Terminal material for connectors

Patent metadata

Field	Value
Publication number	US-11901659-B2
Application number	US-202017633268-A
Country	US
Kind code	B2
Filing date	Aug 3, 2020
Priority date	Aug 9, 2019
Publication date	Feb 13, 2024
Grant date	Feb 13, 2024

Abstract

Providing a terminal material for connectors provided with a base material in which at least a surface layer is made of copper or copper alloy, a nickel-plating layer made of nickel or nickel alloy coating a surface of the base material, and a silver-nickel alloy plating layer formed on at least a part of the nickel-plating layer, the silver-nickel alloy plating layer having a film thickness of 0.5 μm to 20 μm inclusive, a nickel content of 0.03 at % to 1.20 at % inclusive, and an average crystal grain size of 10 nm to 150 nm inclusive, to improve abrasion resistance and heat resistance.

First claim

The invention claimed is:

1. A terminal material for connectors comprising
a base material wherein at least a surface layer is made of copper or copper alloy;
a nickel-plating layer made of nickel or nickel alloy coating a surface of the base material; and
a silver-nickel alloy plating layer formed on at least a part of the nickel-plating layer, having a film thickness 0.5 μm or more and 20.0 μm or less, a nickel content 0.03 at % or more and 1.20 at % or less, and an average crystal grain size 10 nm or more and 150 nm or less.

2. The terminal material for connectors according to claim 1 , wherein the film thickness of the silver-nickel alloy plating layer is 1.0 μm or more and 10.0 μm or less.

3. The terminal material for connectors according to claim 2 , wherein the nickel content of the silver-nickel alloy platin layer is 1.00 at % or less.

4. The terminal material for connectors according to claim 3 , further comprising a silver-plating layer wherein silver purity except for C, H, S, O and N which are gas components is 99 mass % or more and a film thickness is 0.01 μm or more and 2.0 μm or less.

5. The terminal material for connectors according to claim 3 , wherein a film thickness of the nickel-plating layer is 0.2 μm or more and 5.0 μm or less.

6. The terminal material for connectors according to claim 5 , wherein the film thickness of the nickel-plating layer is 0.3 μm or more and 2.0 μm or less.

7. The terminal material for connectors according to claim 2 , further comprising a silver-plating layer wherein silver purity except for C, H, S, O and N which are gas components is 99 mass % or more and a film thickness is 0.01 μm or more and 2.0 μm or less.

8. The terminal material for connectors according to claim 2 , wherein a film thickness of the nickel-plating layer is 0.2 μm or more and 5.0 μm or less.

9. The terminal material for connectors according to claim 8 , wherein the film thickness of the nickel-plating layer is 0.3 μm or more and 2.0 μm or less.

10. The terminal material for connectors according to claim 1 , wherein the nickel content of the silver-nickel alloy platin layer is 1.00 at % or less.

11. The terminal material for connectors according to claim 10 , further comprising a silver-plating layer wherein silver purity except for C, H, S, O and N which are gas components is 99 mass % or more and a film thickness is 0.01 μm or more and 2.0 μm or less.

12. The terminal material for connectors according to claim 10 , wherein a film thickness of the nickel-plating layer is 0.2 μm or more and 5.0 μm or less.

13. The terminal material for connectors according to claim 12 , wherein the film thickness of the nickel-plating layer is 0.3 μm or more and 2.0 μm or less.

14. The terminal material for connectors according to claim 1 , further comprising a silver-plating layer wherein silver purity except for C, H, S, O and N which are gas components is 99 mass % or more and a film thickness is 0.01 μm or more and 2.0 μm or less.

15. The terminal material for connectors according to claim 14 , wherein a film thickness of the nickel-plating layer is 0.2 μm or more and 5.0 μm or less.

16. The terminal material for connectors according to claim 15 , wherein the film thickness of the nickel-plating layer is 0.3 μm or more and 2.0 μm or less.

17. The terminal material for connectors according to claim 1 , wherein a film thickness of the nickel-plating layer is 0.2 μm or more and 5.0 μm or less.

18. The terminal material for connectors according to claim 17 , wherein the film thickness of the nickel-plating layer is 0.3 μm or more and 2.0 μm or less.

Assignees

• Mitsubishi Materials Corp

Inventors

• Tarutani Yoshie
• Kubota Kenji

Classifications

• H01R13/03 Primary

  characterised by the material, e.g. plating, or coating materials · CPC title

• B32B15/01 Primary

  all layers being exclusively metallic {(making layered metal workpieces by pressure cladding B23K20/22; making coatings with a metallic material characterised by its composition C23C30/00)} · CPC title

• C22C5/06

  Alloys based on silver · CPC title

• C25D3/12

  of nickel or cobalt · CPC title

• C25D3/46

  of silver · CPC title