Calibrating a scanner device

US11899421B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11899421-B2
Application numberUS-201916408557-A
CountryUS
Kind codeB2
Filing dateMay 10, 2019
Priority dateNov 11, 2016
Publication dateFeb 13, 2024
Grant dateFeb 13, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present disclosure relates to calibrating scanner devices for positioning laser beams in a processing field, and includes, e.g.: arranging a retroreflector in the processing field of the scanner device, the processing field being formed in a processing chamber for irradiating powder layers; detecting laser radiation reflected back into the scanner device when the laser beam passes over the retroreflector; determining an actual position of the laser beam in the processing field using the detected laser radiation; and calibrating the scanner device by correcting a laser beam target position specified for the scanner device in the processing field using the determined actual position of the laser beam in the processing field.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for calibrating a laser scanner for positioning a laser beam in a processing field, the method comprising: arranging a retroreflector in or above the processing field of the laser scanner and also between a processing sample in the processing field and the laser scanner, wherein the processing field is formed in a powder layer processing chamber; detecting laser radiation that is reflected back into the laser scanner from the retroreflector as the laser beam passes over the retroreflector; determining an actual position of the laser beam in the processing field based on the detected laser radiation; calibrating the laser scanner by correcting a target position of the laser beam specified for the laser scanner in the processing field based on the determined actual position of the laser beam in the processing field; directing an additional laser beam at an additional processing field formed in the powder layer processing chamber; detecting additional laser radiation that is reflected back into an additional laser scanner as the additional laser beam passes over the retroreflector; determining an actual position of the additional laser beam in the additional processing field based on the additional laser radiation detected; and calibrating the additional laser scanner by correcting a target position specified for the additional laser scanner based on the actual position of the additional laser beam in the additional processing field. 2. The method of claim 1 , wherein the retroreflector is arranged directly above the processing field of the laser scanner in an automated manner. 3. The method of claim 2 , wherein the retroreflector is attached to a movable arm that is configured to deposit powder layers in the processing field of the laser scanner. 4. The method of claim 1 , wherein the retroreflector is a ball transparent to a wavelength of the laser beam, and determining the actual position of the laser beam in the processing field is based on an intensity distribution of the detected laser radiation. 5. The method of claim 1 , wherein the retroreflector is in the form of a retroreflective surface region of a foil. 6. The method of claim 5 , wherein the foil comprises at least one non-retroreflective surface region that adjoins the retroreflective surface region. 7. The method of claim 6 , wherein determining the actual position of the laser beam in the processing field is based on a difference in an intensity of the detected laser radiation between the retroreflective surface region and the non-retroreflective surface region. 8. The method of claim 1 , wherein the laser beam comprises a pilot laser beam, wherein the pilot laser beam is provided at a lower power than a processing laser beam used to irradiate powder layers in the powder layer processing chamber. 9. The method of claim 1 , wherein the actual position of the laser beam and the actual position of the additional laser beam are determined simultaneously. 10. The method of claim 1 , wherein the laser radiation is detected upstream of a focusing device that is arranged upstream of the laser scanner, and wherein the additional laser radiation is detected upstream of an additional focusing device that is arranged upstream of the additional laser scanner. 11. A machining device for producing three-dimensional components by irradiating powder layers, the machining device comprising: an irradiation device comprising a laser source and a laser scanner configured to direct a laser beam from the laser source toward a processing field; a processing chamber in which the processing field is located wherein the processing chamber comprises a powder layer support surface on which the powder layers are applied and wherein the processing chamber comprises a retroreflector arranged in or above the processing field of the laser scanner and also between a processing sample in the processing field and the laser scanner; a photodetector arranged to detect laser radiation reflected back into the laser scanner from the retroreflector as the laser beam passes over the retroreflector; a computer coupled with non-transitory computer-readable medium encoding instructions that cause the computer to perform operations comprising determining an actual position of the laser beam in the processing field based on the detected laser radiation, specifying a target position of the laser beam in the processing field, and correcting the specified target position based on the determined actual position; an additional laser scanner configured to direct an additional laser beam in an additional processing field of the processing chamber; and an additional photodetector arranged to detect additional laser radiation reflected back into the additional laser scanner by the retroreflector as the additional laser beam passes over the retroreflector, wherein the operations further comprise determining an actual position of the additional laser beam in the additional processing field based on the additional laser radiation detected, specifying a target position of the additional laser beam in the additional processing field, and correcting the specified target position based on the determined actual position of the additional laser beam. 12. The machining device of claim 11 , further comprising: an arm configured to move the retroreflector into the processing field of the laser scanner. 13. The machining device of claim 12 , wherein the arm also is configured to deposit powder layers in the processing chamber. 14. The machining device of claim 11 , wherein the retroreflector is a transparent ball or is a retroreflective surface region of a foil. 15. The machining device of claim 11 , wherein the photodetector is a diode. 16. The device of claim 11 , comprising: a focusing device arranged upstream of the laser scanner; and an additional focusing device arranged upstream of the additional laser scanner, wherein the photodetector is upstream of the focusing device, and wherein the additional photodetector is upstream of the additional focusing device. 17. The device of claim 11 , wherein the laser beam is a pilot laser beam, and wherein both the laser source and the laser scanner are further configured to direct a processing laser beam from the laser source toward the processing filed to irradiate powder layers in the powder layer processing chamber, wherein the pilot laser beam is a lower power laser beam than the processing laser beam.

Assignees

Inventors

Classifications

  • G05B19/401Primary

    characterised by control arrangements for measuring, e.g. calibration and initialisation, measuring workpiece for machining purposes (G05B19/19 takes precedence) · CPC title

  • Calibration of process steps or apparatus settings, e.g. before or during manufacturing · CPC title

  • Scanners · CPC title

  • Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head · CPC title

  • Laser welding for purposes other than joining · CPC title

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Frequently asked questions

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What does patent US11899421B2 cover?
The present disclosure relates to calibrating scanner devices for positioning laser beams in a processing field, and includes, e.g.: arranging a retroreflector in the processing field of the scanner device, the processing field being formed in a processing chamber for irradiating powder layers; detecting laser radiation reflected back into the scanner device when the laser beam passes over the …
Who is the assignee on this patent?
Trumpf Laser & Systemtechnik Gmbh
What technology area does this patent fall under?
Primary CPC classification G05B19/401. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Feb 13 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).