Device housing with metallic luster

Patent metadata

Field	Value
Publication number	US-11920244-B2
Application number	US-201816982694-A
Country	US
Kind code	B2
Filing date	Jul 24, 2018
Priority date	Jul 24, 2018
Publication date	Mar 5, 2024
Grant date	Mar 5, 2024

Abstract

The application discloses examples of a device housing of an electronic device including a magnesium-alloy substrate. The device housing further including a treatment layer applied over the magnesium-alloy substrate and a metallic coating layer applied over the treatment layer to provide a metallic luster. Further, a paint coating layer is disposed over a first portion of the metallic coating layer. Further, a top coating layer is applied over the paint coating layer and a visible second portion of the metallic coating layer.

First claim

What is claimed is:

1. A device housing of an electronic device, comprising:
a magnesium-alloy substrate;
a treatment layer applied over the magnesium-alloy substrate, wherein the treatment layer is one of:
an oxide layer having a thickness in a range of from about 3 μm to about 15 μm; or
a passivation layer formed to obtain a non-metallic surface over the magnesium-alloy substrate, wherein the passivation layer has a thickness in a range of from about 1 μm to about 5 μm;

a metallic coating layer applied over the treatment layer to provide a metallic luster;
a paint coating layer disposed over a first portion of the metallic coating layer, wherein the paint coating layer comprises:
a clear coating layer applied over the metallic coating layer;
a primer coating layer applied over the clear coating layer; and
a base coating layer applied over the primer coating layer; and

a top coating layer applied over the paint coating layer and a visible second portion of the metallic coating layer.

2. The device housing as claimed in claim 1 , wherein the metallic coating layer is one of:
a non-conductive vacuum metallization (NCVM) coating having a thickness in a range of from about 30 nm to about 1 μm;
a physical vapor deposition (PVD) coating having a thickness in a range of from about 30 nm to about 1 μm; or
a vacuum metallization (VM) coating having a thickness in a range of from about 30 nm to about 1 μm.

3. The device housing as claimed in claim 2 , wherein the NCVM coating, the PVD coating, and the VM coating are made of a material selected from the group consisting of titanium, chromium, nickel, zinc, zirconium, manganese, copper, aluminum, tin, molybdenum, tantalum, tungsten, hafnium, gold, vanadium, silver, platinum, graphite, stainless steel, and alloy combinations thereof.

4. The device housing as claimed in claim 1 , wherein:
the clear coating layer has a thickness in a range of from about 10 μm to about 30 μm;
the primer coating layer has a thickness in a range of from about 5 μm to about 20 μm; and
the base coating layer has a thickness in a range of from about 10 μm to about 25 μm.

5. The device housing as claimed in claim 1 , wherein the clear coating layer includes optical polymers selected from the group consisting of polyacrylic, polycarbonate, cyclic olefin copolymer (COC), and combinations thereof.

6. The device housing as claimed in claim 1 , wherein the base coating layer is made of pigments including one of carbon black, titanium dioxide, clay, mica, talc, barium sulfate, calcium carbonate, synthetic pigment, metallic powder, aluminum oxide, an organic powder, an inorganic powder, graphene, graphite, plastic bead, color pigments, dyes, or combinations thereof.

7. The device housing as claimed in claim 1 , wherein:
the top coating layer has a thickness in a range of from about 10 μm to about 25 μm, and
the top coating layer includes resins selected from the group consisting of polyurethane, polycarbonate, urethane acrylates, ployacrylate, polystyrene, polyetheretherketone, polyesters, fluoropolymers, and combinations thereof.

8. An electronic device comprising a device housing to house different components of the electronic device, the device housing comprising:
a magnesium-alloy substrate;
a plurality of coating layers deposited over the magnesium-alloy substrate;
wherein the plurality of coating layers include at least a treatment layer, a metallic coating layer, a paint coating layer, and a top coating layer, wherein the treatment layer is applied over the magnesium-alloy substrate and is one of:
an oxide layer is having a thickness in a range of from about 3 μm to about 15 μm; or
a passivation layer formed to obtain a non-metallic surface over the magnesium-alloy substrate, wherein the passivation layer has a thickness in a range of from about 1 μm to about 5 μm;

wherein the metallic coating layer is applied over the treatment layer to provide a metallic luster;
wherein the paint coating layer comprises:
a clear coating layer applied over the metallic coating layer;
a primer coating layer applied over the clear coating layer; and
a base coating layer applied over the primer coating layer;

wherein the paint coating layer is disposed on a first portion of the metallic coating layer, and
the top coating layer is applied over the paint coating layer and a visible second portion of the metallic coating layer.

9. The electronic device as claimed in claim 8 , wherein:
the oxide layer is formed by a micro-arc oxidation (MAO) process using an electrolytic solution comprising electrolytes selected from the group consisting of sodium silicate, sodium phosphate, potassium fluoride, potassium hydroxide, sodium hydroxide, fluorozirconate, sodium hexametaphosphate, sodium fluoride, aluminum oxide, silicon dioxide, ferric ammonium oxalate, phosphoric acid salt, polyethylene oxide alkylphenolic ether, and combinations thereof; or
the passivation layer is formed by chemically treating a surface of the magnesium- alloy substrate with a passivation chemical to obtain a non-metallic surface over the magnesium-alloy substrate, wherein the passivation chemical is selected from the group consisting of molybdates, vanadates, phosphates, chromates, stannates, manganese salts, and combinations thereof.

10. The electronic device as claimed in claim 8 , wherein the plurality of coating layers further comprises:
a clear primer coating layer applied over the treatment layer, wherein the clear primer coating layer has a thickness in a range of from about 10 μm to about 30 μm; and
the metallic coating layer applied over the clear primer coating layer, wherein the metallic coating layer is one of:
a non-conductive vacuum metallization (NCVM) coating having a thickness in a range of from about 30 nm to about 1 μm;
a physical vapor deposition (PVD) coating having a thickness in a range of from about 30 nm to about 1 μm; or
a vacuum metallization (VM) coating having a thickness in a range of from about 30 nm to about 1 μm.

11. A method of forming a glossy surface on a device housing for an electronic device, the method comprising:
treating a magnesium-alloy substrate of the device housing to obtain a treatment layer over the magnesium-alloy substrate, wherein the treatment layer is one of:
an oxide layer having a thickness in a range of from about 3 μm to about 15 μm; or
a passivation layer formed to obtain a non-metallic surface over the magnesium-alloy substrate, wherein the passivation layer has a thickness in a range of from about 1 μm to about 5 μm;

applying a metallic coating layer over the treatment layer;
spray depositing a paint coating layer over the metallic coating layer, wherein the paint coating layer comprises:
a clear coating layer applied over the metallic coating layer;
a primer coating layer applied over the clear coating layer; and
a base coating layer applied over the primer coating layer;

cutting a part of the paint coating layer by one of diamond cutting and a laser cutting process to allow a portion of the metallic coating layer to be visible, to provide a metallic luster to the housing; and
applying a top coating layer over the paint coating layer and the second portion of the metallic coating layer.

12. The method as claimed in claim 11 , wherein the method comprises:
cutting an edge of the treatment layer and the magnesium-alloy substrate by a Computer Numeric Control (CNC) process using a diamond cutter, to form a chamfer having a glossy surface.

13. The method as claimed in claim 11 , wherein treating the magnesium-alloy substrate comprises one of:
oxidizing the mag

Assignees

• Hewlett Packard Development Co

Inventors

• Chang Chi-Hao
• Yeh Ya-Ting
• Wu Kuan-Ting
• Liao Chih-Hsiung

Classifications

• C23C28/345 Primary

  with at least one oxide layer · CPC title

• C23C14/16

  on metallic substrates or on substrates of boron or silicon · CPC title

• C23C28/322

  only coatings of metal elements only · CPC title

• C25D11/026

  Anodisation with spark discharge · CPC title

• C25D11/30

  of magnesium or alloys based thereon · CPC title