Lift-off process for manufacturing an organic light-emitting display apparatus

Patent metadata

Field	Value
Publication number	US-11917866-B2
Application number	US-202318161836-A
Country	US
Kind code	B2
Filing date	Jan 30, 2023
Priority date	Dec 3, 2019
Publication date	Feb 27, 2024
Grant date	Feb 27, 2024

Abstract

An organic light-emitting display apparatus includes: first and second pixel electrodes on a substrate, and spaced from each other; a pixel-defining film surrounding edges of the first and second pixel electrodes; a first intermediate layer on the first pixel electrode; a second intermediate layer on the second pixel electrode, spaced from the first intermediate layer; a first counter electrode on the first intermediate layer; a second counter electrode on the second intermediate layer, spaced from the first counter electrode; a first passivation layer on the first counter electrode; a second passivation layer on the second counter electrode, spaced from the first passivation layer; a first bank around the first passivation layer and protruding from the pixel-defining film to extend in a direction away from the substrate; and a second bank around the second passivation layer and protruding from the pixel-defining film to extend in the direction away from the substrate.

First claim

What is claimed is:

1. A method of manufacturing an organic light-emitting display apparatus, the method comprising:
forming, on a substrate, a pixel electrode and a pixel-defining film covering an edge of the pixel electrode;
forming, on the pixel-defining film, a bank protruding in a direction away from the substrate;
sequentially forming a liftoff layer and a photoresist on the pixel electrode, the pixel-defining film, and the bank;
forming an opening by patterning the liftoff layer and the photoresist, the opening exposing the pixel-defining film located on a top surface of the pixel electrode and within the bank;
sequentially depositing an intermediate layer comprising an emission layer, a counter electrode, and a passivation layer on the opening and the photoresist; and
removing a residue of the photoresist and the liftoff layer.

2. The method of claim 1 , wherein a thickness of the bank is less than a thickness of the liftoff layer.

3. The method of claim 1 , wherein an edge of the photoresist protrudes beyond an edge of the liftoff layer at the opening.

4. The method of claim 1 , wherein the photoresist is patterned by using a photolithography process.

5. The method of claim 1 , wherein the liftoff layer comprises a fluoropolymer.

6. The method of claim 5 , wherein the opening is formed by etching the liftoff layer by using a first solvent comprising fluorine.

7. The method of claim 5 , wherein the residue of the liftoff layer is removed by using a second solvent comprising fluorine.

8. The method of claim 1 , wherein the passivation layer is deposited by using a deposition process having better step coverage than a deposition process used for the intermediate layer and the counter electrode.

Assignees

• Samsung Display Co Ltd

Inventors

• Yang Yonghoon
• Ko Minsuk

Classifications

• H10K71/233

  by photolithographic etching · CPC title

• H10K50/84

  Passivation; Containers; Encapsulations · CPC title

• H10K71/221

  by lift-off techniques · CPC title

• H10K59/8731

  multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers · CPC title

• H10K59/80521

  characterised by their shape · CPC title