to 1.7 μm.

4. A composite plated product as set forth in claim 1 , which has a friction coefficient of not larger than 0.8.

5. A composite plated product as set forth in claim 1 , which further comprises a nickel-plating film formed between said composite plating film and said base material.

6. A terminal, the material of which is a composite plated product as set forth in claim 1 .

7. A composite plated product as set forth in claim 2 , which has a surface roughness Ra of 0.2 to 1.7 μm.

8. A composite plated product as set forth in claim 1 , which has a surface roughness Ra of 0.2 to 1.3 μm.

9. A composite plated product as set forth in claim 1 , wherein said composite plating layer is an outermost surface layer.

Assignees

• Dowa Metaltech Co Ltd

Inventors

• Kotani Hirotaka
• Kato Yukiya
• DOI Tatsuhiro
• Tomiya Takao
• Narieda Hiroto

Classifications

• C25D3/46 Primary

  of silver · CPC title

• C25D5/48

  After-treatment of electroplated surfaces · CPC title

• C25D7/00 Primary

  Electroplating characterised by the article coated · CPC title

• H01H1/023

  having a noble metal as the basic material · CPC title

• H01H1/027

  containing carbon particles or fibres · CPC title