Method for producing joined body of different materials and joined body of different materials

US11904553B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11904553-B2
Application numberUS-201917256501-A
CountryUS
Kind codeB2
Filing dateSep 18, 2019
Priority dateSep 28, 2018
Publication dateFeb 20, 2024
Grant dateFeb 20, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention provides a method for producing a joined body of different materials, which may easily achieve joining between a plurality of resin layers and joining between a resin and a metal, and a joined body of different materials.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for producing a joined body comprising different materials joined together, the method comprising the steps of: preparing a metal substrate comprising two or more etched grooves on a surface thereof and burrs provided adjacent to each of the two or more etched grooves; sequentially placing a first resin layer and a second resin layer on the surface of the metal substrate; and irradiating a surface of the second resin layer with a laser, thereby fusing the first and second resin layers to form a laminate, wherein the first resin layer has a light transmittance of 20% to 70% at any one wavelength selected from a range of 800 nm to 1,100 nm, wherein the second resin layer has a light transmittance of 50% to 80% at the any one wavelength, wherein the surface of the metal substrate has a light reflectance of 50% or less at the any one wavelength, wherein a light absorption rate of the first resin layer at the any one wavelength selected from a range of 800 nm to 1,100 nm is 20% to 50%, and wherein the light transmittance of the first resin layer at the any one wavelength is lower than a light transmittance of the second resin layer at the any one wavelength. 2. The method of claim 1 , wherein the light transmittance of the first resin layer at the any one wavelength is 20% to 50%. 3. The method of claim 1 , wherein the first resin layer has a thickness of 0.1 mm to 5 mm. 4. The method of claim 1 , wherein the laser is a diode laser having an output of 50 W to 2,000 W. 5. The method of claim 1 , wherein the surface of the second resin layer is irradiated with the laser three times or less at an irradiation speed of 10 mm/s to 1,000 mm/s, and wherein the laser has a spot size of 100 μm to 5,000 μm.

Assignees

Inventors

Classifications

  • at least passing through one of the parts to be joined, i.e. laser transmission welding · CPC title

  • B32B3/30Primary

    characterised by a layer formed with recesses or projections, e.g. {hollows, grooves, protuberances, ribs (apertured layer B32B3/266; layer with cavities or internal voids B32B3/26)} · CPC title

  • comprising polyolefins · CPC title

  • comprising iron or steel {(B32B15/011, B32B15/012 and B32B15/013 take precedence)} · CPC title

  • specially treated, e.g. irradiated · CPC title

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Frequently asked questions

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What does patent US11904553B2 cover?
The present invention provides a method for producing a joined body of different materials, which may easily achieve joining between a plurality of resin layers and joining between a resin and a metal, and a joined body of different materials.
Who is the assignee on this patent?
Lg Chemical Ltd
What technology area does this patent fall under?
Primary CPC classification B29C65/1635. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Feb 20 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).