Liquid powered and cooled microfluidics photonics architecture

Patent metadata

Field	Value
Publication number	US-11909449-B1
Application number	US-202318204052-A
Country	US
Kind code	B1
Filing date	May 31, 2023
Priority date	May 31, 2023
Publication date	Feb 20, 2024
Grant date	Feb 20, 2024

Abstract

An electronic device includes a substrate having a first surface and an opposite second surface; a photonic transmitter supported by the first surface of the substrate; a photonic receiver supported by the first surface of the substrate; a microfluidic volume positioned in the second surface of the substrate; a waveguide positioned to direct photonic signal from the photonic transmitter to the photonic receiver, wherein at least a portion of the waveguide is positioned between the first surface of the substrate and at least a portion of the microfluidic volume; and a working fluid in the microfluidic volume to receive heat from the waveguide.

First claim

What is claimed is:

1. A device comprising:
a substrate having a first surface and an opposite second surface;
at least one of a photonic transmitter supported by the first surface of the substrate and a photonic receiver supported by the first surface of the substrate;
a microfluidic volume positioned in the second surface of the substrate;
a waveguide positioned to direct photonic signal from the photonic transmitter to the photonic receiver, wherein at least a portion of the waveguide is positioned between the first surface of the substrate and at least a portion of the microfluidic volume; and
a working fluid in the microfluidic volume to receive heat from the waveguide.

2. The device of claim 1 , wherein the waveguide contacts the microfluidic volume.

3. The device of claim 1 , wherein the working fluid is an electrochemical fluid.

4. The device of claim 1 , wherein the photonic transmitter and the photonic receiver are part of a single die.

5. The device of claim 1 , wherein the waveguide is embedded in the substrate with substrate material between waveguide and the first surface and the opposite second surface.

6. The device of claim 1 , wherein the waveguide is a silica glass.

7. The device of claim 1 , wherein a wall between the waveguide and the microfluidic volume is no more than 250 micrometers.

8. The device of claim 1 , wherein the waveguide provides photonic communication to a lateral surface of the substrate.

9. A device comprising:
a substrate having a first surface and an opposite second surface;
an electrical load supported by the first surface of the substrate;
at least one of a photonic transmitter supported by the first surface of the substrate and a photonic receiver supported by the first surface of the substrate;
a microfluidic volume positioned in the second surface of the substrate;
a waveguide positioned to direct photonic signal from the photonic transmitter to the photonic receiver, wherein at least a portion of the waveguide is positioned between the first surface of the substrate and at least a portion of the microfluidic volume;
a first electrode positioned in the microfluidic volume;
a second electrode positioned in the microfluidic volume;
a first through silicon via (TSV) connecting the first electrode to the electrical load;
a second TSV connecting the second electrode to the electrical load; and
an electrochemical fluid positioned in the microfluidic volume to provide electrical power to the electrical load and receive heat from the electrical load and waveguide.

10. The device of claim 9 , wherein the electrical load is the photonic transmitter.

11. The device of claim 9 , wherein the electrical load is the photonic receiver.

12. The device of claim 9 , wherein the electrical load is a processor.

13. The device of claim 9 , further comprising:
an ion-transfer membrane in the microfluidic volume and the ion-transfer membrane separates part of the microfluidic volume into a first portion and a second portion,
wherein the electrochemical fluid is a first electrochemical fluid in the first portion of the microfluidic volume and the device further comprises a second electrochemical fluid in the second portion.

14. The device of claim 13 , wherein the first electrochemical fluid is an anolyte.

15. The device of claim 14 , wherein the second electrochemical fluid is a catholyte.

16. A method of powering and cooling a photonics in an electronic device, the method comprising:
receiving a photonic signal in a waveguide, wherein the waveguide is located in a substrate with at least a first vertical portion of the substrate on a first side of the waveguide and a second vertical portion of the substrate on a second side of the waveguide;
flowing a working fluid through a microfluidic volume of the substrate proximate the waveguide;
receiving heat generated by the photonic signal in the waveguide with the working fluid to create hot working fluid;
exhausting the heat from the working fluid to create cold working fluid; and
recirculating the cold working fluid into the substrate.

17. The method of claim 16 , wherein the working fluid is an electrochemical fluid, and further comprising:
discharging the electrochemical fluid in an electrochemical chamber of the substrate.

18. The method of claim 17 , further comprising:
recharging the electrochemical fluid before recirculating the cold working fluid into the substrate.

19. The method of claim 17 , wherein discharging the electrochemical fluid powers a photonic transmitter.

20. The method of claim 16 , wherein the photonic signal is received through a photonic connector of the substrate.

Assignees

• Microsoft Technology Licensing Llc

Inventors

• Oruganti Vaidehi
• Ramakrishnan Bharath
• Alissa Husam Atallah
• Belady Christian L

Classifications

• H01M8/2455

  with liquid, solid or electrolyte-charged reactants · CPC title

• H01M2250/00

  Fuel cells for particular applications; Specific features of fuel cell system · CPC title

• H01M8/04007

  related to heat exchange · CPC title

• H01M8/04276

  Arrangements for managing the electrolyte stream, e.g. heat exchange · CPC title

• H01M8/0256

  Vias, i.e. connectors passing through the separator material · CPC title