Three-dimensional modeling device and method for manufacturing three-dimensional modeled object

US11904524B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11904524-B2
Application numberUS-202217659959-A
CountryUS
Kind codeB2
Filing dateApr 20, 2022
Priority dateApr 23, 2021
Publication dateFeb 20, 2024
Grant dateFeb 20, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A three-dimensional modeling device includes a modeling unit having a nozzle configured to eject a modeling material, a stage, a movement mechanism unit for changing a relative position between the nozzle and the stage, a measuring unit, a reference unit having a reference surface arranged at a position that corresponds to a deposition surface of the stage in an intersecting direction and where the reference surface can face the measuring unit, the reference unit being separate from the nozzle, and a control unit controlling the modeling unit and the movement mechanism unit. The control unit controls the measuring unit to measure a first distance between the measuring unit and the reference surface and a second distance between the measuring unit and the distal end surface, and decides a distance between a distal end surface of the nozzle and the deposition surface, based on the first and second distances.

First claim

Opening claim text (preview).

What is claimed is: 1. A three-dimensional modeling device comprising: a modeling unit having a nozzle ejecting a modeling material from a nozzle opening formed at a distal end surface; a stage having a deposition surface where the modeling material is deposited; a movement mechanism unit configured to change a relative position between the nozzle and the stage and configured to position a measuring unit to selectively face the distal end surface, the movement mechanism having an actuator and the measuring unit having a sensor; a reference unit having a reference surface arranged at a position that corresponds to the deposition surface in an intersecting direction intersecting the deposition surface, the reference unit being separate from the nozzle; and a control unit configured to control the modeling unit and the movement mechanism unit to model a three-dimensional modeled object, the control unit configured to control the movement mechanism to position the measuring unit to face the reference surface for the measuring unit to measure a first value that is a value about a distance between the measuring unit and the reference surface and control the movement mechanism unit to position the measuring unit to face the distal end surface for the measuring unit to measure a second value that is a value about a distance between the measuring unit and the distal end surface, and configured to decide a distance between the distal end surface and the deposition surface for when modeling the three-dimensional modeled object, based on the first value and the second value. 2. The three-dimensional modeling device according to claim 1 , further comprising: a heating unit configured to move with the movement of the nozzle and configured to heat the modeling material deposited on the deposition surface, wherein the distal end surface is located between the heating unit and the deposition surface in the intersecting direction. 3. The three-dimensional modeling device according to claim 2 , wherein the control unit is configured to control the heating unit to start heating the stage and subsequently control an adjustment unit to bring the reference surface and the deposition surface into contact with each other directly or indirectly so as to cause the position in the intersecting direction of the reference surface and the position in the intersecting direction of the deposition surface to coincide with each other before measuring the first value and the second value, the adjustment unit having an actuator. 4. The three-dimensional modeling device according to claim 1 , wherein the modeling unit has an attachment/detachment part configured to be able to attach and detach the nozzle, and after the nozzle is attached to the attachment/detachment part, the control unit is configured to measure the first value and the second value before starting the modeling of the three-dimensional modeled object. 5. The three-dimensional modeling device according to claim 1 , further comprising: a first cleaning unit configure to clean the distal end surface, the first cleaning unit having a first member in contact with the distal end, wherein the control unit is configured to control the movement mechanism unit to move the first cleaning unit to clean the distal end surface before measuring the second value. 6. The three-dimensional modeling device according to claim 1 , further comprising: a second cleaning unit configured to clean the measuring unit, the second cleaning unit having a second member in contact with the measuring unit, wherein the control unit is configured to control the movement mechanisms unit to move the second cleaning unit to clean the measuring unit before measuring the first value and the second value. 7. The three-dimensional modeling device according to claim 1 , wherein the control unit is configured to control an adjustment unit to bring the measuring unit and the reference surface into contact with each other and measure the first value, the adjustment unit having an actuator. 8. The three-dimensional modeling device according to claim 1 , wherein the control unit is configured to control the movement mechanism unit to bring the measuring unit and the distal end surface into contact with each other and measure the second value. 9. The three-dimensional modeling device according to claim 1 , wherein the reference unit has an inspection surface arranged at a position that is spaced apart from the reference surface by a predetermined distance in the intersecting direction and where the inspection surface can face the measuring unit, and the control unit is configured to control the measuring unit to measure a height difference between the reference surface and the inspection surface and inspect accuracy of the measuring unit, based on the height difference that is measured. 10. The three-dimensional modeling device according to claim 9 , further comprising: a reporting unit, wherein when the accuracy of the measuring unit does not satisfy a predetermined condition, the control unit is configured to control the reporting unit to report information about the accuracy of the measuring unit. 11. The three-dimensional modeling device according to claim 1 , wherein the movement mechanism unit is configured to move the nozzle in the intersecting direction in relation to the stage, move the stage in a direction along the deposition surface in relation to the nozzle, and change the relative position between the nozzle and the stage. 12. The three-dimensional modeling device according to claim 1 , wherein the adjustment unit is configured to change the position in the intersecting direction of the reference unit to selectively face a measuring unit.

Assignees

Inventors

Classifications

  • B29C64/106Primary

    using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material · CPC title

  • Heads; Nozzles · CPC title

  • for motion along the axis orthogonal to the plane of a layer · CPC title

  • Heating elements · CPC title

  • Cleaning · CPC title

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What does patent US11904524B2 cover?
A three-dimensional modeling device includes a modeling unit having a nozzle configured to eject a modeling material, a stage, a movement mechanism unit for changing a relative position between the nozzle and the stage, a measuring unit, a reference unit having a reference surface arranged at a position that corresponds to a deposition surface of the stage in an intersecting direction and where…
Who is the assignee on this patent?
Seiko Epson Corp
What technology area does this patent fall under?
Primary CPC classification B29C64/106. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Feb 20 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).