Curable composition and cured product thereof

Patent metadata

Field	Value
Publication number	US-11901249-B2
Application number	US-201917041674-A
Country	US
Kind code	B2
Filing date	Mar 14, 2019
Priority date	Mar 29, 2018
Publication date	Feb 13, 2024
Grant date	Feb 13, 2024

Abstract

A curable composition to be cured to provide a cured product excellent in heat resistance and dielectric properties, a cured product of the curable composition, a printed wiring board, a semiconductor sealing material, and a build-up film using the curable composition. There is provided a curable composition containing an aromatic ester resin (A) and a maleimide compound (B), the aromatic ester resin (A) being an active ester resin that is a reaction product of a first aromatic compound having two or more phenolic hydroxy groups, a second aromatic compound having a phenolic hydroxy group, and a third aromatic compound having two or more carboxy groups and/or an acid halide thereof or an esterified compound thereof, in which at least one of the first aromatic compound, the second aromatic compound, and the third aromatic compound and/or the acid halide thereof or the esterified compound thereof has a polymerizable unsaturated bond-containing substituent.

First claim

The invention claimed is:

1. A curable composition, comprising:
an aromatic ester resin (A) and a maleimide compound (B), the aromatic ester resin (A) being an active ester resin that is a reaction product of:
a first aromatic compound having two or more phenolic hydroxy groups;
a second aromatic compound having a phenolic hydroxy group; and
a third aromatic compound having two or more carboxy groups and/or an acid halide thereof or an esterified compound thereof,
wherein at least one of the first aromatic compound, the second aromatic compound, and the third aromatic compound and/or the acid halide thereof or the esterified compound thereof has a polymerizable unsaturated bond-containing substituent.

2. The curable composition according to claim 1 , wherein the first aromatic compound is represented by chemical formula (1):

where in chemical formula (1),
each Ar 1 is independently a substituted or unsubstituted first aromatic ring group having 3 to 30 carbon atoms,
each Ar 2 is independently a substituted or unsubstituted second aromatic ring group having 3 to 30 carbon atoms,
each X is independently an oxygen atom, a sulfur atom, a substituted or unsubstituted alkylene having 1 to 20 carbon atoms, a substituted or unsubstituted cycloalkylene having 3 to 20 carbon atoms, or an aralkylene having 8 to 20 carbon atoms, and
n is 0 to 10,
wherein at least two hydrogen atoms of Ar 1 and Ar 2 are replaced with hydroxy groups.

3. The curable composition according to claim 2 , wherein each X is a substituted or unsubstituted cycloalkylene having 1 to 20 carbon atoms or an aralkylene having 8 to 20 carbon atoms.

4. The curable composition according to claim 1 , wherein the second aromatic compound is a fused ring aromatic compound.

5. The curable composition according to claim 1 , wherein the maleimide compound (B) is a compound having two or more maleimide groups in a molecule.

6. A cured product of the curable composition according to claim 1 .

7. A printed wiring board obtained using the curable composition according to claim 1 .

8. A semiconductor sealing material obtained using the curable composition according to claim 1 .

9. A build-up film obtained using the curable composition according to claim 1 .

10. The curable composition according to claim 1 ,
wherein the first aromatic compound is represented by chemical formula (1):

where in chemical formula (1),
each Ar 1 is independently a substituted or unsubstituted first aromatic ring group having 3 to 30 carbon atoms,
each Ar 2 is independently a substituted or unsubstituted second aromatic ring group having 3 to 30 carbon atoms,
each X is independently an oxygen atom, a sulfur atom, a substituted or unsubstituted alkylene having 1 to 20 carbon atoms, a substituted or unsubstituted cycloalkylene having 3 to 20 carbon atoms, or an aralkylene having 8 to 20 carbon atoms, and
n is 0 to 10,
wherein at least two hydrogen atoms of Ar 1 and Ar 2 are replaced with hydroxy groups, and

wherein the second aromatic compound is a fused ring aromatic compound.

11. The curable composition according to claim 2 ,
wherein each X is a substituted or unsubstituted cycloalkylene having 1 to 20 carbon atoms or an aralkylene having 8 to 20 carbon atoms, and
wherein the second aromatic compound is a fused ring aromatic compound.

12. The curable composition according to claim 1 , wherein the first aromatic compound is represented by chemical formula (1):

where in chemical formula (1),
each Ar 1 is independently a substituted or unsubstituted first aromatic ring group having 3 to 30 carbon atoms,
each Ar 2 is independently a substituted or unsubstituted second aromatic ring group having 3 to 30 carbon atoms,
each X is independently an oxygen atom, a sulfur atom, a substituted or unsubstituted alkylene having 1 to 20 carbon atoms, a substituted or unsubstituted cycloalkylene having 3 to 20 carbon atoms, or an aralkylene having 8 to 20 carbon atoms, and
n is 0 to 10,
wherein at least two hydrogen atoms of Ar 1 and Ar 2 are replaced with hydroxy groups, and
wherein the maleimide compound (B) is a compound having two or more maleimide groups in a molecule.

13. The curable composition according to claim 2 ,
wherein each X is a substituted or unsubstituted cycloalkylene having 1 to 20 carbon atoms or an aralkylene having 8 to 20 carbon atoms, and
wherein the maleimide compound (B) is a compound having two or more maleimide groups in a molecule.

14. The curable composition according to claim 1 ,
wherein the second aromatic compound is a fused ring aromatic compound, and
wherein the maleimide compound (B) is a compound having two or more maleimide groups in a molecule.

15. The cured product of the curable composition according to claim 6 , wherein the first aromatic compound is represented by chemical formula (1):

where in chemical formula (1),
each Ar 1 is independently a substituted or unsubstituted first aromatic ring group having 3 to 30 carbon atoms,
each Ar 2 is independently a substituted or unsubstituted second aromatic ring group having 3 to 30 carbon atoms,
each X is independently an oxygen atom, a sulfur atom, a substituted or unsubstituted alkylene having 1 to 20 carbon atoms, a substituted or unsubstituted cycloalkylene having 3 to 20 carbon atoms, or an aralkylene having 8 to 20 carbon atoms, and
n is 0 to 10,
wherein at least two hydrogen atoms of Ar 1 and Ar 2 are replaced with hydroxy groups.

16. The cured product of the curable composition according to claim 15 ,
wherein each X is a substituted or unsubstituted cycloalkylene having 1 to 20 carbon atoms or an aralkylene having 8 to 20 carbon atoms.

17. The cured product of the curable composition according to claim 6 ,
wherein the second aromatic compound is a fused ring aromatic compound.

18. The cured product of the curable composition according to claim 6 ,
wherein the maleimide compound (B) is a compound having two or more maleimide groups in a molecule.

Assignees

• Dainippon Ink & Chemicals

Inventors

• Satou Yutaka
• Yamoto Kazuhisa
• Hayashi Koji

Classifications

• H10W74/40

  characterised by their materials · CPC title

• H05K1/0326

  containing O · CPC title

• C08L67/02

  Polyesters derived from dicarboxylic acids and dihydroxy compounds (C08L67/06 takes precedence) · CPC title

• C08K5/3415

  Five-membered rings · CPC title

• C08G63/547

  Hydroxy compounds containing aromatic rings · CPC title