Method and system for fabricating cross-layer pattern

US11904525B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11904525-B2
Application numberUS-202117336437-A
CountryUS
Kind codeB2
Filing dateJun 2, 2021
Priority dateMar 25, 2014
Publication dateFeb 20, 2024
Grant dateFeb 20, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of fabricating a cross-layer pattern in a layered object is disclosed. The method is executed by an additive manufacturing system and comprises: dispensing a patterning material onto a receiving medium to form a first pattern element; dispensing a first layer of modeling material onto the first pattern element while forming a first open cavity exposing at least a portion of the first pattern element beneath the first layer; and dispensing patterning material onto the exposed portion of the first pattern element and the first layer to form a second pattern element contacting the first pattern element.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of additive manufacturing, comprising: dispensing a patterning material onto a receiving medium to form a first pattern element; dispensing a first layer of modeling material while forming a first open cavity having a non-vertical wall, such that said first pattern element is covered by said first layer except a portion thereof which is exposed to said first open cavity; dispensing said patterning material onto said exposed portion of said first pattern element and onto said non-vertical wall, to form a second pattern element; and dispensing a second layer of modeling material onto said first layer in a manner that a portion of said second layer fills said first open cavity. 2. The method of claim 1 , wherein said non vertical wall is planar. 3. The method of claim 1 , wherein said non vertical wall is curved. 4. The method according to claim 1 , wherein said dispensing said second layer comprises leaving at least a portion of said second pattern element exposed beneath said second layer. 5. The method according to claim 4 , wherein said dispensing said second layer comprises forming a second open cavity in said second layer thereby exposing said portion of said second pattern element beneath said second layer. 6. The method according to claim 5 , wherein said second cavity is laterally displaced relative to said first cavity. 7. The method according to claim 1 , wherein said dispensing said first layer and said dispensing said second layer are by different dispensing nozzle arrays of an additive manufacturing system, each nozzle array dispensing a different modeling material. 8. The method according to claim 1 , wherein said patterning material is conductive. 9. The method according to claim 1 , wherein a thickness of said pattern element is at least two times less than a thickness of each of said layers. 10. The method according to claim 1 , comprising alternately repeating said dispensing of said patterning material and said first and said second layer, a plurality of times, to form a plurality of layers of modeling material, and a plurality of interconnected pattern elements forming a continuous pattern crossing said plurality of layers. 11. The method according to claim 10 , further comprising dispensing at least one additional layer of modeling material while leaving an open cavity in said at least one additional layer, and placing an electronic or electric device in said cavity, wherein said pattern elements are conductive and wherein at least one said pattern elements contacts an electric terminal of said device. 12. The method according to claim 1 , further comprising sintering said pattern element. 13. The method according to claim 1 , wherein said modeling material comprises a sintering inducing agent, and wherein said dispensing of said modeling material and/or said patterning material is executed such that said sintering inducing agent reacts with said patterning material to sinter said patterning element. 14. The method according to claim 13 , wherein said sintering inducing agent comprises a compound selected from the group consisting of free radical polymerizable compound, cationic polymerizable compound and anionic polymerizable compound. 15. The method according to claim 13 , wherein said sintering inducing agent is selected from the group consisting of acrylate, trimethyl ammonium methyl methacrylate chloride, 3-trimethyl ammonium propyl methacrylamide chloride, acrylamide. 16. The method according to claim 13 , wherein said sintering inducing agent comprises an ionic group and a counter ion, said ionic group being an acrylic monomer or derivative. 17. The method according to claim 16 , wherein said sintering inducing agent is a salt. 18. The method according to claim 16 , wherein said counter ion is anionic and the ion group is cationic. 19. The method according to claim 16 , wherein said ionic group selected from the group consisting of an acrylate, a methacrylate, an acrylamide, a methacrylamide, an oligomer and a polymer.

Assignees

Inventors

Classifications

  • B29C64/112Primary

    using individual droplets, e.g. from jetting heads · CPC title

  • Processes of additive manufacturing · CPC title

  • for controlling or regulating additive manufacturing processes · CPC title

  • Materials specially adapted for additive manufacturing · CPC title

  • Inkjet printing inks · CPC title

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Frequently asked questions

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What does patent US11904525B2 cover?
A method of fabricating a cross-layer pattern in a layered object is disclosed. The method is executed by an additive manufacturing system and comprises: dispensing a patterning material onto a receiving medium to form a first pattern element; dispensing a first layer of modeling material onto the first pattern element while forming a first open cavity exposing at least a portion of the first p…
Who is the assignee on this patent?
Stratasys Ltd
What technology area does this patent fall under?
Primary CPC classification B29C64/112. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Feb 20 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).