Kit, composition for forming underlayer film for imprinting, laminate, and production method using the same

Patent metadata

Field	Value
Publication number	US-11899361-B2
Application number	US-202016988033-A
Country	US
Kind code	B2
Filing date	Aug 7, 2020
Priority date	Feb 9, 2018
Publication date	Feb 13, 2024
Grant date	Feb 13, 2024

Abstract

Provided is a kit including a curable composition for imprinting which contains a polymerizable compound having an aromatic ring and a composition for forming an underlayer film for imprinting which contains a polymer and a solvent, in which the polymer contains at least one kind of specific constitutional unit and has a polymerizable group, a film formed of the composition for forming an underlayer film for imprinting is a solid film at 23° C., and a portion that has a continuous partial structure containing an aromatic ring which is included in the polymerizable compound and accounts for 60% by mass or more of the polymerizable compound is common to a continuous partial structure containing an aromatic ring which is included in a substituent R in a side chain in the polymer. Furthermore, the present invention relates to a composition for forming an underlayer film for imprinting which is used in combination with a curable composition for imprinting; a laminate; a method for producing a laminate; a method for producing a cured product pattern; and a method for manufacturing a circuit board.

First claim

What is claimed is:

1. A kit comprising:
a curable composition for imprinting which contains a polymerizable compound having an aromatic ring; and
a composition for forming an underlayer film for imprinting which contains a polymer and a solvent,
wherein the polymer contains at least one kind of constitutional unit represented by any one of Formulae (1) to (6) and has a polymerizable group,
a film formed of the composition for forming an underlayer film for imprinting is a solid film at 23° C., and
a continuous partial structure containing an aromatic ring which is included in the polymerizable compound and accounts for 60% by mass or more of the polymerizable compound is common to a continuous partial structure containing an aromatic ring which is included in a substituent R 2 in Formulae (1) to (6),

in Formulae (1) to (6), the substituents R are each independently a substituent having a partial structure containing an aromatic ring, a formula weight of R 2 is 80 or more, a substituent R 1 is a hydrogen atom or a methyl group, and a main chain of the polymer in Formulae (1) to (6) may have a substituent.

2. The kit according to claim 1 ,
wherein the following ΔHSP, which is derived from a Hansen solubility parameter of at least one kind of polymerizable compound contained in the curable composition for imprinting and a Hansen solubility parameter of the continuous partial structure containing an aromatic ring which is included in the substituent R 2 of the polymer, is 5 or less,
ΔHSP=[4.0×(Δ d 2 +Δp 2 +Δh 2 )] 0.5

where Δd is a difference between a dispersion element component of a Hansen solubility parameter vector of the polymerizable compound and a dispersion element component of a Hansen solubility parameter vector of the continuous partial structure containing an aromatic ring which is included in the substituent R 2 of the polymer,
Δp is a difference between a polarity element component of the Hansen solubility parameter vector of the polymerizable compound and a polarity element component of the Hansen solubility parameter vector of the continuous partial structure containing an aromatic ring which is included in the substituent R 2 of the polymer, and
Δh is a difference between a hydrogen bond element component of the Hansen solubility parameter vector of the polymerizable compound and a hydrogen bond element component of the Hansen solubility parameter vector of the continuous partial structure containing an aromatic ring which is included in the substituent R 2 of the polymer.

3. The kit according to claim 1 ,
wherein a formula weight of the continuous partial structure containing an aromatic ring which is included in the substituent R 2 of the polymer is 500 or less.

4. The kit according to claim 1 ,
wherein the polymerizable group included in the polymer is a (meth)acryloyl group.

5. The kit according to claim 1 ,
wherein surface free energy of an underlayer film for imprinting formed of the composition for forming an underlayer film for imprinting is 40 mN/m or more.

6. The kit according to claim 1 ,
wherein in the polymer, the continuous partial structure containing an aromatic ring which is included in the substituent R 2 in Formulae (1) to (6) includes a polymerizable group.

7. The kit according to claim 1 ,
wherein the continuous partial structure containing an aromatic ring which is included in the substituent R 2 of the polymer is a substituent represented by -(L 1 ) n1 -La-[(L 2 ) n2 -(P) n3 ] n4 ,
where L 1 and L 2 are each independently a linking group containing a heteroatom, provided that in a case where n3 is 0, L 2 is a substituent containing a heteroatom; La is a linking group containing an aromatic ring, provided that in a case where n2 is 0 and n3 is 0, La is a substituent containing an aromatic ring; P is a polymerizable group; n1 is 0 to 4; n2 is 0 to 4; n3 is 0 to 6; and n4 is an integer of 1 to 10.

8. The kit according to claim 1 ,
wherein the polymer is a copolymer having the other constitutional unit different from the constitutional unit having the substituent R, which is represented by any one of Formulae (1) to (6).

9. The kit according to claim 8 ,
wherein the other constitutional unit of the polymer is represented by any one of Formulae (1-1) to (1-6),

in Formulae (1-1) to (1-6), substituents R 3 are each independently a substituent having a polymerizable group, a substituent R 1 is a hydrogen atom or a methyl group, and a main chain of the polymer in Formulae (1-1) to (1-6) may have a substituent.

10. The kit according to claim 8 ,
wherein the constitutional unit having the substituent R 2 has a polymerizable group, and the number of linking atoms between a carbon-carbon unsaturated bond of the polymerizable group and the main chain is larger than the number of linking atoms between a carbon-carbon unsaturated bond of a polymerizable group and a main chain in the other constitutional unit.

11. The kit according to claim 1 ,
wherein the formula weight of the substituent R 2 is 500 or less.

12. A laminate, which is formed from the kit according to claim 1 , comprising:
an underlayer film formed of the composition for forming an underlayer film for imprinting; and
an imprint layer which is formed of the curable composition for imprinting and is positioned on a surface of the underlayer film.

13. A method for producing a laminate using the kit according to claim 1 , the method comprising:
applying a curable composition for imprinting onto a surface of an underlayer film formed of the composition for forming an underlayer film for imprinting.

14. The method for producing a laminate according to claim 13 ,
wherein the curable composition for imprinting is applied onto the surface of the underlayer film by an ink jet method.

15. The method for producing a laminate according to claim 13 , further comprising:
a step of applying the composition for forming an underlayer film for imprinting in a layer form onto a substrate; and
heating the composition for forming an underlayer film for imprinting applied in a layer form at 80° C. to 250° C.

16. A method for producing a cured product pattern using the kit according to claim 1 , the method comprising:
an underlayer film formation step of applying a composition for forming an underlayer film for imprinting onto a substrate to form an underlayer film;
an application step of applying a curable composition for imprinting onto a surface of the underlayer film;
a mold contact step of bringing the curable composition for imprinting into contact with a mold having a pattern for transferring a pattern shape;
a light irradiation step of irradiating the curable composition for imprinting with light to form a cured product; and
a release step of separating the mold from the cured product.

17. A method for manufacturing a circuit board, comprising:
a step of obtaining a cured product pattern by the production method according to claim 16 .

18. A composition for forming an underlayer film for imprinting, which is used in combination with a curable composition for imprinting that contains a polymerizable compound having an aromatic ring, the composition comprising:
the polymer which contains at least one kind of constitutional unit represented by any one of Formulae (1) to (6) and has

Assignees

• Fujifilm Corp

Inventors

• Shimoju Naoya
• Shibuya Akinori
• Goto Yuichiro
• HAKAMATA Akihiro

Classifications

• H10P76/00

  Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography · CPC title

• G03F7/0002 Primary

  Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title

• B29C59/02

  by mechanical means, e.g. pressing {(B29C59/007 takes precedence; embossing expanded porous articles B29C44/5627)} · CPC title

• B29C59/16

  by wave energy or particle radiation {, e.g. infrared heating (B29C59/007 takes precedence)} · CPC title

• C08F220/283

  and containing one or more carboxylic moiety in the chain, e.g. acetoacetoxyethyl(meth)acrylate · CPC title