Ceramic component and method for manufacturing the ceramic component

Patent metadata

Field	Value
Publication number	US-11916236-B2
Application number	US-202017042718-A
Country	US
Kind code	B2
Filing date	Mar 19, 2020
Priority date	Apr 9, 2019
Publication date	Feb 27, 2024
Grant date	Feb 27, 2024

Abstract

A ceramic component and a method for manufacturing a ceramic component are disclosed. In an embodiment a ceramic component includes a ceramic base body and at least one metallization located an outer surface of the ceramic base body, wherein the metallization contains lithium vanadium phosphate having the general chemical formula Li x V y (PO 4 ) z , copper and glass, wherein a is a proportion of copper, b is a proportion of lithium vanadium phosphate and c is a proportion of glass which is contained in the metallization, wherein the following applies: 40 wt. %≤a≤99 wt. %, 1 wt. %≤b≤30 wt. %, 0 wt. %≤c≤20 wt. %, wherein x is a proportion of lithium, y is a proportion of vanadium and z is a proportion of phosphate in lithium vanadium phosphate, and wherein the following applies: 0<x, 0<y, 0<z.

First claim

The invention claimed is:

1. A ceramic component comprising:
a ceramic base body; and
at least one metallization located an outer surface of the ceramic base body,
wherein the metallization contains lithium vanadium phosphate having the general chemical formula Li x V y (PO 4 ) z , copper and optionally glass,
wherein a is a proportion of copper, b is a proportion of lithium vanadium phosphate and c is a proportion of the optional glass, which is contained in the metallization,
wherein the following applies:
40 wt. %≤a≤99 wt. %,
1 wt. %≤b≤30 wt. %, and
0 wt. %≤c≤20 wt. %,
wherein x is a proportion of lithium, y is a proportion of vanadium and z is a proportion of phosphate in lithium vanadium phosphate, and
wherein the following applies:
0<x,
0<y, and
0<z.

2. The ceramic component according to claim 1 ,
wherein lithium vanadium phosphate having the general chemical formula Li x V y (PO 4 ) z , copper and glass or lithium vanadium phosphate having the general chemical formula Li x V y (PO 4 ) z and copper have been used as the parent substances for the metallization, and
wherein, in the general chemical formula of the lithium vanadium phosphate, the following applies:
0.5<x<4.5,
1.8<y<2.2, and
2.8<z<3.2.

3. The ceramic component according to claim 1 , wherein the metallization has been manufactured from a metal-containing paste which contains copper and lithium vanadium phosphate and glass or copper and lithium vanadium phosphate.

4. The ceramic component according to claim 1 , wherein the ceramic component is a ceramic battery.

5. The ceramic component according to claim 1 , wherein the metallization is a connecting surface for electrical contacting of the ceramic component.

6. The ceramic component according to claim 1 , wherein the metallization has at least one top layer containing at least copper and/or nickel and/or tin.

7. The ceramic component according to claim 1 , wherein the ceramic component is a solderable surface mounted device.

8. A method for manufacturing a ceramic component, the method comprising:
providing a green body;
rounding edges of the green body;
affixing a metal-containing paste to at least one outer surface of the green body; and
sintering the green body in order to obtain the ceramic base body with a metallization on the outer surface,
wherein the metal-containing paste contains copper, lithium vanadium phosphate, optionally glass, binding agents and solvents,
wherein a is a proportion of the copper, b is a proportion of the lithium vanadium phosphate, c is a proportion of the optional glass, and d is a proportion of the binding agents and the solvents,
wherein the following applies:
40 wt. %≤a≤90 wt. %,
1 wt. %≤b≤30 wt. %,
0 wt. %≤c≤20 wt. %, and
9 wt. %≤d≤59 wt. %,
wherein lithium vanadium phosphate of the metallization has the general chemical formula Li x N y (PO 4 ),
wherein x is a proportion of lithium, y is a proportion of vanadium and z is a proportion of phosphate in lithium vanadium phosphate, and
wherein the following applies:
0<x,
0<y, and
0<z.

9. The method according to claim 8 , further comprising performing a thermal process, wherein the thermal process is sintering, and wherein the thermal process is performed in a reductive atmosphere.

10. The method according to claim 8 , wherein at least one top layer containing copper and/or tin and/or nickel is affixed to the metallization.

11. The method according to claim 8 , further comprising performing a thermal process, wherein the thermal process is a burning-in process, and wherein the thermal process is performed in a reductive atmosphere.

12. The method according to claim 8 , further comprising performing a thermal process, wherein the thermal process comprises sintering and a burning-in process, and wherein the thermal process is performed in a reductive atmosphere.

13. A method for manufacturing a ceramic component, the method comprising:
providing a green body;
sintering the green body in order to obtain a ceramic base body;
rounding edges of the ceramic base body;
affixing a metal-containing paste to at least one outer surface of the ceramic base body; and
burning the metal-containing paste into the ceramic base body in order to obtain a metallization,
wherein the metal-containing paste contains copper, lithium vanadium phosphate, optionally glass, binding agents and solvents,
wherein a is a proportion of the copper, b is a proportion of the lithium vanadium phosphate, c is a proportion of the optional glass, d is a proportion of the binding agents and solvents,
wherein the following applies:
40 wt. %≤a≤90 wt. %,
1 wt. %≤b≤30 wt. %,
0 wt. %≤c≤20 wt. %, and
9 wt. %≤d≤59 wt. %,
wherein lithium vanadium phosphate of the metallization has the general chemical formula Li x N y (PO 4 ),
wherein x is a proportion of lithium, y is a proportion of vanadium and z is a proportion of phosphate in lithium vanadium phosphate, and
wherein the following applies:
0<x,
0<y, and
0<z.

14. The method according to claim 13 , wherein at least one thermal process is selected from the group consisting of sintering and a burning-in process, and wherein the thermal process is performed in a reductive atmosphere.

15. The method according to claim 13 , wherein at least one top layer containing copper and/or tin and/or nickel is affixed to the metallization.

Assignees

• Tdk Electronics Ag

Inventors

• Obermair Stefan
• Wang Yongli
• Egger Andreas
• Schweinzger Manfred

Classifications

• H01M4/5825 Primary

  Oxygenated metallic salts or polyanionic structures, e.g. borates, phosphates, silicates, olivines · CPC title

• H01G4/2325 Primary

  characterised by the material of the terminals · CPC title

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

• H01G4/228

  Terminals · CPC title

• H01G4/232

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title