Active electronically scanned array system and method with optimized subarrays
US-11271321-B1 · Mar 8, 2022 · US
US11909091B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11909091-B2 |
| Application number | US-202117323800-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 18, 2021 |
| Priority date | May 19, 2020 |
| Publication date | Feb 20, 2024 |
| Grant date | Feb 20, 2024 |
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Expansion compensation structures for an antenna are disclosed. In one embodiment, the antenna comprises: an array of antenna elements; and a structure coupled to the array of antenna elements, the structure having a plurality of components comprising materials having different coefficients of thermal expansion (CTEs), wherein first and second components of the plurality of components are pin bonded with one or more pins, and one or more components of the plurality of components other than the first and second components are between the first and second components and have one or more slots through which the one or more pins traverse and have CTEs different than CTEs of the first and second components.
Opening claim text (preview).
We claim: 1. An antenna comprising: an array of antenna elements; and a structure coupled to the array of antenna elements, the structure having a plurality of components comprising materials having different coefficients of thermal expansion (CTEs), wherein first and second components of the plurality of components are pin bonded with one or more pins, and one or more components of the plurality of components other than the first and second components are between the first and second components and have one or more slots through which the one or more pins traverse and have CTEs different than CTEs of the first and second components to allow movement of at least one component of the one or more components between the first and second components around the one or more pins due to thermal expansion. 2. The antenna of claim 1 wherein the first and second components comprise materials with higher CTE than the one or more components. 3. The antenna of claim 1 wherein the first and second components comprise materials with lower CTE than the one or more components. 4. The antenna of claim 1 wherein each of the one or more pins comprise materials that do not detrimentally impact radio-frequency (RF) propagation of a feed wave. 5. The antenna of claim 1 wherein each of the one or more pins comprises a dielectric pin. 6. The antenna of claim 1 wherein each of the one or more pins comprises polystyrene material. 7. The antenna of claim 1 wherein the one or more slots allow movement of the one or more components with respect to the first and second components in response to thermal expansion. 8. The antenna of claim 1 wherein structure comprises an antenna feed. 9. The antenna of claim 8 wherein the antenna feed includes bonded composite dielectric materials. 10. The antenna of claim 9 wherein the dielectric materials comprise sintered dielectric materials. 11. The antenna of claim 8 wherein the antenna feed includes corrugated dielectric materials. 12. The antenna of claim 1 wherein the array of antenna elements are operable to radiate radio-frequency (RF) energy. 13. The antenna of claim 1 wherein the array of antenna elements are RF radiating metamaterial antenna elements of a metasurface.
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