Fold flex circuit for LNOP

Patent metadata

Field	Value
Publication number	US-11903140-B2
Application number	US-202318456424-A
Country	US
Kind code	B2
Filing date	Aug 25, 2023
Priority date	Feb 6, 2015
Publication date	Feb 13, 2024
Grant date	Feb 13, 2024

Abstract

Various sensors and methods of assembling sensors are described. In some embodiments, the sensor assembly includes a first end, a body portion, and a second end. The first end can include a neck portion and a connector portion and the second end can include a flap, a first component, a neck portion, and a second component. A method is also described for sensor folding. The method can include using a circuit with an attached emitter and a detector that is separated by a portion of the circuit. The method can also include folding the portion of the circuit such that a first fold is created through the emitter and folding the portion of the circuit such that a second fold is created such that the first fold and second fold form an angle.

First claim

What is claimed is:

1. A method for assembling a physiological sensor, the method comprising:
obtaining an individual flexible circuit comprising:
a proximal end comprising a sensor connector,
a distal end comprising at least one emitter, at least one detector, a neck portion, and a hook, wherein the hook is separate and extends from the neck portion and forms an opening configured to support the at least one emitter, and
a body portion that extends from the proximal end to the distal end;

providing at least one foam layer;
applying the at least one foam layer to the body portion to cover both sides of the body portion, wherein the distal end is not covered by foam on either side;
providing at least one tape layer; and
applying the at least one tape layer to cover the distal end of the individual flexible circuit and overlap an end of the at least one foam layer which is proximal the distal end without overlapping an entire length of the at least one foam layer of the body portion.

2. The method of claim 1 , wherein the at least one tape layer comprises a butterfly shape.

3. The method of claim 1 , further comprising attaching a shell onto a proximal end of the individual flexible circuit to secure the individual flexible circuit.

4. The method of claim 3 , wherein the shell comprises a top portion and a bottom portion.

5. The method of claim 4 , further comprising applying a bonding agent to secure the top portion with the bottom portion.

6. The method of claim 1 , further comprising attaching a third component to the proximal end of the individual flexible circuit.

7. The method of claim 6 , wherein the third component is a resistor.

8. The method of claim 7 , further comprising attaching a fourth component to the proximal end of the individual flexible circuit.

9. The method of claim 8 , wherein the fourth component is an electronically erasable programmable read-only memory (EEPROM).

10. A method for assembling a physiological sensor, the method comprising:
obtaining an individual flexible circuit comprising:
a proximal end comprising a sensor connector,
a distal end comprising at least one emitter and at least one detector, and
a body portion that extends from the proximal end to the distal end;

providing at least one foam layer;
applying the at least one foam layer to the body portion to cover both sides of the body portion;
providing at least one tape layer; and
applying the at least one tape layer to cover the distal end of the individual flexible circuit and overlap an end of the at least one foam layer which is proximal the distal end without overlapping an entire length of the at least one foam layer of the body portion.

11. The method of claim 10 , wherein the at least one tape layer comprises a butterfly shape.

12. The method of claim 10 , further comprising attaching a shell onto a proximal end of the individual flexible circuit to secure the individual flexible circuit.

13. The method of claim 12 , wherein the shell comprises a top portion and a bottom portion.

14. The method of claim 13 , further comprising applying a bonding agent to secure the top portion with the bottom portion.

15. The method of claim 10 , further comprising attaching a third component to the proximal end of the individual flexible circuit.

16. The method of claim 15 , wherein the third component is a resistor.

17. The method of claim 16 , further comprising attaching a fourth component to the proximal end of the individual flexible circuit.

18. The method of claim 17 , wherein the fourth component is an electronically erasable programmable read-only memory (EEPROM).

Assignees

• Masimo Corp

Inventors

• Triman Benjamin C
• Schmidt John
• Abdul-Hafiz Yassir Kamel
• Al-Ali Ammar

Classifications

• H05K3/22 Primary

  Secondary treatment of printed circuits {(H05K3/1283 takes precedence; embedding circuits in grooves by pressure H05K3/107)} · CPC title

• A61B5/0059 Primary

  using light, e.g. diagnosis by transillumination, diascopy, fluorescence (photoacoustic A61B5/0093; optical measurement of heart rate A61B5/02416; optical measurement of blood flow A61B5/0261; optical measurement of analytes A61B5/1455) · CPC title

• A61B5/1455 Primary

  using optical sensors, e.g. spectral photometrical oximeters · CPC title

• H05K3/0097

  Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards (H05K3/0052 takes precedence) · CPC title

• A61B5/0261

  using optical means, e.g. infrared light · CPC title