Method for manufacturing a camera module, camera module

Patent metadata

Field	Value
Publication number	US-11917274-B2
Application number	US-202117389965-A
Country	US
Kind code	B2
Filing date	Jul 30, 2021
Priority date	Aug 5, 2020
Publication date	Feb 27, 2024
Grant date	Feb 27, 2024

Abstract

A method for manufacturing a camera module. The method includes: a) mounting an image sensor on a circuit board, b) inserting and fixing the circuit board into a housing, c) aligning an objective lens accommodated in the housing and including an electrical interface with respect to the image sensor, d) fixing the objective lens in the housing. In step b) spring contacts, which are movable with respect to the circuit board, are inserted into the housing together with the circuit board and, in a step e), i.e., after the fixation of the objective lens in the housing, are brought into contact with the electrical interface with the aid of clamping and/or fixing elements.

First claim

What is claimed is:

1. A method for manufacturing a camera module, the method comprising:
a) mounting an image sensor on a circuit board;
b) inserting and fixing the circuit board into a housing, wherein spring contacts, which are movable with respect to the circuit board, are inserted into the housing together with the circuit board;
c) aligning an objective lens accommodated in the housing and including an electrical interface with respect to the image sensor;
d) fixing the objective lens in the housing; and
e) bringing, after the fixation of the objective lens in the housing, the spring contacts into contact with the electrical interface using clamping and/or fixing elements;
wherein the spring contacts are held in a movable manner, movable in a radial direction, at the circuit board via holding elements at least during steps b) through d), and
wherein a free space between the holding elements and the housing is used after the fixing of the objective lens in the housing for accommodating the clamping elements and/or fixing elements, which are inserted into the free space from the outside, so as to press and swivel the holding elements, including the spring contacts, radially inward, so that the spring contacts rest against contact surfaces of the electrical interface formed at the objective lens.

2. The method as recited in claim 1 , wherein the spring contacts are situated at opposite sides of the circuit board relative to one another and are brought into contact with two contact surfaces of the electrical interface, which are diametrically opposite one another at the objective lens on the outer circumference.

3. The method as recited in claim 1 , wherein in a step further comprising:
f) inserting a cover part, including a seal, into the housing, the seal being utilized for axially preloading and securing the position of the clamping elements, and/or fixing elements, and/or the holding elements.

4. The method as recited in claim 1 , wherein in step d) the objective lens is fixed in the housing using an adhesive bond.

5. The method as recited in claim 4 , wherein the adhesive bond is thermally cured.

6. A camera module, comprising:
a housing, wherein a circuit board, including an image sensor, which is inserted into and fixed in the housing;
an objective lens including an electrical interface, which is also inserted into the housing, aligned with respect to the image sensor, and fixed in the housing; and
clamping and/or fixing elements, which are situated between the housing and the circuit board, which act via holding elements upon spring contacts, so that the spring contacts are held in contact with the circuit board and in contact with the electrical interface;
wherein the spring contacts are held in a movable manner, movable in a radial direction, at the circuit board via the holding elements, and
wherein a free space between the holding elements and the housing is used after the fixing of the objective lens in the housing for accommodating the clamping elements and/or fixing elements, which are inserted into the free space from the outside, so as to press and swivel the holding elements, including the spring contacts, radially inward, so that the spring contacts rest against contact surfaces of the electrical interface formed at the objective lens.

7. The camera module as recited in claim 6 , wherein the spring contacts are situated diametrically opposite one another at the objective lens and rest against contact surfaces formed at the objective lens on an outer circumference, which form the electrical interface of the objective lens.

8. The camera module as recited in claim 6 , wherein the housing is closed by a cover part and an annular seal is situated between the cover part and the clamping and/or fixing elements, by which the clamping and/or fixing elements are preloaded in an axial direction.

9. The camera module as recited in claim 6 , wherein the objective lens is connected to the housing via an adhesive bond.

Assignees

• Bosch Gmbh Robert

Inventors

• Brinks Gerald
• Escher Guenter
• Pohl Matthias
• Diesel Peter

Classifications

• H04N23/51 Primary

  Housings · CPC title

• G02B7/022

  lens and mount having complementary engagement means, e.g. screw/thread · CPC title

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H04N23/57

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

• H05K3/30

  Assembling printed circuits with electric components, e.g. with resistors · CPC title