Integrated thermal-electrical component for power electronics converters

Patent metadata

Field	Value
Publication number	US-11917797-B2
Application number	US-202017110628-A
Country	US
Kind code	B2
Filing date	Dec 3, 2020
Priority date	Dec 3, 2019
Publication date	Feb 27, 2024
Grant date	Feb 27, 2024

Abstract

The disclosure relates to capacitive heatsink devices and systems. In one embodiment, the heat sink capacitor includes a positive (P) bus plate; a negative (N) bus plate; a first dielectric material; a second dielectric material; and a heat sink comprising a first side and a second side, the first side of the heat sink attached to the first dielectric material and the second dielectric material, wherein the first dielectric material and the second dielectric material are separated by a portion of the heat sink, wherein the first dielectric material electrically insulates the P bus plate from the first side of the heat sink to form a first capacitor, and wherein the second dielectric material electrically insulates the N bus plate from the first side of the heat sink to form a second capacitor.

First claim

What is claimed is:

1. A heat sink capacitor, the heat sink capacitor comprising:
a positive (P) bus, wherein the P bus is comprised of electrically conductive material;
a negative (N) bus, wherein the N bus is comprised of electrically conductive material;
a first dielectric material;
a second dielectric material; and
a heat sink comprising a first side and a second side, the first side of the heat sink attached to the first dielectric material and the second dielectric material, wherein the first dielectric material and the second dielectric material are separated by a portion of the heat sink, wherein the first dielectric material electrically insulates the P bus from the first side of the heat sink and the portion of the heat sink that separates the first dielectric material and the second dielectric material to form a first capacitor, and wherein the second dielectric material electrically insulates the N bus from the first side of the heat sink and the portion of the heat sink that separates the first dielectric material and the second dielectric material to form a second capacitor.

2. The heat sink capacitor of claim 1 , further comprising:
a printed circuit board;
a circuit component attached to the printed circuit board, wherein the circuit component is electrically connected to at least one of the P bus or the N bus and the printed circuit board is separated from the P bus and the N bus by a non-conductive or a semiconductive material.

3. The heat sink capacitor of claim 2 , wherein the circuit component is a switching component, and the switching component comprises a gallium nitride power transistor or a silicon carbide power transistor.

4. The heat sink capacitor of claim 1 , wherein the P bus and/or the N bus each comprise a bus plate and are configured to maximize a surface area of each of the bus plates, wherein the bus plates are each configured to include a plurality of fins.

5. The heat sink capacitor of claim 1 , wherein the first side of the heat sink is configured to maximize a surface area of the first side of the heat sink, wherein the first side of the heat sink includes a plurality of fins.

6. The heat sink capacitor of claim 1 , wherein the first dielectric material and the second dielectric material are selected from the group consisting of BaTiO 3 , barium strontium titanate, SrTiO 3 , and TiO 2 .

7. The heat sink capacitor of claim 6 , wherein the first dielectric material is not the same as the second dielectric material.

8. The heat sink capacitor of claim 2 , wherein the circuit component is a power semiconductor.

9. The heat sink capacitor of claim 1 , wherein the second side of the heat sink comprises a pin-fin heat sink whose geometry could be plate-fin, porous, and dendritic.

10. A power electronic converter system, the system comprising:
a printed circuit board;
a circuit component attached to the printed circuit board; and
a heat sink capacitor, wherein the heat sink capacitor comprises:
a positive (P) bus plate, wherein the P bus plate is comprised of electrically conductive material;
a negative (N) bus plate, wherein the N bus is comprised of electrically conductive material;
a first dielectric material;
a second dielectric material; and
a heat sink comprising a first side and a second side, the first side of the heat sink attached to the first dielectric material and the second dielectric material, wherein the first dielectric material and the second dielectric material are separated by a portion of the heat sink, wherein the first dielectric material electrically insulates the P bus plate from the first side of the heat sink and the portion of the heat sink that separates the first dielectric material and the second dielectric material to form a first capacitor, and wherein the second dielectric material electrically insulates the N bus plate from the first side of the heat sink and the portion of the heat sink that separates the first dielectric material and the second dielectric material to form a second capacitor.

11. The system of claim 10 , wherein the first dielectric material and/or the second dielectric material is selected from the group consisting of BaTiO 3 , barium strontium titanate, SrTiO 3 , and TiO 2 .

12. The system of claim 11 , wherein the circuit component is a switching component that is switched at a frequency of 1 MHz or greater.

13. The system of claim 12 , wherein the switching component is a gallium nitride power transistor.

14. The system of claim 11 , wherein the first dielectric material is not the same as the second dielectric material.

15. The system of claim 10 , wherein a capacitance of the heat sink capacitor is sufficient for the heat sink capacitor to act as a DC-link capacitor for the power electronic converter.

16. The system of claim 10 , wherein the P bus plate is attached to a first switching component, and the N bus plate is attached to a second switching component, and the printed circuit board is separated from the P bus plate and the N bus plate by a non-conductive or a semiconductive material.

17. The system of claim 10 , wherein the P bus plate and/or the N bus plate are configured to maximize a surface area of each of the bus plates, wherein each of the bus plates are configured to include a plurality of fins.

18. The system of claim 10 , wherein the first side of the heat sink is configured to maximize a surface area of the first side of the heat sink, wherein the first side of the heat sink includes a plurality of fins.

19. The system of claim 10 , wherein the circuit component is a power semiconductor.

20. The system of claim 10 , wherein the second side of the heat sink comprises a pin-fin heat sink whose geometry could be plate-fin, porous, and dendritic.

Assignees

• Univ Florida State Res Found Inc

Inventors

• Shi Yanjun
• Yang Sam

Classifications

• H10W40/228

  the projecting parts being wire-shaped or pin-shaped · CPC title

• H10W72/00

  Interconnections or connectors in packages · CPC title

• H10W40/10

  Arrangements for heating · CPC title

• H10W40/259

  Ceramics or glasses (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H05K7/209 Primary

  Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence) · CPC title