Multilayer ceramic electronic component

Patent metadata

Field	Value
Publication number	US-11915877-B2
Application number	US-202318124019-A
Country	US
Kind code	B2
Filing date	Mar 21, 2023
Priority date	Dec 25, 2019
Publication date	Feb 27, 2024
Grant date	Feb 27, 2024

Abstract

A multilayer ceramic electronic component includes a multilayer body and an external electrode on each of both end surfaces of the multilayer body. The external electrode includes an underlying electrode layer and a plating layer that is disposed on the underlying electrode layer. The underlying electrode layer includes Ni as a first metal component, Sn as a second metal component, and a ceramic material, and includes an alloy portion that is provided around the ceramic material and includes an alloyed Ni defining the first metal component and an alloyed Sn defining the second metal component.

First claim

What is claimed is:

1. A multilayer ceramic electronic component comprising:
a multilayer body including a plurality of first and second ceramic layers that are stacked, a first main surface and a second main surface that face each other in a height direction, a first side surface and a second side surface that face each other in a width direction orthogonal or substantially orthogonal to the height direction, and a first end surface and a second end surface that face each other in a length direction orthogonal or substantially orthogonal to the height direction and the width direction;
a first internal electrode layer on each of the first ceramic layers and exposed on the first end surface;
a second internal electrode layer on each of the second ceramic layers and exposed on at least one surface of the second end surface, the first side surface, and the second side surface;
a first external electrode connected to the first internal electrode layer and disposed on the first end surface; and
a second external electrode connected to the second internal electrode layer and disposed on the at least one surface on which the second internal electrode layer is exposed; wherein
the first external electrode includes a first underlying electrode layer and a plurality of first plating layers located on the first underlying electrode layer;
the second external electrode includes a second underlying electrode layer and a plurality of second plating layers located on the second underlying electrode layer; and
the first underlying electrode layer and the second underlying electrode layer each include Ni as a first metal component, Sn as a second metal component, and a ceramic material; and
each of the first and second underlying electrode layers includes an alloy portion that is provided around the ceramic material and includes an alloyed Ni as the first metal component and an alloyed Sn as the second metal component.

2. The multilayer ceramic electronic component according to claim 1 , wherein the ceramic material in each of the first underlying electrode layer and the second underlying electrode layer includes at least one selected from BaTiO 3 , CaTiO 3 , SrTiO 3 , and CaZrO 3 .

3. The multilayer ceramic electronic component according to claim 1 , wherein
the first internal electrode layer and the second internal electrode layer each include Ni as a third metal component and Sn as a fourth metal component; and
each of the first and second electrode layers includes a portion including an alloyed Ni defining the third metal component and an alloyed Sn defining the fourth metal component.

4. The multilayer ceramic electronic component according to claim 1 , further comprising:
a third external electrode provided on the first side surface; and
a fourth external electrode provided on the second side surface.

5. The multilayer ceramic electronic component according to claim 1 , wherein the multilayer body includes corners and ridges that are rounded.

6. The multilayer ceramic electronic component according to claim 1 , wherein the multilayer body has a dimension in the length direction of about 0.2 mm or more and about 10.0 mm or less, a dimension in the width direction of about 0.1 mm or more and about 10.0 mm or less, and a dimension in the height direction of about 0.1 mm or more and about 5.0 mm or less.

7. The multilayer ceramic electronic component according to claim 1 , wherein each of the plurality of first and second ceramic layers includes at least one of BaTiO 3 , CaTiO 3 , SrTiO 3 , CaZrO 3 as a main component.

8. The multilayer ceramic electronic component according to claim 7 , wherein each of the plurality of first and second ceramic layers further includes at least one of an Mn compound, an Fe compound, a Cr compound, a Co compound, or an Ni compound as a sub-component.

9. The multilayer ceramic electronic component according to claim 1 , wherein a thickness of each of the plurality of first and second ceramic layers has a thickness of about 0.4 μm or more and about 10.0 μm or less.

10. The multilayer ceramic electronic component according to claim 1 , wherein
the first internal electrode layer includes a first facing electrode portion that faces the second internal electrode layer, and a first extending electrode portion on one end side of the first internal electrode portion and extending to the first end surface of the multilayer body; and
the second internal electrode layer includes a second facing electrode portion that faces the first internal electrode layer, and a second extending electrode portion on one end side of the second internal electrode portion and extending to the at least one surface on which the second internal electrode layer is exposed of the multilayer body.

11. The multilayer ceramic electronic component according to claim 1 , wherein each of the first and second internal electrode layers includes at least one of Ni, Cu, Ag, Pd, or Au, or an alloy including at least one of Ni, Cu, Ag, Pd, or Au.

12. The multilayer ceramic electronic component according to claim 1 , wherein a thickness of each of the first and second internal electrode layers is about 0.2 μm or more and about 2.0 μm or less.

13. The multilayer ceramic electronic component according to claim 1 , wherein
the first underlying electrode layer is disposed on the first end surface of the multilayer body; and
the second underlying electrode layer is disposed on the second end surface of the multilayer body.

14. The multilayer ceramic electronic component according to claim 13 , wherein a maximum thickness of each of the first and second underlying electrode layers is about 3 μm or more and about 160 μm or less.

15. The multilayer ceramic electronic component according to claim 1 , wherein the ceramic material in each of the first and second underlying electrode layers includes ceramic particles.

16. The multilayer ceramic electronic component according to claim 1 , wherein
in each of the first and second underlying electrode layers:
a sum of the Ni in the first metal component and the Sn in the second metal component is about 100 mol;
a content of the Sn is about 0.001 mol or more and about 0.1 mol or less; and
a content of the ceramic material is about 5% or more and about 50% or less of an entire volume of the first and second underlying electrode layers.

17. The multilayer ceramic electronic component according to claim 1 , wherein the ceramic material in each of the first and second underlying electrode layers includes at least one of BaTiO 3 , CaTiO 3 , SrTiO 3 , or CaZrO 3 .

Assignees

• Murata Manufacturing Co

Inventors

• Kanzaki Taisuke
• Onishi Kosuke
• Doi Akitaka

Classifications

• H01G4/248 Primary

  the terminals embracing or surrounding the capacitive element, e.g. caps (H01G4/252 takes precedence) · CPC title

• H01G4/008 Primary

  Selection of materials · CPC title

• H01G4/012

  Form of non-self-supporting electrodes · CPC title

• H01G4/1227

  based on alkaline earth titanates · CPC title

• H01G4/232

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title