Package accommodating heat dissipation substrate and packing box

US11912489B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11912489-B2
Application numberUS-201917292473-A
CountryUS
Kind codeB2
Filing dateNov 6, 2019
Priority dateNov 14, 2018
Publication dateFeb 27, 2024
Grant dateFeb 27, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A plurality of heat dissipation substrates stacked on each other, intermediate sheets disposed under a lowermost heat dissipation substrate, on an uppermost heat dissipation substrate, and between heat dissipation substrates adjacent to each other, a drying agent disposed over or under the plurality of heat dissipation substrates, and a bag that seals the plurality of heat dissipation substrates, the plurality of intermediate sheets, and the drying agent.

First claim

Opening claim text (preview).

The invention claimed is: 1. A package comprising: a plurality of heat dissipation substrates stacked on each other; intermediate sheets disposed under a lowermost heat dissipation substrate, on an uppermost heat dissipation substrate, and between heat dissipation substrates adjacent to each other; a sheet drying agent disposed over or under the plurality of heat dissipation substrates; and a bag that seals the plurality of heat dissipation substrates, the plurality of intermediate sheets, and the sheet drying agent in a stacked state. 2. The package according to claim 1 , wherein a water vapor permeability of the bag, which is measured in accordance with JIS Z 0222: 1959, is equal to or more than 0.1 g/m 2 ·day and equal to or less than 15.0 g/m 2 ·day. 3. The package according to claim 1 , wherein an oxygen permeability of the bag, which is measured in accordance with JIS K 7126-2: 2006, is equal to or more than 0.1 cm 3 /(m 2 ·24 h·atm) and equal to or less than 50.0 cm 3 /(m 2 ·24 h·atm). 4. The package according to claim 1 , wherein the heat dissipation substrate is a plate-like substrate made of a metal-silicon carbide composite in which a silicon carbide porous material is impregnated with metal containing any one of aluminum and magnesium. 5. The package according to claim 1 , wherein the bag is made of an aluminum laminated film. 6. The package according to claim 1 , wherein the intermediate sheet is a paper-based base material. 7. The package according to claim 1 , wherein the intermediate sheet disposed on the uppermost heat dissipation substrate covers side surfaces of at least one heat dissipation substrate. 8. The package according to claim 1 , wherein the number of the heat dissipation substrates laminated is equal to or more than two and equal to or less than six. 9. The package according to claim 1 , wherein an end portion of the bag is heat-sealed. 10. The package according to claim 1 , wherein the bag seals the plurality of heat dissipation substrates, the plurality of intermediate sheets, and the sheet drying agent in a vacuum state. 11. A packing box comprising: a plurality of the packages according to claim 1 ; and a cushioning material provided in at least a part of a periphery of the packages in the packing box.

Assignees

Inventors

Classifications

  • B65D81/268Primary

    the absorber being enclosed in a small pack, e.g. bag, included in the package · CPC title

  • the articles being substantially flat panels, e.g. wooden planks · CPC title

  • with one or several rigid inserts · CPC title

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Frequently asked questions

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What does patent US11912489B2 cover?
A plurality of heat dissipation substrates stacked on each other, intermediate sheets disposed under a lowermost heat dissipation substrate, on an uppermost heat dissipation substrate, and between heat dissipation substrates adjacent to each other, a drying agent disposed over or under the plurality of heat dissipation substrates, and a bag that seals the plurality of heat dissipation substrate…
Who is the assignee on this patent?
Denka Company Ltd
What technology area does this patent fall under?
Primary CPC classification B65D81/268. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Feb 27 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).