US11913819B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11913819-B2 |
| Application number | US-201817265966-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 16, 2018 |
| Priority date | Aug 16, 2018 |
| Publication date | Feb 27, 2024 |
| Grant date | Feb 27, 2024 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
An EMI resistant electronics enclosure (200) is provided having a first compartment (206) and a second compartment (207), each defined by a body (205), being separated by a septum (208). A first aperture (209) in the septum (208) connects the first compartment (206) and the second compartment (207). A feed-through element (210) is provided having a first interface region (211) and a second interface region (212), wherein one or more primary conductors (217) extend between the first interface region (211) and the second interface region (212), and wherein the first interface region (211) resides in the first compartment (206), and the second interface region (212) resides in the second compartment (207). A conductive bar (232) circumscribes at least a portion of the feed-through element (210), and a conductive gasket (220) extends from the body (205) to the conductive bar (232), wherein a ground path is formed between the body (205) and the conductive bar (232) with the conductive gasket (220).
Opening claim text (preview).
What is claimed is: 1. An EMI resistant electronics enclosure ( 200 ), comprising: a first compartment ( 206 ) defined by a body ( 205 ); a second compartment ( 207 ) defined by the body ( 205 ); a septum ( 208 ) between the first compartment ( 206 ) and the second compartment ( 207 ); a first aperture ( 209 ) with the septum ( 208 ) that connects the first compartment ( 206 ) and the second compartment ( 207 ); a feed-through element ( 210 ) comprising a first interface region ( 211 ) and a second interface region ( 212 ), wherein one or more primary conductors ( 217 ) extend between the first interface region ( 211 ) and the second interface region ( 212 ), and wherein the first interface region ( 211 ) resides in the first compartment ( 206 ), and the second interface region ( 212 ) resides in the second compartment ( 207 ); a conductive bar ( 232 ) that circumscribes at least a portion of the feed-through element ( 210 ); a conductive gasket ( 220 ) that extends from the body ( 205 ) to the conductive bar ( 232 ), wherein a ground path is formed between the body ( 205 ), the conductive bar ( 232 ) with the conductive gasket ( 220 ) and a flexible member ( 230 ) comprising secondary internal conductors that are in electrical communication with the primary conductors ( 217 ); an EMI shield ( 231 ) formed as an outer layer of the flexible member ( 230 ) that surrounds the secondary conductors of the flexible member ( 230 ). 2. The EMI resistant electronics enclosure ( 200 ) of claim 1 , wherein the EMI shield ( 231 ) is in electrical contact with the conductive bar ( 232 ). 3. The EMI resistant electronics enclosure ( 200 ) of claim 1 , wherein the EMI shield ( 231 ) is in electrical contact with a secondary PCB ( 240 ) disposed in the second compartment ( 207 ). 4. The EMI resistant electronics enclosure ( 200 ) of claim 3 , wherein the secondary PCB ( 240 ) comprises a conductive connection point ( 241 ), and wherein the conductive connection point ( 241 ) is in electrical contact with the EMI shield ( 231 ). 5. The EMI resistant electronics enclosure ( 200 ) of claim 4 , wherein the conductive connection point ( 241 ) is grounded. 6. The EMI resistant electronics enclosure ( 200 ) of claim 1 , wherein the feed-through element ( 210 ) comprises a printed circuit board. 7. The EMI resistant electronics enclosure ( 200 ) of claim 1 , wherein the gasket ( 220 ) comprises a conductive fabric. 8. A method of forming an EMI resistant electronics enclosure ( 200 ), with the method comprising: providing a body ( 205 ) comprising a first compartment ( 206 ) and a second compartment ( 207 ); separating the first compartment ( 206 ) and the second compartment ( 207 ) with a septum ( 208 ); placing a first aperture ( 209 ) in the septum ( 208 ) that connects the first compartment ( 206 ) and the second compartment ( 207 ); inserting a feed-through element ( 210 ) through the first aperture ( 209 ) and cavity ( 225 ), wherein the feed-through element ( 210 ) comprises a first interface region ( 211 ) and a second interface region ( 212 ), wherein one or more primary conductors ( 217 ) extend between the first interface region ( 211 ) and the second interface region ( 212 ), and wherein the first interface region ( 211 ) resides in the first compartment ( 206 ), and the second interface region ( 212 ) resides in the second compartment ( 207 ); placing a conductive bar ( 232 ) around at least a portion of the feed-through element ( 210 ); installing a conductive gasket ( 220 ) between the body ( 205 ) and the conductive bar ( 232 ), to form a conductive path therebetween and electrically connecting secondary internal conductors of a flexible member ( 230 ) to the primary conductors ( 217 ); and surrounding the secondary conductors of the flexible member ( 230 ) with an EMI shield ( 231 ). 9. The method of forming an EMI resistant electronics enclosure ( 200 ) of claim 8 , wherein the feed-through element ( 210 ) comprises a printed circuit board. 10. The method of forming an EMI resistant electronics enclosure ( 200 ) of claim 8 , wherein the gasket ( 220 ) comprises a conductive fabric. 11. The method of forming an EMI resistant electronics enclosure ( 200 ) of claim 8 , comprising the step of placing the EMI shield ( 231 ) in electrical contact with the conductive bar ( 232 ). 12. The method of forming an EMI resistant electronics enclosure ( 200 ) of claim 8 , comprising the step of electrically connecting the EMI shield ( 231 ) with a secondary PCB ( 240 ) disposed in the second compartment ( 207 ). 13. The method of forming an EMI resistant electronics enclosure ( 200 ) of claim 12 , comprising the step of placing a conductive connection point ( 241 ) of the secondary PCB ( 240 ) in electrical contact with the EMI shield ( 231 ).
Casings, e.g. of special material · CPC title
exciters · CPC title
detectors · CPC title
signal processing · CPC title
with multiple measuring conduits · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.