Organic film forming apparatus

Patent metadata

Field	Value
Publication number	US-11906246-B2
Application number	US-202016899767-A
Country	US
Kind code	B2
Filing date	Jun 12, 2020
Priority date	Dec 15, 2017
Publication date	Feb 20, 2024
Grant date	Feb 20, 2024

Abstract

According to one embodiment, an organic film forming apparatus includes a chamber configured to maintain an atmosphere more reduced than an atmospheric pressure, at least one processing room provided inside the chamber and being surrounded by a cover, and an exhaust part configured to exhaust the inside the chamber. The processing room includes an upper heating part including first heaters, a lower heating part including second heaters, and facing the upper heating part, an upper heat equalizing plate provided on the lower heating part side of the upper heating part, a lower heat equalizing plate provided on the upper heating part side of the lower heating part, and workpiece supporters configured to support a workpiece through a gap between the upper and lower heat equalizing plates.

First claim

What is claimed is:

1. An organic film forming apparatus, comprising:
a chamber configured to maintain an atmosphere more reduced than an atmospheric pressure;
at least one processing room provided inside the chamber and being surrounded by a cover; and
an exhaust part configured to exhaust the inside the chamber,
the processing room including
an upper heating part including a plurality of first heaters provided to be arranged in a predetermined direction, the plurality of first heaters having a rod shape,
a lower heating part including a plurality of second heaters provided to be arranged in the predetermined direction, facing the upper heating part, and the plurality of second heaters having a rod shape,
an upper heat equalizing plate provided on the lower heating part side of the upper heating part, a gap being provided between an upper surface of the upper heat equalizing plate and the lower surfaces of the first heaters,
a lower heat equalizing plate provided on the upper heating part side of the lower heating part, a gap being provided between an lower surface of the lower heat equalizing plate and the upper surfaces of the second heaters,
a plurality of workpiece supporters configured to support a workpiece through a gap between the upper heat equalizing plate and the lower heat equalizing plate, the workpiece including a substrate and a solution including polyamic acid coated on an upper surface of the substrate, the workpiece supporters being rod-shaped bodies,
an upper heat equalizing plate supporter detachably supporting the upper heat equalizing plate, and
a lower heat equalizing plate supporter detachably supporting the lower heat equalizing plate,

wherein
the upper heat equalizing plate includes one pair of holders facing in a direction orthogonal to a direction along which the plurality of first heaters are arranged,
a plurality of the upper heat equalizing plate supporters are fixed to the pair of holders, the upper heat equalizing plate includes a bent portion,
the heat equalizing plate supporter includes a bent portion protruding toward the upper heat equalizing plate,
when a tip of the bent portion of the heat equalizing plate supporter contacts a lower surface of the upper heat equalizing plate, a tip of the bent portion of the upper heat equalizing plate does not contact the heat equalizing plate supporter, and
when the tip of the bent portion of the heat equalizing plate supporter does not contact the lower surface of the upper heat equalizing plate, the tip of the bent portion of the upper heat equalizing plate contacts the heat equalizing plate supporter,
the processing room having a space communicating with the chamber, the exhaust part reducing a pressure inside the chamber, and reducing a pressure of a space between an inner wall of the chamber and the cover.

2. The apparatus according to claim 1 , wherein
the processing room is provided in a plurality to overlap in a vertical direction, and
the upper heating part provided in the processing room of the lower side serves as the lower heating part provided in the processing room of the upper side.

3. The apparatus according to claim 1 , wherein
in the predetermined direction, a side heat equalizing plate is further provided in each of side parts of both sides of the processing room, and
the side heat equalizing plate is provided inside the cover.

4. The apparatus according to claim 3 , wherein
the chamber has openings facing each other,
in a direction orthogonal to the predetermined direction, a side heat equalizing plate is further provided on each of both sides of the processing room, and
the side heat equalizing plate is provided inside a lid closing one of the openings and inside a door closing one other of the openings.

5. The apparatus according to claim 3 , further comprising:
at least one third heater provided between the side heat equalizing plate and the cover to be separated from the side heat equalizing plate and the cover.

6. The apparatus according to claim 3 , further comprising:
a supporter detachably supporting the side heat equalizing plate.

7. The apparatus according to claim 1 , wherein
the upper heat equalizing plate and the lower heat equalizing plate include at least one of aluminum, copper, or stainless steel.

8. The apparatus according to claim 7 , wherein
when the upper heat equalizing plate and the lower heat equalizing plate include the copper, a layer including nickel is provided on a surface.

9. The apparatus according to claim 1 , wherein
a distance between a surface of the first heater and the upper heat equalizing plate is same as a distance between a surface of the second heater and the lower heat equalizing plate.

10. The apparatus according to claim 1 , wherein
the cover has function of reflecting a heat incident from the upper heating part side or the lower heating part side to the processing room side.

11. An organic film forming apparatus comprising:
a chamber configured to maintain an atmosphere more reduced than an atmospheric pressure;
at least one processing room provided inside the chamber and being surrounded by a cover; and
an exhaust part configured to exhaust the inside the chamber,
the processing room including
an upper heating part including a plurality of first heaters provided to be arranged in a predetermined direction, the plurality of first heaters having a rod shape,
a lower heating part including a plurality of second heaters provided to be arranged in the predetermined direction, facing the upper heating part, and the plurality of second heaters having a rod shape,
an upper heat equalizing plate provided on the lower heating part side of the upper heating part, a gap being provided between an upper surface of the upper heat equalizing plate and the lower surfaces of the first heaters,
a lower heat equalizing plate provided on the upper heating part side of the lower heating part, a gap being provided between an lower surface of the lower heat equalizing plate and the upper surfaces of the second heaters,
a side heat equalizing plate provided in each of side parts of both sides of the processing room in the predetermined direction,
a side heat equalizing plate provided on each of both sides of the processing room in a direction orthogonal to the predetermined direction,
a plurality of workpiece supporters configured to support a workpiece through a gap between the upper heat equalizing plate and the lower heat equalizing plate, the workpiece including a substrate and a solution including polyamic acid coated on an upper surface of the substrate, the workpiece supporters being rod-shaped bodies, and
an upper heat equalizing plate supporter detachably supporting the upper heat equalizing plate and provided in the processing room,

wherein
the upper heating part includes a pair of holders facing in a direction orthogonal to a direction along which the plurality of first heaters are arranged,
a plurality of the upper heat equalizing plate supporters are fixed to the pair of holders,
the upper heat equalizing plate includes a bent portion,
the heat equalizing plate supporter includes a bent portion protruding toward the upper heat equalizing plate,
when a tip of the bent portion of the heat equalizing plate supporter contacts a lower surface of the upper heat equalizing plate, a tip of the bent portion of the upper heat equalizing plate does not contact the heat equalizing plate supporter,
when the tip of the bent portion of the heat equalizing plate supporter does not contact the lower surface of the upper heat equalizing plate, the tip of the bent portion of the upper heat equalizing plate cont

Assignees

• Shibaura Mechatronics Corp

Inventors

• Nishibe Yukinobu
• Iso Akinori
• Oomori Keigo
• Takahashi Takashi

Classifications

• F27B17/00 Primary

  Furnaces of a kind not covered by any of groups F27B1/00 - F27B15/00 (structural combinations of furnaces F27B19/02) · CPC title

• C23C14/56

  Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks · CPC title

• F26B3/30

  from infrared-emitting elements {(by radiation emanating from passages containing heated fluids other than combustion gases F26B23/10)} · CPC title

• F26B9/06

  in stationary drums or chambers · CPC title

• F27B5/04

  adapted for treating the charge in vacuum or special atmosphere · CPC title