Multi-level authentication using different materials

Patent metadata

Field	Value
Publication number	US-11907782-B2
Application number	US-202117792504-A
Country	US
Kind code	B2
Filing date	Feb 3, 2021
Priority date	Feb 6, 2020
Publication date	Feb 20, 2024
Grant date	Feb 20, 2024

Abstract

Among other concepts, this disclosure describes a thermal/optical/electronic authentication system (covert or non-covert) for device/system implementations. The authentication system may be based on different design parameters such as i) materials composition, ii) thickness of material, iii) geometry of material, iv) external effects including use of an external DC bias and curing, etc. The authentication testbeds can be configured to include one or more inks. Using such methods as discussed herein, the authentication can be broadened to include near-IR (700-900 nm), short wave IR (1-2.6 mm), and UVA (300-400 nm) or any spectrum. Printed resistors are very difficult to duplicate without Ag-BST13 ink. If necessary, a printed resistor network on a respective substrate can be hidden using a layer of non-sintered Ag-BST13 (non-conductive).

First claim

The invention claimed is:

1. An apparatus comprising:
a substrate;
a first layer of material disposed on the substrate; and
multiple authentication components disposed at different locations in the first layer of material, a combination of the multiple authentication components having a unique signature;
wherein the first layer of material is transformable dielectric material; and
wherein the multiple authentication components are formed via modification of the transformable dielectric material.

2. The apparatus as in claim 1 , wherein each of the multiple authentication components is a respective electronic circuit component.

3. The apparatus as in claim 1 further comprising:
a second layer of material disposed on the first layer of material, the second layer of material preventing the multiple authentication components from being viewable via a human visible spectrum of light.

4. The apparatus as in claim 1 , wherein the multiple authentication components include a first authentication component at a first location of the first layer of material, the first authentication component formed via application of localized heat to the first location; and
wherein the multiple authentication components include a second authentication component at a second location of the first layer of material, the second authentication component formed via application of localized heat to the second location.

5. The apparatus as in claim 1 , wherein the multiple authentication components are formed via application of a chemical applied at different locations of the first layer of material.

6. The apparatus as in claim 1 , wherein each of the authentication components is one or more of:
i) emissive,
ii) reflective, or
iii) transparent.

7. The apparatus as in claim 1 , wherein the multiple authentication components are first authentication components, the apparatus further comprising:
a second layer of material disposed on the first layer of material; and
second authentication components disposed at different locations in the second layer of material.

8. The apparatus as in claim 7 , wherein the second authentication components are non-overlapping with respect to the first authentication components.

9. The apparatus as in claim 7 , wherein each of the first authentication components is optically emissive; and
wherein each of the first authentication components is reflective.

10. The apparatus as in claim 7 , wherein each of the first authentication components is optically emissive; and
wherein each of the second authentication components is reflective.

11. The apparatus as in claim 1 further comprising:
electronic circuitry operative to drive the multiple authentication components with a signal; and
wherein each of the multiple authentication components emits a respective wireless signal.

12. An apparatus comprising:
a substrate;
a first layer of material disposed on the substrate; and
multiple authentication components disposed at different locations in the first layer of material, a combination of the multiple authentication components having a unique signature;
wherein each of the multiple authentication components is a respective electronic circuit component;
wherein each of the multiple authentication components is one of:
i) a resistor, or
ii) a capacitor.

13. An apparatus comprising:
a substrate;
a first layer of material disposed on the substrate; and
multiple authentication components disposed at different locations in the first layer of material, a combination of the multiple authentication components having a unique signature;
wherein the first layer of material is a compound comprising:
first particles, the first particles being an insulator material;
second particles, the second particles being electrically conductive material; and
a combination of the first particles and the second particles distributed and suspended in a printable material in which a cured state of the printable material is transformable into an electrically conductive path via application of heat above a threshold value.

14. An apparatus comprising:
a substrate;
a first layer of material disposed on the substrate; and
multiple authentication components disposed at different locations in the first layer of material, a combination of the multiple authentication components having a unique signature;
wherein each of the multiple authentication components emits a different amount of thermal energy when activated via a corresponding applied signal.

15. An apparatus comprising:
a substrate;
a first layer of material disposed on the substrate;
multiple authentication components disposed at different locations in the first layer of material, a combination of the multiple authentication components having a unique signature;
wherein each of the multiple authentication components reflects a different amount of thermal energy when exposed to an applied optical input signal.

16. A method comprising:
receiving a substrate;
disposing a first layer of material on the substrate;
fabricating multiple authentication components at different locations in the first layer of material, a combination of the multiple authentication components having a unique signature;
wherein each of the multiple authentication components is a respective electronic circuit component; and
wherein each of the multiple authentication components is one of: i) a resistor, or ii) a capacitor.

17. The method as in claim 16 further comprising:
fabricating a second layer of material on the first layer of material, the second layer of material preventing the multiple authentication components from being viewable via a human visible spectrum of light.

18. The method as in claim 16 further comprising:
fabricating a first authentication component at a first location of the first layer of material, the first authentication component fabricated via application of localized heat to the first location; and
fabricating a second authentication component at a second location of the first layer of material, the second authentication component fabricated via application of localized heat to the second location.

Assignees

• Univ Massachusetts

Inventors

• Kingsley Edward D
• Ranasingha Oshadha K
• Luce Andrew M
• Akyurtlu Alkim
• Armiento Craig A
• Piro Yuri A

Classifications

• G06K19/06037 Primary

  multi-dimensional coding · CPC title

• B42D25/387 Primary

  absorbing or reflecting ultraviolet light · CPC title

• G07D7/06

  using wave or particle radiation · CPC title

• G07D7/005

  Testing security markings invisible to the naked eye, e.g. verifying thickened lines or unobtrusive markings or alterations · CPC title

• B42D25/305

  Associated digital information (record carriers for use with machines and with at least a part designed to carry digital markings G06K19/00) · CPC title