Plated product and method for producing same

Patent metadata

Field	Value
Publication number	US-11898263-B2
Application number	US-202017435746-A
Country	US
Kind code	B2
Filing date	Jan 22, 2020
Priority date	Mar 29, 2019
Publication date	Feb 13, 2024
Grant date	Feb 13, 2024

Abstract

There is provided an inexpensive plated product, which can prevent the increase of the contact resistance of a silver-plating film and the change of the color of the surface thereof after reflow-treating a plated product wherein the silver-plating film is formed on a portion of the surface thereof and wherein a tin-plating film is formed on a portion of the other portion of the surface thereof, and a method for producing the same. The plated product is produced by a method including the steps of: forming a nickel-plating film 12 on a surface of a base material 10 of copper or a copper alloy; forming a silver-plating film 16 on a portion of a surface of the nickel-plating film 12, and forming a tin-plating film 20 on a portion of the other portion of the surface of the nickel-plating film 12, to prepare a plated product which has the silver-plating film 16 and the tin-plating film 20 on the surface of the nickel-plating film 12 formed on the base material 10; and irradiating the surface of the plated product with infrared rays to heat the surface thereof to reflow-treat the tin-plating film 20 to cause the tin-plating film 20 to be a reflowed tin-plating layer 22.

First claim

The invention claimed is:

1. A plated product comprising:
a base material of copper or a copper alloy;
a nickel-plating layer formed on a surface of the base material;
a silver-plating layer formed on a portion of a single major side of a surface of the nickel-plating layer; and
a reflowed tin-plating layer formed on another portion of the single major side of the surface of the nickel-plating layer,
wherein the silver-plating layer has a surface which has a contact resistance of not higher than 1 mΩ.

2. A plated product as set forth in claim 1 , wherein the silver-plating layer, which is formed on the single major side of the surface of the nickel-plating layer, is apart from the reflowed tin-plating layer.

3. A contact or terminal part using the plating product as set forth in claim 1 , as a material thereof.

4. A plated product as set forth in claim 1 , wherein said silver-plating layer is apart from said reflowed tin-plating layer.

Assignees

• Dowa Metaltech Co Ltd

Inventors

• Hirai Yutaro
• Arai Kentaro
• ASHIDATE Shunsuke

Classifications

• C25D3/12 Primary

  of nickel or cobalt · CPC title

• C25D3/30

  of tin · CPC title

• C25D3/46

  of silver · CPC title

• C25D5/013

  Wavelengths other than ultraviolet [UV], visible or infrared [IR], e.g. X-rays or microwaves · CPC title

• C25D5/022

  using masking means · CPC title