Systems for thermal forming an object

Patent metadata

Field	Value
Publication number	US-11911929-B2
Application number	US-202218066840-A
Country	US
Kind code	B2
Filing date	Dec 15, 2022
Priority date	Apr 13, 2011
Publication date	Feb 27, 2024
Grant date	Feb 27, 2024

Abstract

Systems for thermal forming an object are provided. In some embodiments, a system for thermal forming an object using a mold includes one or more processors, and memory including instructions that, when executed by the one or more processors, cause the system to perform the following operations: receiving a mold identifier identifying the mold; determining mold process information for forming the object based on the mold identifier; inserting a material into a heating area, the material having a geometry selected based on the mold process information; heating the material using one or more independently controllable heat sources; and forming the object by disposing the heated material over or into at least a portion of the mold.

First claim

We claim:

1. A system for thermal forming an object using a mold, the system comprising:
one or more processors; and
memory comprising instructions that, when executed by the one or more processors, cause the system to perform operations comprising:
receiving a mold identifier identifying the mold,
determining mold process information for forming the object based on the mold identifier,
inserting a material into a heating area, the material having a geometry selected based on the mold process information,
heating the material using a plurality of independently controllable heat sources, wherein heating the material comprises using the plurality of independently controllable heat sources to heat a plurality of different portions of the material, and wherein at least some of the different portions overlap each other; and
forming the object by disposing the heated material over or into at least a portion of the mold.

2. The system of claim 1 , wherein the geometry comprises a shape or thickness of the material.

3. The system of claim 1 , wherein the mold process information comprises heating information, and wherein the operations further comprise controlling the plurality of independently controllable heat sources based on the heating information.

4. The system of claim 3 , wherein controlling the plurality of independently controllable heat sources comprises controlling one or more of an output or a heat direction of the plurality of independently controllable heat sources.

5. The system of claim 4 , wherein controlling the heat direction comprises controlling an orientation of at least one of the plurality of independently controllable heat sources.

6. The system of claim 3 , wherein the heating information comprises one or more of: a desired heating temperature at one or more portions of the material, a desired heating time at one or more portions of the material, or a maximum heating temperature at one or more portions of the material.

7. The system of claim 1 , wherein the operations further comprise monitoring a temperature of the material during heating.

8. The system of claim 7 , wherein the operations further comprise controlling the plurality of independently controllable heat sources based on the monitored temperature so as to heat one or more portions of the material to a respective desired temperature.

9. The system of claim 1 , wherein the object comprises an orthodontic shell appliance.

10. A thermoforming system comprising:
one or more processors; and
memory comprising instructions that, when executed by the one or more processors, cause the system to perform operations comprising:
receiving a mold identifier associated with a mold,
determining mold process information for forming an object based on the mold identifier,
heating a material using a plurality of heat sources according to the mold process information, wherein heating the material comprises using the plurality of heat sources to heat a plurality of different portions of the material, and wherein at least some of the different portions overlap each other; and
forming the object by disposing the heated material over or into at least a portion of the mold.

11. The thermoforming system of claim 10 , wherein the operations further comprise:
monitoring a temperature of the material during heating, and
controlling the plurality of heat sources based on the monitored temperature.

12. The thermoforming system of claim 11 , wherein the temperature is monitored using a plurality of temperature sensors, and each temperature sensor is configured to sense a temperature of a different section of the material.

13. The thermoforming system of claim 12 , wherein the plurality of heat sources are proximate to a first surface of the material, and the plurality of temperature sensors are proximate to a second surface of the material opposite the first surface.

14. The thermoforming system of claim 13 , wherein each temperature sensor is located opposite to a corresponding heat source.

15. The thermoforming system of claim 12 , wherein each heat source is configured to heat a portion of the material having a first size, and each temperature sensor is configured to monitor a section of the material having a second size different from the first size.

16. The thermoforming system of claim 15 , wherein the second size is smaller than the first size.

17. The thermoforming system of claim 11 , wherein the operations further comprise evaluating a quality of the heated material by comparing the monitored temperature to a target temperature.

18. The system of claim 7 , wherein the temperature is monitored using a plurality of temperature sensors, and each temperature sensor is configured to sense a temperature of a different section of the material.

19. The thermoforming system of claim 10 , wherein the object comprises an orthodontic shell appliance.

20. The thermoforming system of claim 11 , wherein controlling the plurality of heat sources based on the monitored temperature comprises one or more of activating a heat source, deactivating a heat source, increasing an amount of heat output by a heat source, or decreasing an amount of heat output by a heat source.

Assignees

• Align Technology Inc

Inventors

• Sirovskiy Yevgeniy
• Culp James C

Classifications

• B29B13/023 Primary

  Half-products, e.g. films, plates · CPC title

• B29C51/422

  to produce a temperature differential (B29C51/426 takes precedence) · CPC title

• B29B2013/027

  Obtaining a temperature gradient over the surface of films or tubes · CPC title

• B29C51/42 Primary

  Heating or cooling · CPC title

• B29B13/02

  by heating (B29B13/06, B29B13/08 take precedence) · CPC title