Antenna and electronic device including same

Patent metadata

Field	Value
Publication number	US-11901634-B2
Application number	US-202217668540-A
Country	US
Kind code	B2
Filing date	Feb 10, 2022
Priority date	Jan 18, 2021
Publication date	Feb 13, 2024
Grant date	Feb 13, 2024

Abstract

An electronic device is provided, which includes an FPCB, wherein the FPCB includes a first portion in which an antenna is provided in the form of a patch antenna that overlaps a metal member, a second portion coupled to a connector of the circuit board, and a third portion arranged between the first portion and the second portion. A layered structure of the FPCB may include a dielectric material having a first thickness in the first portion overlapping the metal member and having a second thickness smaller than the first thickness in the second portion and the third portion, a first conductive layer provided in the first direction from the dielectric material, and an intermediate conductive layer provided in a second direction opposite to the first direction, from the dielectric material. The intermediate conductive layer may be provided only in the second portion and the third portion and may not be provided in the first portion. A portion of the dielectric material in the first portion can be arranged to face the metal member.

First claim

What is claimed is:

1. An electronic device, comprising:
a circuit board;
an electronic component arranged in a first direction from the circuit board;
a metal member arranged in the first direction from the electronic component and disposed to overlap the electronic component; and
a flexible printed circuit board (FPCB) arranged in the first direction from the metal member, wherein the FPCB includes:
an antenna,
a first portion in which the antenna is provided in a form of a patch antenna that overlaps the metal member,
a second portion coupled to a connector of the circuit board; and
a third portion arranged between the first portion and the second portion,

wherein a layered structure of the FPCB includes:
a dielectric material having a first thickness in the first portion and having a second thickness, which is smaller than the first thickness, in the second portion and the third portion,
a first conductive layer provided in the first direction from the dielectric material, and
an intermediate conductive layer provided in a second direction opposite to the first direction, from the dielectric material,

wherein the intermediate conductive layer is provided only in the second portion and the third portion, and is not provided in the first portion, and
wherein a portion of the dielectric material in the first portion is disposed to face the metal member.

2. The electronic device of claim 1 , wherein the intermediate conductive layer of the FPCB is not provided between the metal member and the dielectric material in the first portion of the FPCB.

3. The electronic device of claim 1 , wherein the dielectric material includes:
a first dielectric material arranged in the first portion and having the first thickness; and
a second dielectric material arranged in the second portion and the third portion and having the second thickness.

4. The electronic device of claim 3 , wherein the intermediate conductive layer is arranged in the second direction from the second dielectric material.

5. The electronic device of claim 4 , wherein the first dielectric material has a thickness greater than a sum of a thickness of the second dielectric material and a thickness of the intermediate conductive layer.

6. The electronic device of claim 1 , wherein the metal member includes a hole through which the third portion of the FPCB passes, and
wherein the second portion of the FPCB extends from a first end of the third portion, which passes through the hole in the metal member, and is coupled to the connector of the circuit board.

7. The electronic device of claim 1 , wherein the third portion of the FPCB is thinner than each of the first portion and the second portion.

8. The electronic device of claim 1 , wherein the electronic component includes one or more of:
a memory;
a central processing unit (CPU);
an application processor (AP);
a graphics processor;
an image signal processor (ISP);
a sensor hub processor; or
a communication processor (CP).

9. The electronic device of claim 1 , wherein the metal member includes stainless steel (SUS).

10. The electronic device of claim 1 , wherein the antenna includes:
a first patch antenna;
a second patch antenna arranged in a y-direction from the first patch antenna; and
a third patch antenna arranged in a x direction perpendicular to the y direction, from the first patch antenna.

11. The electronic device of claim 10 , wherein each of the second patch antenna and the third patch antenna has a same structure as the first patch antenna.

12. An electronic device, comprising:
a circuit board;
an electronic component arranged in a first direction from the circuit board;
a metal member arranged in the first direction from the electronic component and disposed to overlap the electronic component; and
a flexible printed circuit board (FPCB) arranged in the first direction from the metal member, wherein the FPCB includes:
an antenna,
a first portion in which the antenna is provided in a form of a patch antenna that overlaps the metal member,
a second portion coupled to a connector of the circuit board, and
a third portion arranged between the first portion and the second portion,

wherein a layered structure of the FPCB includes:
a first conductive layer in which the patch antenna is provided,
a second conductive layer providing a ground layer, and
an intermediate layer arranged between the first conductive layer and the second conductive layer,

wherein a thickness of the intermediate layer is reduced in the third portion, and
wherein the intermediate layer includes a dielectric material that is at least partially removed in the third portion to provide a groove.

13. The electronic device of claim 12 , wherein the intermediate layer includes:
a first intermediate layer including the dielectric material arranged in the first direction from the second conductive layer, wherein the dielectric material is at least partially removed in the third portion;
a second intermediate layer arranged in the first direction from the first intermediate layer, wherein the second intermediate layer includes a pressure-sensitive adhesive arranged to correspond to the first portion and an intermediate conductive layer arranged to correspond to the second portion and the third portion; and
a third intermediate layer including the dielectric material arranged in the first direction from the second intermediate layer, wherein the dielectric material is arranged to correspond to each of the first portion, the second portion, and the third portion.

14. The electronic device of claim 12 , wherein the metal member includes a hole through which the third portion of the FPCB passes, and
wherein the second portion of the FPCB extends from a first end of the third portion, which passes through the hole in the metal member, and is coupled to the connector of the circuit board.

15. The electronic device of claim 12 , wherein the third portion of the FPCB is thinner than each of the first portion and the second portion.

16. The electronic device of claim 12 , wherein the electronic component includes one or more of:
a memory;
a central processing unit (CPU);
an application processor (AP);
a graphics processor;
an image signal processor (TSP);
a sensor hub processor; or
a communication processor (CP).

17. The electronic device of claim 12 , wherein the metal member includes stainless steel (SUS).

18. The electronic device of claim 12 , wherein the first conductive layer includes:
a first patch antenna;
a second patch antenna arranged in a y-direction from the first patch antenna; and
a third patch antenna arranged in a x direction perpendicular to the y direction, from the first patch antenna.

19. The electronic device of claim 18 , wherein each of the second patch antenna and the third patch antenna has a same structure as the first patch antenna.

20. The electronic device of claim 18 , wherein the first conductive layer further includes:
a first transmission line connecting the connector and the first patch antenna to each other;
a second transmission line connecting the connector and the second patch antenna to each other; and
a third transmission line connecting the connector and the third patch antenna to each other.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Woosup
• Yoo Youngsuk
• Hong Sukgi
• Kim Dongyeon

Classifications

• H01Q21/065 Primary

  Patch antenna array · CPC title

• H01Q5/25

  Ultra-wideband [UWB] systems, e.g. multiple resonance systems; Pulse systems · CPC title

• H01Q21/0006

  Particular feeding systems · CPC title

• H01Q1/243 Primary

  with built-in antennas · CPC title

• H01Q9/0407 Primary

  Substantially flat resonant element parallel to ground plane, e.g. patch antenna (dipole H01Q9/285; monopole H01Q9/40) · CPC title