Repositionable radio frequency identification device

Patent metadata

Field	Value
Publication number	US-11915080-B2
Application number	US-202017631517-A
Country	US
Kind code	B2
Filing date	Jul 30, 2020
Priority date	Jul 30, 2019
Publication date	Feb 27, 2024
Grant date	Feb 27, 2024

Abstract

An adjustable and repositionable RFID inlay is described herein. The RFID inlay comprises: a) a substrate having a first side and a second side; b) an antenna at least partially disposed on the first side of the substrate, and c) an RFID chip at least partially disposed on the first side of the substrate; wherein a first adhesive is at least partially disposed on the RFID inlay; and wherein a second adhesive is at least partially disposed on the RFID inlay. The second adhesive is an activatable adhesive. Also described herein is a method of positioning an RFID inlay with a first adhesive and a second adhesive where the second adhesive is an activatable adhesive. The method may further comprise repositioning the RFID inlay prior to activating the second adhesive to at least partially affix the RFID inlay to the object.

First claim

What is claimed is:

1. A RFID inlay, comprising:
a substrate having a first side and a second side;
an antenna at least partially disposed on the first side of the substrate, and
an RFID chip at least partially disposed on the first side of the substrate,
wherein the RFID inlay has a first side and a second side,
wherein the first side of the RFID inlay is the first side of the substrate, and the second side of the RFID inlay is the second side of the substrate,
wherein a first adhesive is at least partially disposed on the first side of the RFID inlay,
wherein a second adhesive is at least partially disposed on the second side of the RFID inlay, and
wherein the first adhesive is a pressure sensitive adhesive and the second adhesive is an activatable adhesive.

2. The RFID inlay of claim 1 , wherein the substrate comprises wood, textiles, plastic, paper, glass, metal, composites, or combinations thereof.

3. The RFID inlay of claim 1 , wherein the substrate is continuous.

4. The RFID inlay of claim 1 , wherein the antenna is comprised of a non-metallic conductor, a metal wire, a metal foil, a printed metallic ink, or combinations thereof.

5. The RFID inlay of claim 4 , wherein the non-metallic conductor is comprised of graphene.

6. The RFID inlay of claim 4 , wherein the metal wire, the metal foil, the printed metallic ink, or combinations thereof is comprised of silver, copper, aluminum, nickel, tin-bismuth, and combinations thereof.

7. The RFID inlay of claim 1 , wherein the first adhesive is a temporary adhesive.

8. The RFID inlay of claim 1 , wherein the first adhesive is at least partially patterned.

9. The RFID inlay of claim 1 , wherein the first adhesive is continuous.

10. The RFID inlay of claim 1 , wherein the first adhesive is comprised of a rubber adhesive, a silicone adhesive, an acrylic adhesive, an epoxy adhesive, a urethane adhesive, or combinations thereof.

11. The RFID inlay of claim 1 , wherein the first adhesive is at least partially disposed on the antenna and the RFID chip.

12. The RFID inlay of claim 1 , wherein the activatable adhesive is activated by heat, IR, UV, or combinations thereof.

13. The RFID inlay of claim 1 , wherein the second adhesive is at least partially bonded to an object.

14. The RFID inlay of claim 13 , wherein the object comprises wood, textiles, plastic, paper, glass, metal, composites, or combinations thereof.

15. The RFID inlay of claim 1 , wherein the second adhesive is at least partially patterned.

16. The RFID inlay of claim 1 , wherein the second adhesive is continuous.

17. The RFID inlay of claim 1 , wherein the second adhesive is comprised of a rubber adhesive, a silicone adhesive, an acrylic adhesive, an epoxy adhesive, a urethane adhesive, or combinations thereof.

18. The RFID inlay of claim 1 , where the RFID inlay is used in an RFID tag.

19. The RFID inlay of claim 1 , where the RFID inlay is used in an RFID label.

20. The RFID inlay of claim 1 , where the RFID inlay is repositionable.

21. A method of positioning an RFID inlay comprising the steps of:
positioning an RFID inlay onto an object, wherein the RFID inlay comprises:
a substrate having a first side and a second side;
an antenna at least partially disposed on the first side of the substrate; and
an RFID chip at least partially disposed on the first side of the substrate,
wherein the RFID inlay has a first side and a second side,
wherein the first side of the RFID inlay is the first side of the substrate, and the second side of the RFID inlay is the second side of the substrate,
wherein a first adhesive is at least partially disposed on the first side of the RFID inlay[H] the first adhesive being a pressure sensitive adhesive, and
wherein a second adhesive is at least partially disposed on the second side of the RFID inlay, the second adhesive being an activatable adhesive; and

activating the second adhesive to at least partially affix the RFID inlay to the object.

22. The method of claim 21 , wherein the object comprises wood, textiles, plastic, paper, glass, metal, composites, or combinations thereof.

23. The method of claim 21 , wherein the substrate comprises wood, textiles, plastic, paper, glass, metal, composites, or combinations thereof.

24. The method of claim 21 , wherein the substrate is continuous.

25. The method of claim 21 , wherein the antenna is comprised of non-metallic conductor, a metal wire, a metal foil, a printed metallic ink, or combinations thereof.

26. The method of claim 25 , wherein the non-metallic conductor is comprised of graphene.

27. The method of claim 25 , wherein the metal wire, the metal foil, the printed metallic ink, or combinations thereof is comprised of silver, copper, aluminum, nickel, tin-bismuth, and combinations thereof.

28. The method of claim 21 , wherein the first adhesive is a temporary adhesive.

29. The method of claim 21 , wherein the first adhesive is at least partially patterned.

30. The method of claim 21 , wherein the first adhesive is continuous.

31. The method of claim 21 , wherein the first adhesive is comprised of a rubber adhesive, a silicone adhesive, an acrylic adhesive, an epoxy adhesive, a urethane adhesive, or combinations thereof.

32. The method of claim 21 , wherein the first adhesive is at least partially disposed on the antenna and the RFID chip.

33. The method of claim 21 , wherein the activatable adhesive is activated by heat, IR, UV, or combinations thereof.

34. The method of claim 21 , wherein the second adhesive is at least partially bonded to the object.

35. The method of claim 21 , wherein the second adhesive is at least partially patterned.

36. The method of claim 21 , wherein the second adhesive is continuous.

37. The method of claim 21 , wherein the second adhesive is comprised of a rubber adhesive, a silicone adhesive, an acrylic adhesive, an epoxy adhesive, a urethane adhesive, or combinations thereof.

38. The method of claim 21 , where the RFID inlay is used in an RFID tag.

39. The method of claim 21 , where the RFID inlay is used in an RFID label.

40. The method of claim 21 , further comprising repositioning the RFID inlay prior to activating the second adhesive.

Assignees

• Avery Dennison Retail Information Services Llc

Inventors

• De Backer Mathieu

Classifications

• G06K19/0723 Primary

  the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs · CPC title

• G06K19/07758

  arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag · CPC title

• G06K19/07773

  Antenna details (antennas for wireless devices, e.g. RFID tags, in general H01Q1/22) · CPC title

• G06K19/07722 Primary

  the record carrier being multilayered, e.g. laminated sheets (flat articles in general, see B32B37/00) · CPC title

• G06K19/0776

  the adhering arrangement being a layer of adhesive, so that the record carrier can function as a sticker · CPC title